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    SAMTEC HIGH DENSITY ARRAYS Search Results

    SAMTEC HIGH DENSITY ARRAYS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TLP5754H Toshiba Electronic Devices & Storage Corporation Photocoupler (Gate Driver Coupler), High-speed / High-Topr, 5000 Vrms, SO6L Visit Toshiba Electronic Devices & Storage Corporation
    TLP5751H Toshiba Electronic Devices & Storage Corporation Photocoupler (Gate Driver Coupler), High-speed / High-Topr, 5000 Vrms, SO6L Visit Toshiba Electronic Devices & Storage Corporation
    TLP5752H Toshiba Electronic Devices & Storage Corporation Photocoupler (Gate Driver Coupler), High-speed / High-Topr, 5000 Vrms, SO6L Visit Toshiba Electronic Devices & Storage Corporation
    TLP5702H Toshiba Electronic Devices & Storage Corporation Photocoupler (Gate Driver Coupler), High-Topr / IGBT driver, 5000 Vrms, SO6L Visit Toshiba Electronic Devices & Storage Corporation
    DCL542H01 Toshiba Electronic Devices & Storage Corporation Digital Isolator / VDD=2.25~5.5V / 150Mbps / 4 channel(F:R=2:2) / Default Output Logic: High / Output enable Visit Toshiba Electronic Devices & Storage Corporation

    SAMTEC HIGH DENSITY ARRAYS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SEAF-RA

    Abstract: SAMTEC SEAM-SEAF VITA-57 Samtec High Density Arrays BGA reflow guide 2 pin male connector 5mm pitch VITA57 Seaf right angle SATA connector Samtec Connector Reliability
    Text: SEARAY High Speed, High Density Arrays Samtec’s family of SEARAY™ high speed, high density arrays offer ultimate design flexibility that is unmatched in the connector industry. SEARAY™ products allow for maximum grounding and routing flexibility with up to


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    right angle 20 pin pcb edge connector

    Abstract: SMA Connector Spice samtec MEC1 HSEC8 lshm connector pin contact Samtec breakout agilent BNC edge connector layout SEAF-RA PCI express PCB footprint
    Text: DESIGN GUIDE NOVE EMBER 2010 HIGH SPEED High Speed Edge Cards Page 4 High Density Edge Rate Contact System High Speed Rugged Contact Systems Page 5 High Density High Speed p Systems y Page g 6 High Speed Ground Plane Page 7 ™ Two Piece T Edg Rate™ Edge


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    PEC 726 UF1004FCT

    Abstract: POWER-STRIP mppt code Solar mppt mppt VPSTP Solar mppt circuit design HSEC8 mppt circuit QDF8
    Text: RUGGED/POWER INTERCONNECT DESIGN & CAPABILITIES GUIDE OCTOBER 2009 INTERCONNECT SOLUTIONS CONTENTS Samtec’s extensive line of Rugged and Power board-to-board, cable-to-board, and panel & I/O systems is designed specifically to address the interconnect needs of applications requiring high power or highly durable solutions.


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    SMA rf pogo pin

    Abstract: flex pogo pin rg6 f connector compression MIPI spec rf pogo pin electronic passive components catalog Samtec ASP header rg-178 spice model samtec connector QSH SMA pcb footprint Connector
    Text: DESIGN GUIDE FEBRUARY 2009 RD-TO-BOARD BOA Samtec product solutions are supported by the best service in the industry, as documented year after year by the Bishop Survey of the Interconnect Industry. B LE CA For the ultimate in design flexibility, Samtec also offers the unique ability to weave these


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    ASP-122952-01

    Abstract: samtec ASP ASP-122953-01 samtec connector QSH ASP Series samtec samtec connector QTH pcb connectors HDR-12891-xx samtec connector SMA rf pogo pin
    Text: SILICON BOARD DESIGNS HIGH SPEED INTERCONNECT SOLUTIONS Once high speed silicon has been integrated into a package, Samtec can assist with chip testing, verification, development board design and reference design assistance. Development Board Design • Samtec assistance with


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    RG058

    Abstract: RG318 cables ESQT SFML cadstar CR5000 EQDP QMSS RF179
    Text: SAMTEC USA 0/"OXs.EW!LBANY . 53!   3!-4%# 53!#ANADA s4EL  s&AX  s% MAILINFO SAMTECCOM SAMTEC SILICON VALLEY 5NIVERSITY!VENUEs3UITEs,OS'ATOS #!  4EL  s&AX  s% MAILSAMTECSILICONVALLEY SAMTECCOM


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    ASP-134486-01

    Abstract: ASP Series samtec ASP-134488-01 ASP-134603-01 ASP-134604-01 VITA-57 fmc samtec asp connector STR 30130 samtec connector QSH cables
    Text: INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT, & OEM HARDWARE SILICON-GUIDE-XILINX MAY 2010 SILICON BOARD DESIGNS HIGH SPEED INTERCONNECT SOLUTIONS Once high speed silicon has been integrated into a package, Samtec can assist with chip testing, verification, development


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    BNC edge connector layout

    Abstract: hdmi SDI BNC7T-J-P-HN-ST-EM1 SMB SDI layout FOR 3G cables samtec connector samtec connector QTH hdmi to SDI Samtec High Density Arrays
    Text: Common 3G SDI applications include Routers, Switchers, Video Servers, Distribution Amplifiers DAs , Multi-Viewers, Encoders/Decoders, Converters, Projectors, and Test & Measurement. Typical Interconnect Panels 3G SDI Challenges 2 Samtec’s signal integrity expertise and


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    PCI express PCB footprint

    Abstract: LGP-24-G-D LGP-14-G-D 371A CAT-EX-SCTP-01 CCS-145025-01-MC Samtec Connectors
    Text: F-210 TEST PRO E SPT–16–MB SPT SERIES PATENT PENDING MIDBUS TDR TEST PROBE Full size 16 Differential channels or half size (8 Differential channels) FEATURES • Compatible to Intel specified PCI Express® protocol footprint Replaceable contact arrays


    Original     		PDF F-210 SPF-14 LGP-14-G-D SPF-24 LGP-24-G-D PCI express PCB footprint LGP-24-G-D LGP-14-G-D 371A CAT-EX-SCTP-01 CCS-145025-01-MC Samtec Connectors

    slim power sata pinout

    Abstract: Mini USB 8-pin B-Type CON HDR 2663 HQCD-030-06 JST MSA QSH-060-01-L-D-A serdes hdmi optical fibre SO-0165-04-01-02 XFP extender BOARD HCM 582 circuit
    Text: CABLE SYSTEMS CSF-210 AUGUST 2010 END-TO-END CABLE SYSTEM SOLUTIONS Product Solutions Whether you need quick-turn, off-the-shelf cable solutions or custom cable solutions, Samtec offers a full line of components and systems that will address your specific needs.


    Original     		PDF CSF-210 slim power sata pinout Mini USB 8-pin B-Type CON HDR 2663 HQCD-030-06 JST MSA QSH-060-01-L-D-A serdes hdmi optical fibre SO-0165-04-01-02 XFP extender BOARD HCM 582 circuit

    A40A

    Abstract: Samtec breakout agilent HSEC8 e5381a 20 pin header connector Agilent logic analyzer 16803A A90A LGP-24-G-D CAT-EX-SCTP-02 38AWG
    Text: LOGIC ANALYSIS WITH SAMTEC’S SPIRIT TEST PROBE Spirit® Compression Test Probes • Eliminate costly PCB test probe connectors • Replaceable probe tip connectors extend probe life indefinitely • Enables high speed testing • Available as components or complete


    Original     		PDF Agilent40-pinlogicanalyzer* SCTPS-18-XX XX-EM-A40A 42AWG 90coax Agilent90-pinlogicanalyzer* XX-EM-A90A 38AWG 75coax A40A Samtec breakout agilent HSEC8 e5381a 20 pin header connector Agilent logic analyzer 16803A A90A LGP-24-G-D CAT-EX-SCTP-02

    Untitled

    Abstract: No abstract text available
    Text: F-211 SEAM–20–02.0–S–10–2–A–K–TR 1,27mm .050" SEAM–30–03.5–S–04–2–A–K–TR SEAM–30–02.0–S–08–2–A–K–TR SEAM SERIES HIGH SPEED/HIGH DENSITY OPEN PIN FIELD Mates with: SEAF, SADL SPECIFICATIONS Up to 500 Pins (1,15mm)


    Original     		PDF F-211

    high power pogo pins

    Abstract: high voltage pogo pins coaxial pogo pin rf pogo pin pogo pins insertion tool high current pogo pin flex pogo pin Samtec High Density Arrays DB-064 samtec micro coax cable
    Text: DESIGN AND CAPABILITIES GUIDE APRIL 2008 ADVANCED TECHNOLOGY SOLUTIONS Samtec’s in-house custom cabling and advanced interface design capabilities provide complete Automated Test Equipment solutions, customized to specific design platforms and supported by


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    VITA57

    Abstract: VITA-57
    Text: CSF-210 SEAM–20–02.0–S–10–2–A–K–TR 1,27mm .050" SEAM–30–03.5–S–08–2–A–K–TR SEAM–30–02.0–S–08–2–A–K–TR SEAM SERIES HIGH SPEED/HIGH DENSITY OPEN PIN FIELD Mates with: SEAF, SADL SPECIFICATIONS Up to 500 Pins


    Original     		PDF CSF-210 50x10 40x10 VITA57 VITA-57

    Untitled

    Abstract: No abstract text available
    Text: F-210-1 SEAM–20–02.0–S–10–2–A–K–TR 1,27mm .050" SEAM–30–03.5–S–08–2–A–K–TR SEAM–30–02.0–S–08–2–A–K–TR SEAM SERIES HIGH SPEED/HIGH DENSITY OPEN PIN FIELD Mates with: SEAF, SADL SPECIFICATIONS Up to 500 Pins


    Original     		PDF F-210-1

    VITA57

    Abstract: 20x5
    Text: F-212 SEAM–20–02.0–S–10–2–A–K–TR 1,27mm .050" SEAM–30–03.5–S–04–2–A–K–TR SEAM–30–02.0–S–08–2–A–K–TR SEAM SERIES HIGH SPEED/HIGH DENSITY OPEN PIN FIELD Mates with: SEAF, SEAFP SPECIFICATIONS Up to 500 Pins (1,15mm)


    Original     		PDF F-212 charges040 50x10 40x10 VITA57 20x5

    Untitled

    Abstract: No abstract text available
    Text: F-211-1 SEAM–20–02.0–S–10–2–A–K–TR 1,27mm .050" SEAM–30–03.5–S–04–2–A–K–TR SEAM–30–02.0–S–08–2–A–K–TR SEAM SERIES HIGH SPEED/HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see


    Original     		PDF F-211-1

    Untitled

    Abstract: No abstract text available
    Text: F-213 SEAM–20–02.0–S–10–2–A–K–TR 1,27 mm .050" SEAM–30–03.5–S–04–2–A–K–TR SEAM–30–02.0–S–08–2–A–K–TR SEAM SERIES HIGH SPEED/HIGH DENSITY OPEN PIN FIELD Mates with: SEAF, SEAFP SPECIFICATIONS Up to 500 Pins


    Original     		PDF F-213

    Untitled

    Abstract: No abstract text available
    Text: F-210 SEAM–20–02.0–S–10–2–A–K–TR 1,27mm .050" SEAM–30–03.5–S–08–2–A–K–TR SEAM–30–02.0–S–08–2–A–K–TR SEAM SERIES HIGH SPEED/HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Up to 500 Pins (1,50mm) .059" NOMINAL WIPE


    Original     		PDF F-210 50x10 40x10 30x10 20x10

    fr4 rlgc

    Abstract: No abstract text available
    Text: HNAL NCtf" DESIGN TOOLS To m ake high sp eed connectors e as ier to specify a n d use, Sam tec has extended the concept o f m anufacturer supplied P C B p a d layouts a n d connector S P /C E m odels. Sam tec now supplies “reference designs” fo r one o f the


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: S E A F -2 0 -0 5 .0 -S -1 0 -2 -A -K -T R amtec SEfR O T OPEN PIN FIELD INTERCONNECTS 1,27mm .050" S E A F -3 0 -0 5 .0 -S -0 8 -2 -A -K -T R SEAF SERIES S E A F -3 0 -0 5 .0 -S -0 8 -2 -A -L P -K -T R HIGH SPEED/HIGH DENSITY OPEN PIN FIELD *1^ up to 5, 8 and 10 row footprint


    OCR Scan     		PDF 408-395-59CO

    Untitled

    Abstract: No abstract text available
    Text: F-212 SE A M -2 0 -0 2 .0 -S -1 0 -2 -A -K -T R amtec s er w OPEN PIN FIELD INTERCONNECTS 1,27mm .050'' SE A M -3 0 -0 3 .5 -S -0 4 -2 -A -K -T R SE A M -3 0 -0 2 .0 -S -0 8 -2 -A -K -T R SEAM SERIES HIGH SPEED/HIGH DENSITY OPEN PIN FIELD Up to 5, 8 and 10 row footprint compatible


    OCR Scan     		PDF F-212 C45-475-1385

    Untitled

    Abstract: No abstract text available
    Text: S E A M -2 0 -0 2 .0 -S -1 0 -2 -A -K -T R amtec S E fR W OPEN PIN FIELD INTERCONNECTS 1,27mm .050" S E A M -3 0 -0 3 .5 -S -0 4 -2 -A -K -T R S E A M -3 0 -0 2 .0 -S -0 8 -2 -A -K -T R SEAM SERIES HIGH SPEED/HIGH DENSITY OPEN PIN FIELD Up to 500 Pins 5, 8 and 10 row footprint compatible


    OCR Scan     		PDF 408-395-59CO

    ASP-105884-01

    Abstract: 13002 hj B1 PA66-GF13 5mm ldr ASP-105885-01 mj 13003 IRF 3055 DIN 16901 130 plastic PCI x1 express PCB dimensions artwork Training TV repair
    Text: CONTENTS Board-to-Board Applications Fin al Inch P C B D esign T o o ls . 10-11 High S p eed Board-to-Board S y s te m s .12-27 M icro Pitch Board-to-Board S y s t e m s .28-37


    OCR Scan     		PDF Series09 ASP-105884-01 13002 hj B1 PA66-GF13 5mm ldr ASP-105885-01 mj 13003 IRF 3055 DIN 16901 130 plastic PCI x1 express PCB dimensions artwork Training TV repair