reflow
Abstract: soldering
Text: SOLDER REFLOW PROFILE RECOMMENDATIONS Reflow Profiles Table 1 SnPb Assembly Process – Package Peak Reflow Temperatures Table 2 Pb-free Assembly Process – Package Peak Reflow Temperatures Manual Soldering Conditions: ► Peak Temperature at terminals : 350 °C
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capacitor 47 nano
Abstract: No abstract text available
Text: X7R Dielectric Capacitance Range PREFERRED SIZES ARE SHADED SIZE 0201 0402 0603 0805 1206 Soldering Packaging Reflow Only All Paper Reflow Only All Paper Reflow/Wave All Paper Reflow/Wave Paper/Embossed Reflow/Wave Paper/Embossed 0.60 ± 0.03 0.024 ± 0.001
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reflow profile
Abstract: Abracon 8001 reflow
Text: APPENDIX E SUGGESTED REFLOW PROFILE NOTE: This information is for reference only. Please refer to the Official Specification Sheet for component-specific reflow information and maximum temperature specifications. Please contact Abracon Corporation prior to implementation of reflow process changes.
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VSC8201XVZ
Abstract: VITESSE reflow VSC8201 AN0057 VITESSE reflow profile BGA PACKAGE thermal profile VITESSE vsc8201
Text: Application Note VSC8201 VSC8201XVZ Solder Reflow Profile GENERAL DESCRIPTION While the VSC8201XVZ is a lead-free device, it is not compatible with a 260°C solder reflow profile. This document will describe the proper solder reflow profile for use with the VSC8201XVZ.
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VSC8201
VSC8201XVZ
VSC8201XVZ.
AN0057
VITESSE reflow
VSC8201
VITESSE
reflow profile
BGA PACKAGE thermal profile
VITESSE vsc8201
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10 35L CAPacitor
Abstract: 22 35L CAPacitor 87L TO-92
Text: • Soldering Method and Allowable Range of Reflow Soldering Method ■ Recommended Land Size Allowable Range of Reflow Hot-Plate Reflow Infrared-Ray Reflow Air Reflow Size X Y a φ3 1.6 2.2 0.8 φ4 1.6 2.6 1.0 φ5 1.6 3.0 1.4 φ6.3 1.6 3.5 2.1 φ3x5.5L, φ8×6.2L, φ8×7L
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JEDEC J-STD-020d
Abstract: TES 1-0511V J-STD-020D JEDEC J-STD-020d Moisture Sensitivity 56756 4932 45328 j 182 JSTD-020D 4925
Text: Product: TES 1 Series Single Output Models Moisture Sensitivity Level MSL Test Report as per IPC/JEDEC J-STD-020D Table of Contents page Tested Flowchart 1 Tested Data before Reflow 2 245℃ Temperature Reflow Profile 3 Tested Data after Reflow 4 Pictures
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J-STD-020D
code0851)
JEDEC J-STD-020d
TES 1-0511V
J-STD-020D
JEDEC J-STD-020d Moisture Sensitivity
56756
4932
45328
j 182
JSTD-020D
4925
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80826
Abstract: TES-2N traco 212 DSASW004049
Text: Product: TES 2N Series Moisture Sensitivity Level MSL Test Report as per IPC/JEDEC J-STD-020C Table of Contents Tested Flowchart Page 1 Tested Data before Reflow 2 245℃ Temperature Reflow Profile 3 Tested Data after Reflow 4 Pictures Conclusion 5-40 41
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J-STD-020C
2N-1223
code0730)
J-STD-020
80826
TES-2N
traco 212
DSASW004049
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215C
Abstract: reflow
Text: Soldering Profile Vishay Dale Soldering Profiles RECOMMENDED PROFILES FOR SOLDER REFLOW Infrared Reflow 10 Second Max. 245°C 200 1 to 5°C/Second 1 to 5°C/Second Temperature °C 100 1 to 9°C/Second Preliminary Heating 60 Seconds 200 Seconds Time Vapor Phase Reflow
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08-Jun-05
215C
reflow
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reflow profile 245
Abstract: 215C dale
Text: Soldering Profile Vishay Dale RECOMMENDED PROFILES FOR SOLDER REFLOW Infrared Reflow 10 Second Max. 245°C 200 1 to 5°C/Second 1 to 5°C/Second Temperature °C 100 1 to 9°C/Second Preliminary Heating 60 Seconds 200 Seconds Time Vapor Phase Reflow 50 Second
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12-Jan-00
reflow profile 245
215C
dale
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VG-469
Abstract: VG469
Text: VG-469 Solder Reflow Profile
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VG-469
VG469
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smema specifications
Abstract: smema AN038 smema control EAN-102068
Text: DESIGN APPLICATI0N NOTE - AN038 Solder Reflow Recommendations Sn/Pb and Pb Free for Plastic RFICs Overview The stages used in a solder profile We are often asked what the solder reflow profile should be for SMDI devices mounted on PCB’s using high volume production equipment. The reflow profile is
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AN038
10oC/second.
EAN-102068
AN-038
smema specifications
smema
AN038
smema control
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PCB fill silicone
Abstract: No abstract text available
Text: Flame Retardant Silicone Coating Alloy Resistance Wire Tinned End Caps. Suitable For Reflow Soldering Alloy Resistance Wire, Wound To Specific Parameters Terminals Suitable For Reflow Soldering Terminals Suitable For Reflow Soldering Flame Ratardant Silicone Coating
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JIS-C-5202-
PCB fill silicone
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VG-469-LF
Abstract: reflow profile
Text: VG-469-LF Solder Reflow Profile
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VG-469-LF
reflow profile
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Untitled
Abstract: No abstract text available
Text: Solder reflow recommendations Solder reflow profiles consist of four stages. They are: • Preheat • Pre-flow • Reflow • Cool down It is critical to have the rate of temperature change, maximum temperature, and time duration within each stage controlled to create solder joints that have flowed properly. An example of a
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J-STD-020B
Abstract: JEDEC J-STD-020B J-STD-020-B joint reflow profile JSTD020B
Text: Application Note Recommended Lead-Free Reflow Profile TriQuint Semiconductor provides surface-mount devices that are capable of withstanding the maximum temperature reflow profile shown in Figure 1. This includes a pre heat and cool-down rate of 3 and 6 °C/sec, respectively, with a maximum reflow temperature of 260°C for a maximum of 30 seconds. This
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J-STD-020B:
1-800-WJ1-4401
J-STD-020B
JEDEC J-STD-020B
J-STD-020-B
joint
reflow profile
JSTD020B
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ISP2100
Abstract: reflow reflow profile
Text: QLogic Corporation Applications Note No. 83210-514-01 A Reflow Soldering Recommendations Products Affected Chip Name Part Number ISP2100 2405088 This applications note describes the reflow soldering recommendations for the ISP2100 chip. The recommended reflow soldering conditions are
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ISP2100
ISP2100
15conds
reflow
reflow profile
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Kyocera capacitor
Abstract: No abstract text available
Text: TECHNICAL INFORMATION SOLDER REFLOW MOUNTING “TACmicrochip” TANTALUM CAPACITOR SOLDER REFLOW MOUNTING “TACmicrochip” TANTALUM CAPACITOR Solder reflow mounting of the small 0603 “TACmicrochip” requires a rethink from the established mounting of the 0603 ceramic chip or
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CERAMI0-539-1501
S-SRMTC00M301-N
Kyocera capacitor
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Reflow Soldering Guide
Abstract: berex
Text: BeRex Reflow Soldering Guide Application Note RF MMIC Innovator www.berex.com Classification: Reflow Soldering Document Number: Reflow61110 Revision code: 0.1 Reflow Soldering Guide for Surface Mount Devices Name Writer Date Signature BY KIM JH Bae OK Dr. Yoo
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Reflow61110
B61110
Reflow Soldering Guide
berex
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avx taj
Abstract: kyocera ceramic package
Text: TECHNICAL INFORMATION SOLDER REFLOW MOUNTING “TACmicrochip” TANTALUM CAPACITOR SOLDER REFLOW MOUNTING “TACmicrochip” TANTALUM CAPACITOR Solder reflow mounting of the small 0603 “TACmicrochip” requires a rethink from the established mounting of the 0603 ceramic chip or
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S-SRMTC00M301-N
avx taj
kyocera ceramic package
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Untitled
Abstract: No abstract text available
Text: VISHAY Soldering Profile Vishay Dale RECOMMENCED PROFILES FOB SOLDER REFLOW Infrared Reflow 10 Second Max. Vapor Phase Reflow Document Number 35033 Revision 12-Jan-OO www.vishay.com 37
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12-Jan-OO
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electrolytic capacitor
Abstract: dip electrolytic capacitor
Text: ALUMINUM ELECTROLYTIC CAPACITORS Reflow soldering method for the chip aluminum electrolytic capacitor 1. Recommended conditions for reflow soldering The chip aluminum electrolytic capacitor is subjected to soldering by reflow method. Temperature and time conditions of reflow soldering shall be set as per each temperature profile shown below
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reflow profile
Abstract: No abstract text available
Text: surfeeleds reflow profiles / tape specifications PRODUCT REFLOW PROFILE Ô « § £ 230 MAX. 200 175 150 125 100 2 - 75 50 25 REFLOW PROFILE REFLOW PROFILE 8 s e c . Max . 3 s e c . Ma x . 230 MAX. /Ä\ 90-120 SECr/ j > # \ /&> fa \ / .0 s /> M O' “
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reflow profile
Abstract: No abstract text available
Text: Reflow Profiles / Tape Specifications surfeeleds Product Reflow Profile REFLOW PROFILE REFLOW PROFILE 3 SEC. MAX, 230 MAX. 10 SEC. MAX, 200 175 150 125 9 0-12 0 S ÍC ./ ¡> £ 9 0-12 0 SEC. 100 75 50 25 90 180 90 TIME SECONOS Figure 1 180 TIME (SECONDS)
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delamination leadframe
Abstract: No abstract text available
Text: VISHAY ▼ Vishay Telefunken Reflow Soldering Reflow Solder Profile The recommended profile is shown in figure 2 Vishay Telefunken transceivers are surface mount devices and are designed to be assembled to printed circuit boards PCBs using reflow soldering. Possible
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