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    S-51850-- Search Results

    S-51850-- Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    65185-001LF Amphenol Communications Solutions Din Accessory Latching Frame Modular 2 modules Visit Amphenol Communications Solutions
    77313-518-50LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 50 Positions Visit Amphenol Communications Solutions
    54121-809251850LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 25 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    74AC11086D Texas Instruments Quadruple 2-Input Exclusive-OR Gates 16-SOIC -40 to 85 Visit Texas Instruments Buy
    74AC11244DW Texas Instruments Octal Buffers/Drivers 24-SOIC -40 to 85 Visit Texas Instruments Buy
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    S-51850-- Price and Stock

    Boyd Corporation OS518-50-B

    Heatsink, 3.59°C/W, To-218/To-220/To-251; Thermal Resistance:3.59°C/W; Packages Cooled:To-218, To-220, To-251; External Width - Metric:38Mm; External Height - Metric:54Mm; External Length - Metric:50Mm; External Diameter - Metric:- |Boyd OS518-50-B
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