N681622
Abstract: W681388 TRANSISTOR Bf 310n N681387DG N681387 GKDF QFN-48 thermal resistance N681386 w684386 n681622yg
Text: N681386/87 Single Programmable Extended Codec/SLCC 1. DESCRIPTION The N681386/87, implements a single channel FXS telephone line interface optimized for short loop applications. It integrates SLCC Subscriber Line Control Circuit functionality with a programmable CODEC and a DC/DC controller.
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N681386/87
N681386/87,
16-bit
N681622
W681388
TRANSISTOR Bf 310n
N681387DG
N681387
GKDF
QFN-48 thermal resistance
N681386
w684386
n681622yg
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Untitled
Abstract: No abstract text available
Text: SLCC Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm 0.05 % at 1000 h at 70 °C under Pn • Low noise < 35 dB • Hermetic package RoHS COMPLIANT TYPICAL PERFORMANCE ABS TRACKING Actual Size
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MIL-PRF-83401
08-Apr-05
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FAH 32
Abstract: No abstract text available
Text: 32 Megabit FLASH EEPROM DP5Z1MW32PV3 DESCRIPTION: The DP5Z1MW32PV3 ‘’VERSA-STACK’’ module is a memory subsystem using DPAC Technologies’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 32 Megabits of
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DP5Z1MW32PV3
DP5Z1MW32PV3
MX29F1610AHC)
MX29F1610HC)
30A180-11
FAH 32
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DP5Z2MW16PA3
Abstract: DP5Z2MW16PH3 DP5Z2MW16PI3 DP5Z2MW16PJ3 DP5Z2MW16PY3
Text: 2Mx16, 120 - 200ns, STACK/PGA 30A161-22 A 32 Megabit FLASH EEPROM DP5Z2MW16Pn3 PRELIMINARY DESCRIPTION: SLCC Stack The DP5Z2MW16Pn3 ‘’SLCC’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip
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2Mx16,
200ns,
30A161-22
DP5Z2MW16Pn3
50-pin
64-Megabits
DP5Z2MW16Pn3
DP5Z2MW16PA3
DP5Z2MW16PH3
DP5Z2MW16PI3
DP5Z2MW16PJ3
DP5Z2MW16PY3
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DP5Z2MW32PV3
Abstract: Dense-Pac Microsystems
Text: 64 Megabit FLASH EEPROM DP5Z2MW32PV3 PRELIMINARY DESCRIPTION: The DP5Z2MW32PV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It
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DP5Z2MW32PV3
DP5Z2MW32PV3
5555H
30A180-12
Dense-Pac Microsystems
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Dense-Pac DP5Z1M
Abstract: 30A18
Text: 32 Megabit FLASH EEPROM DP5Z1MW32PV3 PRELIMINARY DESCRIPTION: The DP5Z1MW32PV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It
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DP5Z1MW32PV3
DP5Z1MW32PV3
5555H
30A180-11
Dense-Pac DP5Z1M
30A18
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Untitled
Abstract: No abstract text available
Text: Data sheet E 1/4.944 - 10497 SLCC 16 20 24 thin film leadless chip resistor networks Capable to meet characteristics of the MIL-R-83-401 these networks are available in a wide range of resistance values : several standard configurations are presented with feature such.
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MIL-R-83-401
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08AP
Abstract: No abstract text available
Text: Data sheet E 1/4.944 - 10497 SLCC 16 20 24 thin film leadless chip resistor networks Capable to meet characteristics of the MIL-R-83-401 these networks are available in a wide range of resistance values : several standard configurations are presented with feature such.
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MIL-R-83-401
08-Apr-05
08AP
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resistor 100k ohm
Abstract: No abstract text available
Text: SURFACE MOUNT NETWORKS SURFACE MOUNT SLCC Vishay Thin Film Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm • Low noise • Hermetic package TYPICAL PERFORMANCE ● Actual Size TCR Capable of meeting the characteristics of MIL-PRF-83401
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MIL-PRF-83401
11lute
27-Apr-01
resistor 100k ohm
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Untitled
Abstract: No abstract text available
Text: SLCC CNP www.vishay.com Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Thin Film Resistor Networks FEATURES • High stability ultrafilm (0.05 % at 1000 h at + 70 °C under Pn) • Custom available (CNP) • Low noise < 35 dB • SMD • Hermetic package
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2002/95/EC
MIL-PRF-83401
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
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Untitled
Abstract: No abstract text available
Text: SLCC CNP www.vishay.com Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Thin Film Resistor Networks FEATURES • High stability ultrafilm (0.05 % at 1000 h at + 70 °C under Pn) • Custom available (CNP) • Low noise < - 35 dB • SMD • Hermetic package
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MIL-PRF-83401
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNT NETWORKS SURFACE MOUNT SLCC Vishay Thin Film Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm • Low noise • Hermetic package TYPICAL PERFORMANCE ● Actual Size TCR Capable of meeting the characteristics of MIL-PRF-83401
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MIL-PRF-83401
08-Apr-05
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R0005
Abstract: SLCC20
Text: SLCC Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm 0.05 % at 1000 hours at 70 °C under Pn • Low noise < 35 dB RoHS COMPLIANT • Hermetic package Actual Size TYPICAL PERFORMANCE Capable of meeting the characteristics of MIL-PRF-83401
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MIL-PRF-83401
08-Apr-05
R0005
SLCC20
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DP5Z2MK16PA3
Abstract: DP5Z2MK16PH3 DP5Z2MK16PI3 DP5Z2MK16PJ3 DP5Z2MK16PY
Text: 2Mx16, 120 - 200ns, STACK/PGA 30A161-02 A 32 Megabit FLASH EEPROM DP5Z2MK16Pn3 PRELIMINARY DESCRIPTION: The DP5Z2MK16n3 ‘’SLCC’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, ‘’J’’ leaded, gullwing
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2Mx16,
200ns,
30A161-02
DP5Z2MK16Pn3
DP5Z2MK16n3
50-pin
32-Megabits
DP5Z2MK16PY
DP5Z2MK16Pn3
30A161-32
DP5Z2MK16PA3
DP5Z2MK16PH3
DP5Z2MK16PI3
DP5Z2MK16PJ3
DP5Z2MK16PY
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SMD A06
Abstract: R0005 20A06 A03 SMD
Text: SLCC CNP Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability ultrafilm (0.05 % at 1000 h at + 70 °C under Pn) • Custom available (CNP) • Low noise < 35 dB • SMD • Hermetic package Actual Size Capable of meeting the characteristics of MIL-PRF-83401
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MIL-PRF-83401
2002/95/EC
18-Jul-08
SMD A06
R0005
20A06
A03 SMD
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DP5Z2ME16PA3
Abstract: DP5Z2ME16PH3 DP5Z2ME16PI3 DP5Z2ME16PJ3 DP5Z2ME16PY
Text: 2Mx16, 120 - 200ns, STACK/PGA 30A161-02 A 32 Megabit FLASH EEPROM DP5Z2ME16Pn3 PRELIMINARY DESCRIPTION: The DP5Z2ME16Pn3 ‘’SLCC’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, ‘’J’’ leaded, gullwing
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2Mx16,
200ns,
30A161-02
DP5Z2ME16Pn3
50-pin
32-Megabits
DP5Z2ME16PY
DP5Z2ME16Pn3
30A161-42
DP5Z2ME16PA3
DP5Z2ME16PH3
DP5Z2ME16PI3
DP5Z2ME16PJ3
DP5Z2ME16PY
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resistor* 100k ohm
Abstract: 20A06 a06 transistor resistor 100k ohm
Text: P R E C I S I O N T H I N F I L M T E C H N O L O G Y SURFACE MOUNT NETWORKS Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks SLCC Series FEATURES • High stability Ultrafilm • Low noise • Hermetic package TYPICAL PERFORMANCE ● Actual Size
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MIL-PRF-83401
resistor* 100k ohm
20A06
a06 transistor
resistor 100k ohm
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20A06
Abstract: R0005
Text: SLCC Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability ultrafilm 0.05 % at 1000 h at + 70 °C under Pn • Low noise < 35 dB RoHS COMPLIANT • Hermetic package Actual Size TYPICAL PERFORMANCE Capable of meeting the characteristics of MIL-PRF-83401
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MIL-PRF-83401
18-Jul-08
20A06
R0005
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNT NETWORKS SURFACE MOUNT SLCC Vishay Thin Film Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm • Low noise • Hermetic package TYPICAL PERFORMANCE Actual Size ● ABS TCR Capable to meet characteristics of the MIL-PRF-83401 these networks are
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MIL-PRF-83401
03-Apr-00
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 64 Megabit FLASH EEPROM DP5Z4MX16Pn3 PRELIMINARY DESCRIPTION: The DP5Z4MX16Pn3 "SLC C " devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, "J" leaded, gullwing
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DP5Z4MX16Pn3
50-pin
64-Megabits
DP5Z4MX16Pn3
120ns
150ns
200ns
30A161
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11A16
Abstract: No abstract text available
Text: 32 Megabit FLASH EEPROM DP5Z1MW32PV3 DENSIE-PAC MI GR ÖS VST BMS PRELIMINARY DESCRIPTION: The DP5Z1MW32PV3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It
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DP5Z1MW32PV3
DP5Z1MW32PV3
120ns
200ns
11A16
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 64 Megabit FLASH EEPROM DP5Z2MW32PV3 MICROSYSTEMS PRELIMINARY DESCRIPTION: The DP5Z2M W 32PV3 VERSA -STA CK module is a revolutionary new memory subsystem using Dense-Pac Microsystems ceram ic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It
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DP5Z2MW32PV3
32PV3
120ns
200ns
30A180-12
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 32 Megabit FLASH EEPROM DP5Z2MW 16Pn3 MICROSYSTEMS PRELIMINARY DESCRIPTION: The DP5Z2M W 16Pn3 " S L C C " devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, "J" leaded, gullwing
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16Pn3
50-pin
64-Megabits
16Pn3
120ns
150ns
200ns
30A161-22
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MI C R O S Y S T E MS 32 Megabit FLASH EEPROM DP5Z1MW32PV3 PRELIMINARY DESCRIPTION: The DP5Z1MW32PV3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It
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DP5Z1MW32PV3
DP5Z1MW32PV3
32PV3
120ns
150ns
200ns
30A180-11
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