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Roth Elecronik GmbH RE933 Smd To Pin Out Adapter - Tssop Multiple; Board Type:Smd Device Adapter; Board Material:Epoxy Glass Composite; Hole Diameter:1Mm; External Height:58.9Mm; External Width:120.1Mm; Board Thickness:1.5Mm Rohs Compliant: Yes \|Roth Elektronik RE933
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Newark	RE933	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Buy Now
TME	RE933		20		1	1 $24.87 10 $23.4 100 $21.95 1000 $21.95 10000 $21.95	Buy Now
Roth Elecronik GmbH RE933-05 Smd To Pin Out Adapter - Tssop-24; Board Type:Smd Device Adapter; Board Material:Epoxy Glass Composite; Hole Diameter:1Mm; External Height:18.5Mm; External Width:23.5Mm; Board Thickness:1.5Mm Rohs Compliant: Yes \|Roth Elektronik RE933-05
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Newark	RE933-05	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Buy Now
TME	RE933-05				5	1 - 10 $7.64 100 $7.64 1000 $7.64 10000 $7.64	Get Quote
Roth Elecronik GmbH RE933-03 Smd To Pin Out Adapter - Tssop-16; Board Type:Smd Device Adapter; Board Material:Epoxy Glass Composite; Hole Diameter:1Mm; External Height:13.5Mm; External Width:23.5Mm; Board Thickness:1.5Mm; Body Material:Epoxied Fr4 Rohs Compliant: Yes \|Roth Elektronik RE933-03
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Newark	RE933-03	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Buy Now
TME	RE933-03				1	1 $7.5 10 $7.06 100 $6.63 1000 $6.63 10000 $6.63	Get Quote
Roth Elecronik GmbH RE933-01 Adaptor, Smd, Tssop-8, 0.65Mm; Convert From:-; Convert To:-; Pitch Spacing:2.54Mm; Row Pitch:2.54Mm; Product Range:-; Svhc:No Svhc (15-Jan-2019); Board Connector/Footprint:Tssop-8; Board Material:Epoxy Glass Composite; Board Rohs Compliant: Yes \|Roth Elektronik RE933-01
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Newark	RE933-01	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Buy Now
TME	RE933-01				1	1 $8.11 10 $7.64 100 $7.16 1000 $7.16 10000 $7.16	Get Quote
Roth Elecronik GmbH RE933-02 Smd To Pin Out Adapter - Tssop-14; Board Type:Smd Device Adapter; Board Material:Epoxy Glass Composite; Hole Diameter:1Mm; External Height:13.5Mm; External Width:23.5Mm; Board Thickness:1.5Mm Rohs Compliant: Yes \|Roth Elektronik RE933-02
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Newark	RE933-02	Bulk			1	1 $8.79 10 $8.79 100 $8.79 1000 $8.79 10000 $8.79	Buy Now
TME	RE933-02		25		1	1 $8.11 10 $7.64 100 $7.16 1000 $7.16 10000 $7.16	Buy Now

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RE933 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Multiadapters RE933-06 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 mm (173 mil) - pins: 28 - hole dia 1.00 mm - size 21.00 x 23.50 mm	Original	PDF	RE933-06
Untitled Abstract: No abstract text available Text: Multiadapters RE933-09 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 48 - hole dia 1.00 mm - size 27.00 x 34.50 mm	Original	PDF	RE933-09
RE933-04 Abstract: RE933-03 RE933-08 RE933-10 Text: TSSOP-CMS Multiadaptateur thin shrink small package RE933 - fibre de verre époxyde FR4 1,50 mm, double face 35 µm CU (entiérement métallisées) - côté de soudure et des composants avec une surface d`or chimique et pourvus d`un masque d`arrêt de soudure	Original	PDF	RE933 RE933-01 RE933-02 RE933-03 RE933-04 RE933-05 RE933-06 RE933-07 RE933-08 RE933-09 RE933-04 RE933-03 RE933-08 RE933-10
TSSOP8 Abstract: TSSOP8 Package Text: TSSOP8 Adapter thin shrink small outline package RE933-01 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 8 - hole dia 1.00 mm - size 9.00 x 23.50 mm	Original	PDF	RE933-01 TSSOP8 TSSOP8 Package
TSSOP48 Abstract: No abstract text available Text: TSSOP48 Adapter thin shrink small outline package RE933-09 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 48 - hole dia 1.00 mm - size 27.00 x 34.50 mm	Original	PDF	TSSOP48 RE933-09
Untitled Abstract: No abstract text available Text: Multiadapters RE933-02 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 14 - hole dia 1.00 mm - size 13.50 x 23.50 mm	Original	PDF	RE933-02
Untitled Abstract: No abstract text available Text: Multiadapters RE933-01 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 8 - hole dia 1.00 mm - size 9.00 x 23.50 mm	Original	PDF	RE933-01
TSSOP14 Abstract: TSSOP14 package Text: TSSOP14 Adapter thin shrink small outline package RE933-02 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 14 - hole dia 1.00 mm - size 13.50 x 23.50 mm	Original	PDF	TSSOP14 RE933-02 TSSOP14 package
TSSOP20 Abstract: TSSOP20 package RE933-04 Text: TSSOP20 Adapter thin shrink small outline package RE933-04 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 20 - hole dia 1.00 mm - size 16.00 x 23.50 mm	Original	PDF	TSSOP20 RE933-04 TSSOP20 package RE933-04
TSSOP32 Abstract: TSSOP-32 RE933-07 Text: TSSOP32 Adapter thin shrink small outline package RE933-07 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 mm (240 mil) - pins: 32 - hole dia 1.00 mm - size 23.50 x 25.50 mm	Original	PDF	TSSOP32 RE933-07 TSSOP-32 RE933-07
Untitled Abstract: No abstract text available Text: Multiadapters RE933-05 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 mm (173 mil) - pins: 24 - hole dia 1.00 mm - size 18.50 x 23.50 mm	Original	PDF	RE933-05
TSSOP56 Abstract: RE933-10 Text: TSSOP56 Adapter thin shrink small outline package RE933-10 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 56 - hole dia 1.00 mm - size 27.00 x 39.50 mm	Original	PDF	TSSOP56 RE933-10 RE933-10
Untitled Abstract: No abstract text available Text: Multiadapters RE933-07 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 mm (240 mil) - pins: 32 - hole dia 1.00 mm - size 23.50 x 25.50 mm	Original	PDF	RE933-07
RE933-04 Abstract: RE933-03 RE933-08 RE933-10 Text: TSSOP-SMD Multiadaptador thin shrink small outline package RE933 - epóxido FR4 1,50 mm, por dos lados 35 µm CU (pth) - lado de soldadura y de componentes con na superficie de oro químico y una máscara inhibidora de soldadura - agujeros Ø 1,00 mm - adaptador para 10 TSSOP diferentes	Original	PDF	RE933 RE933-01 RE933-02 RE933-03 RE933-04 RE933-05 RE933-06 RE933-07 RE933-08 RE933-09 RE933-04 RE933-03 RE933-08 RE933-10

tSSOP28 Abstract: TSSOP28 package 173-MIL solder stop mask Text: TSSOP28 Adapter thin shrink small outline package RE933-06 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 mm (173 mil) - pins: 28 - hole dia 1.00 mm - size 21.00 x 23.50 mm	Original	PDF	TSSOP28 RE933-06 TSSOP28 package 173-MIL solder stop mask
RE933-04 Abstract: RE933-03 RE933-08 RE933-10 Text: TSSOP-SMD Multiadapter thin shrink small outline package RE933 - Epoxydglashartgewebe FR4 1,50 mm, zweiseitig 35 µm CU (durchkontaktiert) - Löt- und Komponentenseite mit einer Oberfläche aus chem. AU und Lötstoppmaske - Lochdurchmesser 1,00 mm - Adaptionsplatine für 10 verschiedene TSSOP	Original	PDF	RE933 RE933-01 RE933-02 RE933-03 RE933-04 RE933-05 RE933-06 RE933-07 RE933-08 RE933-09 RE933-04 RE933-03 RE933-08 RE933-10
RE933-03 Abstract: RE933-04 RE933-08 RE933-10 0.5 mm pitch TSSOP Text: TSSOP-SMD Multiadapter thin shrink small outline package RE933 - FR4 EPOXY fibre-glass 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - hole dia 1.00 mm - adapter for 10 differents TSSOP - pitch 0.65 mm / 0.50 mm	Original	PDF	RE933 RE933-01 RE933-02 RE933-03 RE933-04 RE933-05 RE933-06 RE933-07 RE933-08 RE933-09 RE933-03 RE933-04 RE933-08 RE933-10 0.5 mm pitch TSSOP
RE933-03 Abstract: 173MIL Text: Multiadapters RE933-03 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 16 - hole dia 1.00 mm - size 13.50 x 23.50 mm	Original	PDF	RE933-03 RE933-03 173MIL
RE933-08 Abstract: No abstract text available Text: Multiadapters RE933-08 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (173 mil) - pins: 38 - hole dia 1.00 mm - size 28.50 x 23.50 mm	Original	PDF	RE933-08 RE933-08
RE933-04 Abstract: No abstract text available Text: Multiadapters RE933-04 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 20 - hole dia 1.00 mm - size 16.00 x 23.50 mm	Original	PDF	RE933-04 RE933-04
RE933-10 Abstract: No abstract text available Text: Multiadapters RE933-10 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 56 - hole dia 1.00 mm - size 27.00 x 39.50 mm	Original	PDF	RE933-10 RE933-10
RE933-03 Abstract: TSSOP16 TSSOP16 datasheet Text: TSSOP16 Adapter thin shrink small outline package RE933-03 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 16 - hole dia 1.00 mm - size 13.50 x 23.50 mm	Original	PDF	TSSOP16 RE933-03 RE933-03 TSSOP16 datasheet
tssop24 Abstract: tssop24 datasheet Text: TSSOP24 Adapter thin shrink small outline package RE933-05 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 mm (173 mil) - pins: 24 - hole dia 1.00 mm - size 18.50 x 23.50 mm	Original	PDF	TSSOP24 RE933-05 tssop24 datasheet
solder stop mask Abstract: RE931 Text: Stock No.: RE931 Stock No.: RE931 SSOP-SMD Multiadapter shrink small outline package - pitch 0,65 mm / 0,635 mm - Epoxy fibre glass FR 4 1.5 mm double-sided 35 µm CU - plated through holes 1.00 mm Ø - adapter for 7 different SSOP Pitch (mm) 0,65 0,65 0,65	Original	PDF	RE931 RE932 RE932n solder stop mask RE931

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RE933 Price and Stock

Roth Elecronik GmbH RE933

Roth Elecronik GmbH RE933-05

Roth Elecronik GmbH RE933-03

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RE933 Datasheets Context Search

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RE933-04

TSSOP8

TSSOP48

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TSSOP14

TSSOP20

TSSOP32

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TSSOP56

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RE933-04

tSSOP28

RE933-04

RE933-03

RE933-03

RE933-08

RE933-04

RE933-10

RE933-03

tssop24

solder stop mask