Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint for reflow soldering of RDBS27P package 2 SOT878-1 1 27 1 2.54 26 hole diameter min. 0.92 2 ∅ 0.08 M Dimensions in mm SOT878-1_fr PDF sot878-1_fr Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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RDBS27P
OT878-1
OT878-1
sot878-1
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Untitled
Abstract: No abstract text available
Text: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads non-concave SOT462-2 Dh x D Eh view B: mounting base side A2 d B j E Q A L c 1 e2 13 e1 Z bp e L1 w M 5 v M 10 mm scale DIMENSIONS (mm are the original dimensions)
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RDBS13P:
OT462-2
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sot462
Abstract: No abstract text available
Text: PDF: 1999 Dec 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e v M L1 w M bp 5 10 mm scale
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RDBS13P:
OT462-1
OT462-1
sot462
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RDBS17P
Abstract: sot668
Text: PDF: 2001 Jan 05 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL reverse bent power package; 17 leads (row spacing 2.54 mm) SOT668-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A Q L c 17 1 e1 Z w M bp e L1
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RDBS17P:
OT668-2
RDBS17P
sot668
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RDBS17P
Abstract: sot577
Text: PDF: 2001 Jan 05 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads row spacing 2.54 mm SOT577-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L 1 e2 17 e1 Z w M bp e c v M 5 Q L1 10 mm
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RDBS17P:
OT577-2
RDBS17P
sot577
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Untitled
Abstract: No abstract text available
Text: Package outline RDBS23P: plastic rectangular-DIL-bent-SIL reverse bent power package; 23 leads (row spacing 2.54 mm) SOT889-1 non-concave D Dh x Eh view B: mounting base side d A2 β A5 A4 B j E E1 A L 1 c 23 e2 Q e1 Z w M bp e v M L1 5 10 mm scale DIMENSIONS (mm are the original dimensions)
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RDBS23P:
OT889-1
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Untitled
Abstract: No abstract text available
Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E Q A L c 1 e2 13 e1 Z e L1 w M bp 5 v M 10 mm scale
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RDBS13P:
OT462-2
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Untitled
Abstract: No abstract text available
Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions
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RDBS13P:
OT528-2
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Untitled
Abstract: No abstract text available
Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e v M L1 w M bp 5 10 mm scale
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RDBS13P:
OT462-1
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SOT889-1
Abstract: RDBS23P sot889
Text: Package outline Philips Semiconductors RDBS23P: plastic rectangular-DIL-bent-SIL reverse bent power package; 23 leads (row spacing 2.54 mm) SOT889-1 non-concave D Dh x Eh view B: mounting base side d A2 β A5 A4 B j E E1 A L 1 c 23 e2 Q e1 Z w M bp e v M
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RDBS23P:
OT889-1
SOT889-1
RDBS23P
sot889
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Untitled
Abstract: No abstract text available
Text: PDF: 2000 Mar 16 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e v M L1 w M bp 5 10 mm scale
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RDBS13P:
OT462-1
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SOT462-2
Abstract: sot462
Text: PDF: 2000 Oct 19 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e L1 w M bp 5 v M 10 mm scale
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RDBS13P:
OT462-2
SOT462-2
sot462
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LC7074M
Abstract: DIP18 LA2230 LC7074
Text: Ordering number:ENN4789 CMOS IC LC7074, 7074M Synchronous Error Correction IC for RDS Applications Overview Package Dimensions The LC7074 and the LC7074M are ICs for the RDS radio data system implemented by the EBU (European Broadcasting Union) and the RDBS (radio broadcast data system) implemented by the NRSC (National Radio System
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ENN4789
LC7074,
7074M
LC7074
LC7074M
LA2230
LC7074/M
DIP18
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Untitled
Abstract: No abstract text available
Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-1 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 Q c 13 1 e1 Z e v M w M bp 5 L1 10 mm scale DIMENSIONS mm are the original dimensions
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RDBS13P:
OT528-1
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Untitled
Abstract: No abstract text available
Text: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-1 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 Q c 13 1 e1 Z e v M w M bp 5 L1 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A2
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RDBS13P:
OT528-1
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Untitled
Abstract: No abstract text available
Text: Package outline RDBS17P: plastic rectangular-DIL-bent-SIL reverse bent power package; 17 leads (row spacing 2.54 mm) non-concave SOT668-2 Dh x D Eh view B: mounting base side A2 d B j E A Q L c 17 1 e1 Z w M bp e L1 5 e2 v M 10 mm scale DIMENSIONS (mm are the original dimensions)
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RDBS17P:
OT668-2
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Untitled
Abstract: No abstract text available
Text: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A2
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RDBS13P:
OT528-2
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RDBS17P
Abstract: No abstract text available
Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads row spacing 2.54 mm SOT577-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L 1 e1 Z w M bp e c e2 17 v M 5 Q L1 10 mm
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RDBS17P:
OT577-2
RDBS17P
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RDBS17P
Abstract: No abstract text available
Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL reverse bent power package; 17 leads (row spacing 2.54 mm) SOT668-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A Q L c 17 1 e1 Z w M bp e L1
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RDBS17P:
OT668-2
RDBS17P
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RDBS27P
Abstract: SOT-878 sot878
Text: Package outline Philips Semiconductors RDBS27P: plastic rectangular-DIL-bent-SIL reverse bent power package; 27 leads (row spacing 2.54 mm) SOT878-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L 1 27 c e1 Z e2 Q e w bp v L1 M 10 M 20 mm
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RDBS27P:
OT878-1
RDBS27P
SOT-878
sot878
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Untitled
Abstract: No abstract text available
Text: Package outline RDBS27P: plastic rectangular-DIL-bent-SIL reverse bent power package; 27 leads (row spacing 2.54 mm) SOT920-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L 1 27 c e1 Z e2 Q e w bp v L1 M 10 M 20 mm scale DIMENSIONS (mm are the original dimensions)
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RDBS27P:
OT920-1
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Untitled
Abstract: No abstract text available
Text: Package outline RDBS27P: plastic rectangular-DIL-bent-SIL reverse bent power package; 27 leads (row spacing 2.54 mm) SOT878-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A 1 L 27 c e1 Z e2 Q e w bp v L1 M 10 M 20 mm scale Dimensions (mm are the original dimensions)
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RDBS27P:
OT878-2
sot878-2
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Untitled
Abstract: No abstract text available
Text: Package outline RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads row spacing 2.54 mm SOT577-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L 1 e1 Z w M bp e c e2 17 v M 5 Q L1 10 mm scale DIMENSIONS (mm are the original dimensions)
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RDBS17P:
OT577-2
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SOT577-1
Abstract: RDBS17P sot577
Text: PDF: 2000 Mar 16 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads row pitch 2.54 mm SOT577-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L 1 e2 17 e1 Z w M bp e Q c v M L1 5 10 mm
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RDBS17P:
OT577-1
SOT577-1
RDBS17P
sot577
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