SOLDER Search Results

SOLDER Result Highlights (5)

Part	Manufacturer	Description	Download
CN-AC3MMDZBAU	Amphenol Cables on Demand	3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts)	Datasheet
CN-DSUB50PIN0-000	Amphenol Cables on Demand	Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals	Datasheet
CN-DSUBHD62PN-000	Amphenol Cables on Demand	Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals	Datasheet
CN-DSUB25SKT0-000	Amphenol Cables on Demand	Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals	Datasheet
CN-DSUBHD26SK-000	Amphenol Cables on Demand	Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals	Datasheet

SOLDER Price and Stock

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Digi-Key DKS-SOLDERBREAD-02 BREADBOARD GENERAL PURPOSE PTH
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	DKS-SOLDERBREAD-02	Bulk	4,015		1	1 $3.19 10 $3.19 100 $2.79 1000 $2.79 10000 $2.79	Buy Now
Digi-Key DKS-SOLDERBREAD-01 BREADBOARD GENERAL PURPOSE PTH
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	DKS-SOLDERBREAD-01	Bulk	3,805		1	1 $2.49 10 $2.29 100 $2.49 1000 $2.49 10000 $2.49	Buy Now
Digi-Key DKS-SOLDERBREADBOX1 BREADBOARD GENERAL PURPOSE PTH
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	DKS-SOLDERBREADBOX1	Bulk	3,175		1	1 $3.79 10 $3.29 100 $3.79 1000 $3.79 10000 $3.79	Buy Now
LEDIL F17250_SOLDER-CLIP-A ACCESSORYMM (D)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	F17250_SOLDER-CLIP-A	Digi-Reel	2,155		1	1 $0.73 10 $0.436 100 $0.73 1000 $0.21017 10000 $0.21017	Buy Now
	F17250_SOLDER-CLIP-A	Cut Tape	2,155		1	1 $0.73 10 $0.436 100 $0.73 1000 $0.21017 10000 $0.21017	Buy Now
	F17250_SOLDER-CLIP-A	Reel	2,150		2,150	1 - 10 - 100 - 1000 - 10000 $0.19411	Buy Now
Newark	F17250_SOLDER-CLIP-A	Bulk			2,150	1 - 10 - 100 - 1000 $0.229 10000 $0.229	Buy Now
Mouser Electronics	F17250_SOLDER-CLIP-A		1,230			1 $0.66 10 $0.445 100 $0.26 1000 $0.215 10000 $0.176	Buy Now
Avnet Silica	F17250_SOLDER-CLIP-A			7 Weeks	2,150	1 - 10 - 100 - 1000 - 10000 -	Buy Now
EBV Elektronik	F17250_SOLDER-CLIP-A			7 Weeks	2,150	1 - 10 - 100 - 1000 - 10000 -	Buy Now

New Advantage Corporation	F17250_SOLDER-CLIP-A		4,300		1	1 - 10 - 100 - 1000 - 10000 $0.144	Buy Now
Sierra Wireless MANGOHYELLOW_7702_SOLDERED MANGOH YELLOW WP7702 APP BOARD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	MANGOHYELLOW_7702_SOLDERED	Box	1,980		1	1 $156.25 10 $156.25 100 $156.25 1000 $156.25 10000 $156.25	Buy Now

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SOLDER Datasheets (7)

Part	Manufacturer	Description	Datasheet Type	PDF
Solder	Philips Semiconductors	Package information	Original	PDF
Soldering Recommendations ACP	NXP Semiconductors	Soldering Recommendations ACP	Original	PDF
Soldering recommendations for Ldmos Power Amplifiers (1)	NXP Semiconductors	Soldering recommendations for Ldmos Power Amplifiers (1)	Original	PDF
SOLDERRM	On Semiconductor	Soldering and Mounting Techniques Reference Manual	Original	PDF
SOLDERWICK1.5	Chip Quik	1.5MM SOLDER WICK NO CLEAN	Original	PDF
SOLDERWICK2.0	Chip Quik	2.0MM SOLDER WICK NO CLEAN	Original	PDF
SOLDERWICK2.8	Chip Quik	2.8MM SOLDER WICK NO CLEAN	Original	PDF

SOLDER Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
TOSHIBA ADDC Abstract: No abstract text available Text: TL19W01-D T32 TOSHIBA LED lamps TL19W01-D(T32 ○ Surface-mount devices Unit: mm 3.1 (L mm x 3.8 (W) mm × 0.65 (H) mm size • High luminous flux LED : 110 lm(typ.) @ IF=300 mA • Color: white (6500K) • Reflow-soldering is available • Applications : general lighting and etc.	Original	PDF	TL19W01-D 6500K) TOSHIBA ADDC
SMD 0402 Abstract: No abstract text available Text: 2381 553 2.6/MLV0402E3.3T Vishay BCcomponents SMD 0402 Multilayer Varistor FEATURES • Surface mount multilayer surge suppressor  Inherent bidirectional clamping  Excellent energy/volume ratio  Suitable for reflow soldering  Compliant to RoHS directive 2002/95/EC	Original	PDF	6/MLV0402E3. 2002/95/EC 2002/96/EC 2011/65/EU 2002/95/EC. 2011/65/EU. 12-Mar-12 SMD 0402
40MT160 Abstract: 40MT140 100mt160 Text: 40MT1.0P.PbF, 70MT1.0P.PbF, 100MT1.0P.PbF Series Vishay High Power Products Three Phase Bridge Power Module , 45 A to 100 A FEATURES • Low VF • Low profile package • Direct mounting to heatsink • Flat pin/round pin versions with PCB solderable terminals	Original	PDF	40MT1 70MT1 100MT1 E78996 2002/95/EC 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 40MT160 40MT140 100mt160
Untitled Abstract: No abstract text available Text: P/N 96-160M65 160-Position, 0.0256 [0.65] Pitch QFP-to-PGA Adapter FEATURES • Convert surface-mount QFP packages to a 15x15 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,	Original	PDF	96-160M65 160-Position, 15x15 C36000, B16/B16M B579-73 AMS-QQ-N-290 96-160M65-P
BY252P Abstract: No abstract text available Text: BY251P thru BY255P Vishay General Semiconductor General Purpose Plastic Rectifier FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 A • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in	Original	PDF	BY251P BY255P 22-B106 2002/95/EC 2002/96/EC DO-201AD AEC-Q101 DO-201AD, 2011/65/EU 2002/95/EC. BY252P
Untitled Abstract: No abstract text available Text: Product Number: 3158-0-00-15-00-00-03-0 Description: 3158 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 3158-0-00-15-00-00-03-0 10 " Gold over Nickel 00 RoHS Compliant SHELL MATERIAL:	Original	PDF	C36000) C/885 2002/95Annex
9940 Abstract: mal215099xxxe3 MAL215099 99101E3 99804E3 150631-2 99103E3 99515E3 99603E3 MAL215 Text: 150 CRZ www.vishay.com Vishay BCcomponents Aluminum Capacitors SMD Chip , Very Low Z FEATURES • Polarized aluminum electrolytic capacitors, non-solid electrolyte, self healing • SMD-version with base plate, lead (Pb)-free reflow solderable • Very low impedance, very high ripple current	Original	PDF	J-STD-020 AEC-Q200 MAL215099. 9991trademarks 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 9940 mal215099xxxe3 MAL215099 99101E3 99804E3 150631-2 99103E3 99515E3 99603E3 MAL215
Untitled Abstract: No abstract text available Text: P300A thru P300M Vishay General Semiconductor General Purpose Plastic Rectifier FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 A • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in	Original	PDF	P300A P300M 22-B106 2002/95/EC 2002/96/EC DO-201AD AEC-Q101 DO-201AD, 2011/65/EU 2002/95/EC.
Vitreous enamel coating wirewound Abstract: No abstract text available Text: 210 Series Features • Terminals suitable for soldering or bolt connection. • Adjustable lug supplied. • High wattage applications. • All-welded construction. • Rugged lead free vitreous enamel coating. • Flame resistant coating. • Thumb-screw-adjustable lug	Original	PDF	1-866-9-OHMITE Vitreous enamel coating wirewound
MILL-MAX Abstract: No abstract text available Text: Product Number: 3158-0-00-01-00-00-03-0 Description: 3158 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 3158-0-00-01-00-00-03-0 200 - 300 " Tin/Lead over Nickel 00 RoHS Compliant SHELL MATERIAL:	Original	PDF	C36000) C/885 2002/95Annex MILL-MAX
2331-ZX Abstract: Sn62Pb36Ag02 sn63pb37 solder wire Kester LIQUID FLUX IPC-TM650 sn63pb37 solder wire shelf life ZX 650 Text: 331 Organic Cored W ire For Lead-bearing and Lead-free alloys Product Description Kester 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than	Original	PDF	2331-ZX 2331-ZX. J-STD-004, IPC-TM-650, 04Jun07 Sn62Pb36Ag02 sn63pb37 solder wire Kester LIQUID FLUX IPC-TM650 sn63pb37 solder wire shelf life ZX 650
Untitled Abstract: No abstract text available Text: Board to Board Connectors FH Free Height 0.8mm Pitch Connectors Board to Board SMT Typed/With Solder Peg Receptacle Assemblies Applicable Board Stacking Heights = 5mm/6mm/7mm/8mm Material and Finish: Housing- UL94V-0 rated, heat-resistant thermoplastic,	OCR Scan	PDF	UL94V-0 -177984-Q 179485-D* -179029-D 2-179485-D* -179030-n 4-179485-Q* 6-179485-D*
Untitled Abstract: No abstract text available Text: h- .5 0 - - .2 5 0 \|.0 7 5 — .19 r t 1 t 1 RF□ 0 5 5 -1 r .031 — c ri T -lo .38 T - .35 1 I IF MATERIAL El STANDARD □ SPECIAL ° BASE o COVER ° MARKING » FINISH F R -4 VECTRA LASER SOLDER TIN HIGH DYNAMIC RANGE DOUBLE BALANCED MIXER MAX	OCR Scan	PDF	MXR/6EF-02HD
Untitled Abstract: No abstract text available Text: 6 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 5 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. REVISIONS LOC DIST CM 00 LTR DESCRIPTION K .125/3 POST BOTH .225 + .010 II .005 MEASURED P LA S TIC PARTS D 05 APPLY AT TO SOLDER	OCR Scan	PDF	08JULY2005 08JULY2005 31MAR2000

Untitled Abstract: No abstract text available Text: CO NOTES: 1 .MATERIAL: HOUSiNG : THERMOPLASTIC CONTACT : COPPER ALLOY. SHELL : COPPER ALLOY. CD O O + ü 15.2 0 1 4.50 2 .FINISH: CONTACT: GOLD PLATING SEE TABLE ON CONTACT AREA TIN-LEAD ON SOLDER TAILS. NICKEL UNDERPLATED OVER ALL SHELL: NICKEL PLATING OVER COPPER.	OCR Scan	PDF	36Kg/R
Untitled Abstract: No abstract text available Text: 3 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. 2 - LOC ALL RIGHTS RESERVED. CM DIST R E VIS IO N S LTR R DESCRIPTION EC 0G3B 0 2 4 9 DATE DWN 24SEP05 05 1. FITS SOCKET HOUSING 2. ASSEMBLY CONFORMS TO AMP SOLDERABILITY	OCR Scan	PDF	24SEP05 27APR95 27APR98
ECRE Abstract: No abstract text available Text: 5 -7 Precaution of Assembly for Mini Flat Coupler 5 -7 -1 ) Soldering A vo id th e rise o f device te m p e ra tu re as m u ch as p ossible by th e fo llo w in g c o n d itio n s . a) S old e ring lead d ire c tly by so ld e r header) 26CTC M a x ., 1 0 second M ax.	OCR Scan	PDF	26CTC ECRE
Untitled Abstract: No abstract text available Text: 4. Solder-mounting Flat Package ICs 1. Soldering conditions a. Soldering iron Solder a t lead tem p eratu re of 2 6 0 t for no m ore than 10 seconds or a t 350°C fo r no m ore th a n 3 seconds. b. Infrared reflow 1 W e recom m end heating m ethods in far-interm ediate infrared shown a t the top and bottom of	OCR Scan	PDF
Untitled Abstract: No abstract text available Text: Special Connectors Battery Connectors 2.5mm/3.0mm Pitch 3.0mm Pitch, Plug Assembly 8 Position, Material and Finish : Housing — Thermoplastic UL94V-0 rated, black Contact — Copper Alloy, Nickel-underplated all over, tin-lead plated on soldering area Housing	OCR Scan	PDF	UL94V-0
D325 Abstract: No abstract text available Text: 8 Manufacturing date c o n s i s t i n g o f : 2 d i g i t s f o r the year Y Y , 2 d i g i t s old P/N Tyco (without the week ( WW) and 1 digit for the day -x-xxxxxxx-x V Code 0,6 P/N TYCO V Soldering/Wire-Wrap pins V42254-) 00 -0. 4 YYWWD +XXXX-+XXX	OCR Scan	PDF	DIN41612 IEC603-2 V42254-) V42254- -D325 SR10-0177-03 SR10-0157-02 V42254-B1xxx-D325- D325
Untitled Abstract: No abstract text available Text: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 5 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. REVISIONS DIST CM LTR T DESCRIPTION DATE DWN BSV RCJ 27SEP05 EC 0G3B 0249 05 APVD ANTI SOLDER WICKING TAB FITS SOCKET HOUSING 640525.	OCR Scan	PDF	27SEP05 Z8APR98
OV 5693 Abstract: No abstract text available Text: / j \ HOUSING & TINE PLATE - LIQUID CRYSTAL POLYMER LC P , UL 9 4 V —0 , BLACK. 2. CONNECTOR SOLDER TAILS WILL ACCOMMODATE PRINTED CIRCUIT BOARD THICKNESS OF 0 .8 TO 1.6 [.0 3 1 TO .0 6 3 ], ^ G, J, H INDICATE NUMBER OF POSITION MARKED ON ASSEMBLY. ALSO SEE TABLE.	OCR Scan	PDF
Untitled Abstract: No abstract text available Text: 3 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. 2 - LOC ALL RIGHTS RESERVED. CM DIST R E VIS IO N S LTR N D o ASSEMBLY CONEORMS TO AMP SOLDERABILITY SPEC. 1 0 9 - 1 1 - 3 . C UL AND o .020 .0 6 3 BSV RCJ	OCR Scan	PDF	28APR98 28APR98
Untitled Abstract: No abstract text available Text: Electronics Standard Edge II Card Edge Connectors Solder Type Board-to-Board Connectors .100 [2.54] Centerline Vertical Solder Posts, Retention Feature, Without Mounting Ears M a te ria l and F in is h : .064 [1.63] Sq. X .130 [3.301 Dp. — Intercontact Key Slot	OCR Scan	PDF

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SOLDER Search Results

SOLDER Result Highlights (5)

SOLDER Price and Stock

Digi-Key DKS-SOLDERBREAD-02

Digi-Key DKS-SOLDERBREAD-01

Digi-Key DKS-SOLDERBREADBOX1

LEDIL F17250_SOLDER-CLIP-A

Sierra Wireless MANGOHYELLOW_7702_SOLDERED

SOLDER Datasheets (7)

SOLDER Datasheets Context Search

TOSHIBA ADDC

SMD 0402

40MT160

Untitled

BY252P

Untitled

9940

Untitled

Vitreous enamel coating wirewound

MILL-MAX

2331-ZX

Untitled

Untitled

Untitled

Untitled

Untitled

ECRE

Untitled

Untitled

D325

Untitled

OV 5693

Untitled

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