Signal Integrity Handbook
Abstract: Signal Integrity edge rate processing microwave products TWISTED SHIELDED PAIR SPICE MODEL transmission line model orcad pspice samtec PCIE 1-800-SAMTEC-9 samtec PCIE design
Text: INTERCONNECT SIGNAL INTEGRITY HANDBOOK AUGUST 2007 INTERCONNECT SIGNAL INTEGRITY HANDBOOK 2007 by Samtec, Inc. All rights reserved. Table of Contents Introduction . 4
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Signal Integrity Handbook
Signal Integrity
edge rate
processing
microwave products
TWISTED SHIELDED PAIR SPICE MODEL
transmission line model orcad pspice
samtec PCIE
1-800-SAMTEC-9
samtec PCIE design
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VIRTEX-4
Abstract: F1020 SSTL-18 Altera source-synchronous EP2S60F1020 package and silicon
Text: White Paper Signal Integrity Comparisons Between Stratix II and Virtex-4 FPGAs Introduction Signal integrity has become a critical issue in the design of high-speed systems. Poor signal integrity can mean increased engineering costs, delayed product releases, and even lost revenues. The opportunity cost
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Abstract: hspice System Software Writers Guide QII53020-7 SIGNAL INTEGRITY AND TIMING SIMULATION
Text: Section IV. Signal Integrity As FPGA usage expands into more high-speed applications, signal integrity becomes an increasingly important factor to consider for an FPGA design. Signal integrity issues must be taken into account as part of FPGA I/O planning and assignments, as well as in the design and layout of the
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AN1051
Abstract: AN2127 MPC5500 MPC5553 MPC5554 MPC5554 evb AN2705
Text: Freescale Semiconductor Application Note Signal Integrity Considerations with MPC5500-based Systems by: Stevan Dobrasevic and John Phillippe MCD Design 1 Introduction As external bus interfaces increase in operating frequency, signal integrity becomes a major concern for
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MPC5500
AN2705
MPC5553
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AN2705
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Untitled
Abstract: No abstract text available
Text: 6. Signal Integrity Analysis with Third-Party Tools November 2013 QII53020-13.1.0 QII53020-13.1.0 Introduction With the ever-increasing operating speed of interfaces in traditional FPGA design, the timing and signal integrity margins between the FPGA and other devices on the
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Abstract: QII53020-7 hyperlynx
Text: 11. Signal Integrity Analysis with Third-Party Tools QII53020-7.1.0 Introduction As FPGA devices are used in more high-speed applications, signal integrity and timing margin between the FPGA and other devices on the printed circuit board PCB become increasingly important
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Board Design Guideline
Abstract: WP-01008 board design guidelines application note an224 Signal Path Designer
Text: White Paper Stratix III FPGA Signal Integrity As devices move towards faster switching speed and higher pin counts, signal and power integrity become crucial, making or breaking a system. Chip designs that work perfectly for 90-nm process technology may no longer be good
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90-nm
65-nm
Board Design Guideline
WP-01008
board design guidelines
application note an224
Signal Path Designer
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Abstract: No abstract text available
Text: DataSource CD-ROM Q4-01: techXclusives techXclusives techXclusives Signal Integrity: Tips and Tricks By Austin Lesea Principal Engineer - Xilinx San Jose Signal Integrity SI engineering has become a necessary requirement for today's high-speed logic signals. Having control of cross-talk, ground
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CMOS spice model
Abstract: No abstract text available
Text: R IBIS Models The need for higher system performance leads to faster output transitions. Signals with fast transitions cannot be considered purely digital; it is important to understand their analog behavior for signal integrity analysis. To simulate the signal integrity on printed circuit boards PCB accurately and solve design
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Abstract: Quartus II Handbook version 9.1 volume Design and IBIS Models QII53020-9 EP2S60F1020C3
Text: 7. Signal Integrity Analysis with Third-Party Tools QII53020-9.1.0 Introduction With the ever-increasing operating speed of interfaces in traditional FPGA design, the timing and signal integrity margins between the FPGA and other devices on the board must be within specification and tolerance before a single PCB is built. If the
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Quartus II Handbook version 9.1 volume Design and
IBIS Models
EP2S60F1020C3
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Abstract: hyperlynx ep2s60f1020c System Software Writers Guide EP2S60F1020C3 QII53020-10 713N S
Text: 7. Signal Integrity Analysis with Third-Party Tools QII53020-10.0.0 Introduction With the ever-increasing operating speed of interfaces in traditional FPGA design, the timing and signal integrity margins between the FPGA and other devices on the board must be within specification and tolerance before a single PCB is built. If the
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713N S
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Untitled
Abstract: No abstract text available
Text: Transceiver Signal Integrity Development Kit, Stratix IV GX Edition User Guide Transceiver Signal Integrity Development Kit, Stratix IV GX Edition User Guide 101 Innovation Drive San Jose, CA 95134 www.altera.com UG-01057-2.1 Subscribe 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX words and logos
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FF1136
Abstract: SSTL18I thevenin DDR2 sstl_18 class magic eye ML461 ML561 UG190 UG199 XAPP863
Text: Application Note: Virtex-5, Virtex-4, and Spartan-3 Generation Devices R XAPP863 v1.0 June 1, 2007 Using Digitally Controlled Impedance: Signal Integrity vs. Power Dissipation Considerations Author: David Banas Summary On-die termination (ODT) promises higher signaling rates for printed circuit board (PCB) interchip interfaces through improved signal integrity. However, when using ODT, there is
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org/download/search/JESD8-15a
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com/bvdocs/userguides/ug190
UG079,
ML461
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UG199,
ML561
com/bvdocs/userguides/ug199
FF1136
SSTL18I
thevenin
DDR2 sstl_18 class
magic eye
UG190
UG199
XAPP863
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MPC5500
Abstract: pcb diagram inverter ups AN1051 MPC5500-Based AN2127 MPC5554 mini inverter circuit schematic diagram inductors 33 micro henry inductor 220 micro henry inductor
Text: Freescale Semiconductor Application Note Document Number: AN2705 Rev. 0, 07/2005 Signal Integrity Considerations with MPC5500-based Systems by: Stevan Dobrasevic and John Phillippe MCD Design 1 Introduction As external bus interfaces increase in operating
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AN2705
MPC5500-based
MPC5500
pcb diagram inverter ups
AN1051
AN2127
MPC5554
mini inverter circuit schematic diagram
inductors 33 micro henry
inductor 220 micro henry inductor
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SIGNAL PATH DESIGNER
Abstract: No abstract text available
Text: White Paper Basic Principles of Signal Integrity Introduction Digital designs have not traditionally suffered by issues associated with transmission line effects. At lower frequencies the signals remain within data characterization and the system performs as designed. But as system
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88E1111
Abstract: LTI-SASF546-P26-X1 Marvell PHY 88E1111 layout Marvell 88E1111 trace layout guidelines 88E1111-B2 -BAB-1I000 Marvell PHY 88E1111 Datasheet Marvell rgmii layout guide 48F4400P0VB00 EVALUATION BOARD 88E1111 88E1111 PHY registers map
Text: Transceiver Signal Integrity Development Kit, Stratix IV GT Edition Reference Manual 101 Innovation Drive San Jose, CA 95134 www.altera.com Document Version: Document Date: 1.0 December 2009 Copyright 2009 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other
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Abstract: No abstract text available
Text: R Using Digitally Controlled Impedance DCI Introduction As FPGAs get bigger and system clock speeds get faster, PCB board design and manufacturing has become more difficult. With ever faster edge rates, maintaining signal integrity becomes a critical issue. Designers must make sure that most PC board traces are
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Altera DDR3 FPGA sampling oscilloscope
Abstract: lot Code Formats altera altera board
Text: Stratix III Design Guidelines Application Note 469 July 2007, version 1.0 Introduction Stratix III devices are engineered for high-speed core performance and high-speed I/O with the best signal integrity in the industry, combined with low-static and dynamic-power consumption. The devices also offer
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LTI-SASF546-P26-X1
Abstract: Marvell 88E1111 trace layout guidelines 88E1111-B2-CAA1C000 48F4400 PC48F4400P0VB00 48F4400p0vb00 88E1111-B2 -BAB-1I000 88E1111 Marvell PHY 88E1111 layout fuse n15
Text: Transceiver Signal Integrity Development Kit, Stratix IV GX Edition Reference Manual 101 Innovation Drive San Jose, CA 95134 www.altera.com Document Version: Document Date: 2.0 November 2009 Copyright 2009 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other
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Altera DDR3 FPGA sampling oscilloscope
Abstract: EPC16 EPCS128 EPCS16 EPCS64 AN469 altera board
Text: Stratix III Design Guidelines Application Note 469 May 2008, version 1.1 Introduction Stratix III devices are engineered for high-speed core performance and high-speed I/O with the best signal integrity in the industry, combined with low-static and dynamic-power consumption. The devices also offer
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transistor directory
Abstract: No abstract text available
Text: Using Calibrated On-Chip Series Termination in Stratix II Devices Application Note 384 April 2005, ver. 1.0 Introduction On-chip series termination RS OCT improves signal integrity and I/O performance due to optimized impedance matching. On-chip series termination eliminates the need for external series termination resistors
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PC48F4400P0VB00
Abstract: "DC Power Jack" SMA END LAUNCH HD 10E12 PRBS23
Text: Transceiver Signal Integrity Development Kit, Stratix IV GX Edition User Guide 101 Innovation Drive San Jose, CA 95134 www.altera.com P30-38445-00 Document Version: Document Date: 2.0 December 2009 Copyright 2009 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other
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PC48F4400P0VB00
"DC Power Jack"
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10E12
PRBS23
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ICS830231
Abstract: dual 7-segment-display pin configuration Stratix II GX FPGA Development Board Reference Ma S72 SMD tactile push button smd switch datasheet Maxim - SRAM FPGA ICS557-03 S29GL128N11TFI020 smd diode S7 TSOP sensor project
Text: Stratix II GX EP2SGX90 Transceiver Signal Integrity Development Board Reference Manual 101 Innovation Drive San Jose, CA 95134 408 544-7000 www.altera.com Development Board Version: 1.0.0 Document Version: 1.0.0 Document Date: May 2006 Copyright 2006 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
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EP2SGX90
S29GL128N11TFI020,
128-Mbit
56-pin
64-pin
ICS830231
dual 7-segment-display pin configuration
Stratix II GX FPGA Development Board Reference Ma
S72 SMD
tactile push button smd switch datasheet
Maxim - SRAM FPGA
ICS557-03
S29GL128N11TFI020
smd diode S7
TSOP sensor project
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DDR3 pcb layout guide
Abstract: DDR3 pcb layout guidelines DDR2 sdram pcb layout guidelines sdr sdram pcb layout guidelines DDR3 pcb layout memory handbook sdr sdram pcb layout DDR3 sdram pcb layout guidelines External Memory Interface Handbook DDR3 layout
Text: Section I. About This Handbook 101 Innovation Drive San Jose, CA 95134 www.altera.com EMI_INTRO_ABOUT-2.0 Document Version: Document Date: 2.0 July 2010 Copyright 2010 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other
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