samtec ASP 146
Abstract: No abstract text available
Text: 23.40 .921 REF ASP-149700-01 5.75 .226 REF TYP REVISION DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] CL 11.35 .447 REF 8.7 .34 REF 16.30 .642 REF 11.88±0.25 .468±.010 8.00 .315 NOT RELEASED FOR PRODUCTION 02 C1 'B' "A" 0.80 .031 (REF) 22 USE FOR QUOTING, PRELIMINARY
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ASP-149700-01
\dwg\sw\asp\149000\ASP-149700-01
samtec ASP 146
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Untitled
Abstract: No abstract text available
Text: F-203 Through T/H Hole 2mm LOW PROFILE TMM SERIES SPECIFICATIONS For complete specifications see www.samtec.com?TMM Mates with: CLT, SQT, SQW, ESQT, TLE, SMM, MMS, TCSD Insulator Material: Black Liquid Crystal Polymer Terminal Material: Phosphor Bronze Operating Temp
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F-203
1-800-SAMTEC-9
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samtec ASP 146
Abstract: samtec asp header
Text: FACTSHEET F-201-1 QTE–020–03 –F–D–A QTE–040–02–L–D–A QTE–060–01–L–D–A 0,80 mm HI-SPEED HEADER QTE SERIES SPECIFICATIONSi APPLICATIONS For complete specifications: see www.samtec.com/design/ pdf_reports.asp; select QTE –01 –02
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F-201-1
1-800-SAMTEC-9
samtec ASP 146
samtec asp header
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Untitled
Abstract: No abstract text available
Text: F-208-1 TMM–108–03–T–Q TMM–112–01–L–D–RA TMM–108–04–S–D TMM–116–01–G–S EXTENDED LIFE PRODUCT 10 Year Mixed Flowing Gas MFG Call Samtec for maximum cycles mated with SMM 2mm LOW PROFILE TMM SERIES SPECIFICATIONS For complete specifications
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F-208-1
E111594
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Untitled
Abstract: No abstract text available
Text: F-213 TMM–108–03–T–Q TMM–112–01–L–D–RA TMM–108–04–S–D TMM–116–01–F–S 2,00 mm .0787" TM TMM SERIES LOW PROFILE THROUGH-HOLE HEADER SPECIFICATIONS For complete specifications see www.samtec.com?TMM Insulator Material: Black Liquid
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F-213
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Text: F-213-1 TMM–108–03–T–Q TMM–112–01–L–D–RA TMM–108–04–S–D TMM–116–01–F–S 2,00 mm .0787" TM TMM SERIES LOW PROFILE THROUGH-HOLE HEADER SPECIFICATIONS For complete specifications see www.samtec.com?TMM Insulator Material: Black Liquid
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F-213-1
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samtec asp header
Abstract: No abstract text available
Text: F-212 TMM–108–03–T–Q TMM–112–01–L–D–RA TMM–108–04–S–D TMM–116–01–F–S 2,00mm .0787" TM TMM SERIES LOW PROFILE THROUGH-HOLE HEADER SPECIFICATIONS For complete specifications see www.samtec.com?TMM Insulator Material: Black Liquid
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F-212
samtec asp header
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ASP-122952-01
Abstract: samtec ASP ASP-122953-01 samtec connector QSH ASP Series samtec samtec connector QTH pcb connectors HDR-12891-xx samtec connector SMA rf pogo pin
Text: SILICON BOARD DESIGNS HIGH SPEED INTERCONNECT SOLUTIONS Once high speed silicon has been integrated into a package, Samtec can assist with chip testing, verification, development board design and reference design assistance. Development Board Design • Samtec assistance with
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ASP-134486-01
Abstract: ASP Series samtec ASP-134488-01 ASP-134603-01 ASP-134604-01 VITA-57 fmc samtec asp connector STR 30130 samtec connector QSH cables
Text: INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT, & OEM HARDWARE SILICON-GUIDE-XILINX MAY 2010 SILICON BOARD DESIGNS HIGH SPEED INTERCONNECT SOLUTIONS Once high speed silicon has been integrated into a package, Samtec can assist with chip testing, verification, development
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Daughter Cards
Abstract: hsmc spec QSH-090-01-L-D-A hsmc connector footprint samtec connector QSH ASP-122953-01 samtec connector QTH HDR-128291-XX CX4 connector pinout ASP-122952-01
Text: High Speed Mezzanine Card HSMC Specification 101 Innovation Drive San Jose, CA 95134 www.altera.com Document Version: Document Date: 1.7 June 2009 Copyright 2009 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
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FET k163
Abstract: AMD 140 Socket AM3 BCM91250A 60R100M6A EPM3256ATC144-7 QTE-080 k163 BCM1125 RJ45INTLED amd am2 socket pin diagram
Text: Stratix PCI Development Board September 2003, ver. 2.0 Introduction Data Sheet This data sheet describes the features and technical details of the StratixTM PCI development board. Slightly different versions of the board are included in the following development kits:
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PCI-BOARD/S25)
PCI-BOARD/S60)
FET k163
AMD 140 Socket AM3
BCM91250A
60R100M6A
EPM3256ATC144-7
QTE-080
k163
BCM1125
RJ45INTLED
amd am2 socket pin diagram
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samtec ASP 146
Abstract: No abstract text available
Text: F-211 TMM–108–03–T–Q TMM–112–01–L–D–RA TMM–108–04–S–D TMM–116–01–G–S 2,00mm .0787" TM TMM SERIES LOW PROFILE THROUGH-HOLE HEADER SPECIFICATIONS For complete specifications see www.samtec.com?TMM Insulator Material: Black Liquid
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F-211
Gas20)
samtec ASP 146
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Untitled
Abstract: No abstract text available
Text: F-210-1 TMM–108–03–T–Q TMM–112–01–L–D–RA TMM–108–04–S–D TMM–116–01–G–S 2,00mm .0787" TM TMM SERIES LOW PROFILE THROUGH-HOLE HEADER SPECIFICATIONS For complete specifications see www.samtec.com?TMM Insulator Material: Black Liquid
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F-210-1
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Untitled
Abstract: No abstract text available
Text: F-208 TMM–108–03–T–Q TMM–112–01–L–D–RA TMM–108–04–S–D TMM–116–01–G–S TM 2mm LOW PROFILE SPECIFICATIONS For complete specifications see www.samtec.com?TMM Insulator Material: Black Liquid Crystal Polymer Terminal Material:
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F-208
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Untitled
Abstract: No abstract text available
Text: F-209 TMM–108–03–T–Q TMM–112–01–L–D–RA TMM–108–04–S–D TMM–116–01–G–S EXTENDED LIFE PRODUCT 10 Year Mixed Flowing Gas MFG 1,000 cycles when mated with SMM 2mm LOW PROFILE TMM SERIES SPECIFICATIONS For complete specifications
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F-209
E111594
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Untitled
Abstract: No abstract text available
Text: F-209-1 TMM–108–03–T–Q TMM–112–01–L–D–RA TMM–108–04–S–D TM TMM–116–01–G–S EXTENDED LIFE PRODUCT 10 Year Mixed Flowing Gas MFG 1,000 cycles when mated with SMM Through T/H Hole 2mm LOW PROFILE TMM SERIES SPECIFICATIONS For complete specifications
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F-209-1
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Untitled
Abstract: No abstract text available
Text: F-210 TMM–108–03–T–Q TMM–112–01–L–D–RA TMM–108–04–S–D TMM–116–01–G–S 2,00mm .0787" TM TMM SERIES LOW PROFILE THROUGH-HOLE HEADER SPECIFICATIONS For complete specifications see www.samtec.com?TMM Insulator Material: Black Liquid
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F-210
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g31 motherboard
Abstract: XVC400 LMXCV400 0130A ARM966E-S XCV400 pld connector
Text: Integrator/LM-XCV400+ Logic Module User Guide ARM DUI 0130A Integrator/LM-XCV400+ User Guide Copyright ARM Limited 2000. All rights reserved. Release information Change history Date Issue Change 16 February 2000 A New document Proprietary notice ARM, the ARM Powered logo, Thumb and StrongARM are registered trademarks of ARM Limited.
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Integrator/LM-XCV400+
ARM966E-S,
g31 motherboard
XVC400
LMXCV400
0130A
ARM966E-S
XCV400
pld connector
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MB133
Abstract: ASP 178 samtec
Text: F -1 9 9 -1 _ m _ GENERAL POLICY SEliTiplE The inform ation contained in this catalog is accurate to the best of our knowledge. Due to technical progress, it is subject to change w ithout notice. Application inform ation is inform ational in nature
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6B90315
MB133
ASP 178 samtec
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samtec ASP 146
Abstract: No abstract text available
Text: F-207 m samTëc T M M -1 0 8 -0 3 -T -Q T M M -1 1 6 -0 1 -G -S T M M -1 0 6 -0 4 -S -D T M M -1 1 2 -0 1 -L -D -R A m ro u g n \ W 2mm LOW PROFILE SPECIFICATIONS For complete specifications see www.samtec.com?TMM In sulator Material: TMM SERIES 'Ultra-low profile
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F-207
852-26904858-Fax:
samtec ASP 146
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Abstract: No abstract text available
Text: ASP—14677—01—K NOTE: PA RT S TO BULK PACKAGED. •200± I 00 .100 REF r~ CONTACT AREA .255 REF MATERIAL: INSULATOR: BLACK G.F. POLYESTER UL RATED 9 4 V - 0 TERMINAL: SPRING TEMPER PHOSPHOR BRONZE PLATING: CONTACT AREA: .0 0 0 0 3 0 GOLD OVER .0 0 0 0 5 0 NICKEL
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ASP--14677--01--K
SPN--11670
ASP-14677-01SH
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Abstract: No abstract text available
Text: ASP—14659—01—N NOTES: 1. POSITIONS 0 3 , 04, 07, 08, 11, 12, 15, 16, 19, 20, 23, 47, 4 8 , 51, 5 2 , 55, 56, 59 & 6 0 TO BE POLARIZED 24, 27 , 2 8 , 31, 32, 35, 36, 39, 4 0 , 4 3, 4 4 2. PARTS TO BE BULK PACKAGED. = UNFILLED = FILLED {31 3 .1 2 0 ± . 0 1 0
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ASP-14659-01
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Untitled
Abstract: No abstract text available
Text: F-204 INDEX Series Description ALC AP APA APH APO APS ASP ATS AW Aluminum Lead Socket Carrier, DIP. " Adaptor Plug, DIP. * Adaptor Plug, DIP, Automated insertion Design .353
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F-204
PC104+
86-21-53B5-4089
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ASP-105884-01
Abstract: 13002 hj B1 PA66-GF13 5mm ldr ASP-105885-01 mj 13003 IRF 3055 DIN 16901 130 plastic PCI x1 express PCB dimensions artwork Training TV repair
Text: CONTENTS Board-to-Board Applications Fin al Inch P C B D esign T o o ls . 10-11 High S p eed Board-to-Board S y s te m s .12-27 M icro Pitch Board-to-Board S y s t e m s .28-37
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Series09
ASP-105884-01
13002 hj B1
PA66-GF13
5mm ldr
ASP-105885-01
mj 13003
IRF 3055
DIN 16901 130 plastic
PCI x1 express PCB dimensions artwork
Training TV repair
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