SMT ROADMAP Search Results

SMT ROADMAP Result Highlights (5)

Part	Manufacturer	Description
A9784-	Coilcraft Inc	Transformer, planar, SMT, RoHS
B0310-	Coilcraft Inc	Transformer, planar, SMT, RoHS
CST1-06	Coilcraft Inc	Current sensor, SMT, RoHS
CST2010-03	Coilcraft Inc	Current sensor, SMT, RoHS
CST2010-08	Coilcraft Inc	Current sensor, SMT, RoHS

SMT ROADMAP Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
SMT roadmap Abstract: SMT Component Technology Road Map Capacitor tantalum 0402 Electrolytic Capacitors General Introduction technology roadmap NIC Components resistor Array chip resistors size 8 0402 electrolytic capacitor High Current SMT Ferrite Chip Beads 100PPM Text: SMT Component Technology Road Map Today The Future Technology Roadmap NIC Aluminum Electrolytic Capacitors Surface Mount aluminum electrolytic capacitors have become the area of largest growth for all electrolytic capacitors. • Larger case sizes: 8mm ~ 18mm diameters	Original	PDF	6800uF 400VDC SMT roadmap SMT Component Technology Road Map Capacitor tantalum 0402 Electrolytic Capacitors General Introduction technology roadmap NIC Components resistor Array chip resistors size 8 0402 electrolytic capacitor High Current SMT Ferrite Chip Beads 100PPM
INTEL application notes Abstract: land pattern BGA 0.75 PCB design for very fine pitch csp package land pattern for TSOP 2 1mm pitch BGA socket land pattern for TSOP BGA reflow guide pcb thermal Design guide trace theta layout micro pitch BGA socket s1 SOLDER PROFILE Text: 5.0 5.1 5.2.1 MANUFACTURING CONSIDERATIONS SMT Process Many factors contribute to a high yielding assembly process. A few of the key focus areas and their contributing factors are highlighted in Table 7. 5.2 PCB Design Guidelines One of the key efforts in implementing the	Original	PDF
JAE MX34 Abstract: SMT pitch roadmap CONNECTOR jae 50 SMT roadmap JAE ffc JAE CONNECTORS FPC 0.6mm pitch MX23A MX34 TX20A Text: JAE Product guide 15/11/05 1:43 pm Page 3 CONNECTOR PRODUCT GUIDE JAE Product guide 15/11/05 1:43 pm Page 4 Board to Board SERIES AA01A No of contacts 10,30,40,60 Pitch 0.5mm Current Rating 0.2 amp PCB Mounting Method SMT Operating Temp -40 +85 degrees Reeled	Original	PDF	AA01A KX14/KX15 TX24/TX25 LOGO05/2 JAE MX34 SMT pitch roadmap CONNECTOR jae 50 SMT roadmap JAE ffc JAE CONNECTORS FPC 0.6mm pitch MX23A MX34 TX20A
Untitled Abstract: No abstract text available Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension	Original	PDF	100kHz NOSC107M004 NOSC157M004 NOSD227M004 NOSD337M004 NOSE477M004 NOSD107M006
capacitor esr 100khz Abstract: No abstract text available Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension	Original	PDF	100kHz capacitor esr 100khz
Untitled Abstract: No abstract text available Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension	Original	PDF	100kHz NOSC107M004 NOSC157M004 NOSD227M004 NOSD337M004 NOSE477M004 NOSD107M006
Sn62Pb36Ag2 Abstract: Boards for assembly with 100OHM impedance erni 32 pins connector 68 pin high density flat connector Z-PACK DIN 1.5mm header connector SMT roadmap Text: DesignCon 2005 ERNI MicroSpeed, the Revolution in Mezzanine Connection Andreas Scheck, President & CEO, ERNI Electronics, Inc. Abstract For many reasons, today’s electronic systems are being built in three rather than two dimensions. As such, inter-board connectors – “mezzanine connectors” – play an	Original	PDF
Untitled Abstract: No abstract text available Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension	Original	PDF	NOJA156 NOJB226 NOJB336 NOJC476 NOJC686 NOJC107 NOJC157 NOJD227 NOJD337 NOJE477
Fuse m1 250C Abstract: SIEMENS b43471 B43991 SIEMENS b43405 B43876 B43875 m1 250c fuse B41684 epcos B43991 B43405 Text: Microwave Ceramics and Modules RF LTCC Filter for ISM 2.4 GHz Filter B69893K2457C101 Preliminary datasheet Features • Low Profile maximum height 0.9 mm Change History Revision Detail of change P1 First release Date 09.06.06 Author Stadler Contents Page 2	Original	PDF	B69893K2457C101 2002/95/EC 2005/747/EC Fuse m1 250C SIEMENS b43471 B43991 SIEMENS b43405 B43876 B43875 m1 250c fuse B41684 epcos B43991 B43405
MezzSelect Abstract: FCI Connector interface hybrid 84502 meg array FCI Connector top mount 0 stand off single row header 2.0mm pitch 10mm height bergstik 2,54 SMT roadmap gig-array connector footprint SMT pitch roadmap GR-1217-CORE Text: Targeted Technology Service Speed and Integrity MezzSelect presentation – Dec 2009 – FCI ELX 1 Choose precisely what you Need What is a mezzanine connector? A mezzanine connector… …provides an electrical and mechanical connection between two printed circuits.	Original	PDF
B43875 Abstract: B43991 epcos B43991 EPCOS Sikorel B41684 B43876 B43405 B41684 SIEMENS b43405 B43471 Epcos B41684 Text: SAW Components SAW filter TD-SCDMA Series/type: Ordering code: B7853 B39202B7853C710 Date: Version: September 28, 2006 2.2  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.	Original	PDF	B7853 B39202B7853C710 LK39B. C61157-A8-A3 LK39A. B43875 B43991 epcos B43991 EPCOS Sikorel B41684 B43876 B43405 B41684 SIEMENS b43405 B43471 Epcos B41684
B43875 Abstract: SIEMENS b43405 B43406 B41684 epcos B43991 B43991 B43876 Epcos sikorel b41684 DDS2004 B43405 Text: SAW Components SAW filter MediaFLO Series/type: Ordering code: LR24A Date: Version: June 19, 2006 1.0  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.	Original	PDF	LR24A 2002/95/EC 2005/747/EC B43875 SIEMENS b43405 B43406 B41684 epcos B43991 B43991 B43876 Epcos sikorel b41684 DDS2004 B43405
B43875 Abstract: B43876 SIEMENS b43471 SIEMENS b43405 epcos B43991 B41684 Epcos sikorel b41684 E70 ferrite core DDS2004 E16* transformer Text: SAW Components SAW Rx filter WCDMA band I Series/type: Ordering code: LK39B Date: Version: Sep. 26, 2006 1.1  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.	Original	PDF	LK39B LK39B. C61157-A8-A3 B39202B7853C710 LK39A. B43875 B43876 SIEMENS b43471 SIEMENS b43405 epcos B43991 B41684 Epcos sikorel b41684 E70 ferrite core DDS2004 E16* transformer
Untitled Abstract: No abstract text available Text: Section 2: Niobium Oxide Capacitors* OxiCap NOJ Series and NOS Series DEVELOPMENT ROADMAP Released Low ESR Development NOS Low ESR, 125°C Released Specification and Matrix Development NOJ Generic Purpose 105°C Capacitors Under Development High CV Range Extension	Original	PDF	NOJE477M004# NOJV687M004# NOJA106M006# NOJB156M006# NOJB226M006# NOJB336M006# NOJC336M006# NOJC476M006# NOJC686M006# NOJD107M006#

hp laptop MOTHERBOARD pcb CIRCUIT diagram Abstract: ips 500w circuit diagram 800w class d circuit diagram schematics IRS2092 audio amplifier circuit diagram 700w audio amplifier circuit diagram schematic diagram Electronic Ballast xenon 2000w audio amplifier circuit diagram 1000w class d circuit diagram schematics IR2153 spice model circuit diagram of smps 400w DESKTOP Text: Product Line Overview Applications Key Products Energy Saving Products • Appliances • Digital Control ICs Integrated design platforms that enable customers to add energyconserving features that achieve lower operating energy costs and manufacturing Bill of Material	Original	PDF
capture and electronic packaging Abstract: teledyne Microelectronics microwave transceiver specification Optical-Pressure-Sensor Optic-Pressure-Sensor military relay pro mechanica Arrayed Waveguide Grating DAR090709 TOSA Text: AG100714 Opto Optoelectronics Products, Packaging & Engineering Services Approved for Export COMPANY PROPRIETARY DAR 07/22/10 12964 Panama Street • Los Angeles, CA 90066 • Phone: 310.822.8229 FAX: 310.822.3573 • [email protected] • www.teledynemicro.com	Original	PDF	AG100714 DAR090709 capture and electronic packaging teledyne Microelectronics microwave transceiver specification Optical-Pressure-Sensor Optic-Pressure-Sensor military relay pro mechanica Arrayed Waveguide Grating DAR090709 TOSA
74729 latch Abstract: dms 59 to vga SFF8470 pinout DMS59 to vga PS-91525-001 DMS-59 to 15pin QSFP passive connector xaui mini HDMI plug 74752-2301 Micro-D connectors Text: I/O Products High Speed Pluggable I/O Solutions Small Form-Factor Pluggable SFP to N-3 Cable to N-8	Original	PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original	PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100 Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original	PDF
wireless switch diagram Abstract: AWT6200 SMT roadmap Text: The PowerPlexerTM Advantage • • • Boost Handset Talk Times/Standby Times Slash RF System Footprint Shorten Handset Time to Market • • Decrease RF system component count Reduce overall cost of RF system Current Solution AWT6200 PowerPlexerTM GSM GSM	Original	PDF	AWT6200 wireless switch diagram SMT roadmap
10000 watt stabilizer transformer winding formula Abstract: BUSS SR-5 T3.15A 250V mini project using microcontroller toy car OC-106 94V0 C Buss SR-5 T2A 250v T2A 250v BUSS SS-5 PCF 7953 T2A 250v SS-5 OC106 T2A 250v BUSS Text: Circuit Protection and Power Management Solutions Full Line Electronics Catalog 2007 Electronic Components INTRODUCTION From overcurrent and overvoltage protection to supercapacitors and magnetics, Cooper Bussmann provides integrated solutions that meet the evolving needs of technology-driven markets. Cooper	Original	PDF	CB-5010 10000 watt stabilizer transformer winding formula BUSS SR-5 T3.15A 250V mini project using microcontroller toy car OC-106 94V0 C Buss SR-5 T2A 250v T2A 250v BUSS SS-5 PCF 7953 T2A 250v SS-5 OC106 T2A 250v BUSS
220v AC voltage stabilizer schematic diagram Abstract: rjh 3047 equivalent WECO 1502 connection drawing transistor equivalent rjh 3047 str 1265 smps power supply circuit of tv transistor a950 MTK 6252 weco 602 connection drawing 8140 SOURIAU weco 1502 cap drawing Text: INTERCONNECTS Interconnects AC Power Connectors Power Cords, Power Entry Modules, Power Filters, Power Outlets and Inlets Bulgin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1105 Qualtek . . . . . . . . . . . . . . . . . . . . . . . . . . . 1106, 1107	Original	PDF
capacitor date codes Abstract: marking codes 93 Multi-Turn Potentiometers bi marking SMD CODES BCN31 HM80 P232 P270 smd marking codes SMD resistors codes Text: BI Technologies RoHS compliance roadmap Compliance herein is the same as Pb-free and indicates meeting E.U. RoHS legislation Directive 2002/95/EC and revisions to date . Pb in Cu (brass), steel, and Al are assumed exemptions (not listed). If P/N is changing, compliant date code indicates compliant production date not shipment date (due to non-compliant inventory)	Original	PDF	2002/95/EC EC/2002/95/EC) capacitor date codes marking codes 93 Multi-Turn Potentiometers bi marking SMD CODES BCN31 HM80 P232 P270 smd marking codes SMD resistors codes
WP-72-08 Abstract: white papers coin sensor Text: Executive Briefing Avoiding an Energy Storage Crisis: The 8 Key Competitive Advantages of Solid State Batteries By Steve Grady Introduction If electronics manufacturers have a motto, it's probably this: Innovate or Die. For years, the industry's rapid rate of innovation and	Original	PDF	WP-72-08 WP-72-08 white papers coin sensor

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SMT ROADMAP Search Results

SMT ROADMAP Result Highlights (5)

SMT ROADMAP Datasheets Context Search

SMT roadmap

INTEL application notes

JAE MX34

Untitled

capacitor esr 100khz

Untitled

Sn62Pb36Ag2

Untitled

Fuse m1 250C

MezzSelect

B43875

B43875

B43875

Untitled

hp laptop MOTHERBOARD pcb CIRCUIT diagram

capture and electronic packaging

74729 latch

TAIYO PSR 4000

TAIYO PSR 4000

wireless switch diagram

10000 watt stabilizer transformer winding formula

220v AC voltage stabilizer schematic diagram

capacitor date codes

WP-72-08