Untitled
Abstract: No abstract text available
Text: QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP FPT-208P-M04 208-pin plastic QFP (FPT-208P-M04) Lead pitch 0.50 mm Package width x package length 28.0 × 28.0 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-208P-M04
208-pin
FPT-208P-M04)
F208020S-c-3-4
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FPT-256P-M09
Abstract: No abstract text available
Text: QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M09 EIAJ code : P-FQFP256-28 x 28-0.40 256-pin plastic QFP FPT-256P-M09 256-pin plastic QFP (FPT-256P-M09) Lead pitch 0.40 mm Package width × package length 28.0 × 28.0 mm Lead shape
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FPT-256P-M09
P-FQFP256-28
256-pin
FPT-256P-M09)
F256025S-c-2-2
FPT-256P-M09
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100P6S-A
Abstract: LQFP100-P-1414-0 LQFP128-P-1420-0 QFP100-P-1420-0 128P6Q-A
Text: Renesas microcomputers M16C / 62P Group Package Dimensions SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Package Dimensions MMP 100P6S-A EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material Alloy 42 MD e JEDEC Code –
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16-BIT
100P6S-A
QFP100-P-1420-0
100pin
1420mm
LQFP100-P-1414-0
1414mm
100P6Q-A
128pin
100P6S-A
LQFP128-P-1420-0
128P6Q-A
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100P6S-A
Abstract: QFP100-P-1420-0
Text: Under development This document is under development and its contents are subject to change. M16C/6N5 Group Package Dimension Package Dimension 100P6S-A MMP EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material
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M16C/6N5
100P6S-A
QFP100-P-1420-0
100pin
1420mm
100P6S-A
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100P6S-A
Abstract: QFP100-P-1420-0
Text: Under development This document is under development and its contents are subject to change. M16C/6N4 Group Package Dimension Package Dimension 100P6S-A MMP EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material
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M16C/6N4
100P6S-A
QFP100-P-1420-0
100pin
1420mm
100P6S-A
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3525A
Abstract: 136-pin LA-3525A-1 QFP package weight la-3525a
Text: UNIT : mm 335±1.0 59.5±0.5 216±0.5 24±0.5 27±0.5 54±0.1 180±1.0 A' A 126±0.5 42±0.1 PPE 38 22±0.5 HEAT PROOF NEC LA-3525A-1 38 SECTION A-A' 38 5.8 4.5 8.8 27.3 Applied Package Quantity pcs 120-Pin Plastic QFP (3.7mm thick) 136-Pin Plastic QFP (3.7mm thick)
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LA-3525A-1
136-Pin
120-Pin
160-Pin
208-Pin
3525A
LA-3525A-1
QFP package weight
la-3525a
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QFP64-P-1414-0
Abstract: SDIP64-P-750-1
Text: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 49 b2 64 ME D 1 48 I2 HE E Recommended Mount Pad Symbol A A1 A2 b c D
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64P6N-A
64pin
1414mm
QFP64-P-1414-0
64P4B
LQFP64-P-1414-0
SDIP64-P-750-1
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QFP64-P-1414-0
Abstract: SDIP64-P-750-1 3804 f
Text: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 64 b2 ME D 49 1 I2 48 Recommended Mount Pad HE E Symbol 33 16 A 32 L1
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64P6N-A
64pin
1414mm
QFP64-P-1414-0
64P4B
750mil
SDIP64-P-750-1
3804 f
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MO-235 FOOTPRINT
Abstract: die bond MO-235 SC-100 JEDEC 784-pin QFP PACKAGE thermal resistance LFPAK footprint mo204 ED-7311-15 fcBGA PACKAGE thermal resistance jc
Text: Products LQFP Low Profile Quad Flat Package High reliability, Standard Lead type Packages with rich line-ups • High pin-count, ideal for high-functionality, high-I/Ocount LSIs • Small size, allowing high-density mounting • Thin QFP LQFP with package mounting height of
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SC-100
MO-235
MO-235 FOOTPRINT
die bond
MO-235
SC-100 JEDEC
784-pin
QFP PACKAGE thermal resistance
LFPAK footprint
mo204
ED-7311-15
fcBGA PACKAGE thermal resistance jc
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PCI1510ZGU
Abstract: 82365SL PCI1510 PCI1510GGU PCI1510PGE PCI1510PGEG4 TPS2211A QFP Package 144 lead
Text: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package
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PCI1510
SLLA229
144-terminal
209-terminal
16-bit
TPS2211A
PCI1510ZGU
82365SL
PCI1510GGU
PCI1510PGE
PCI1510PGEG4
QFP Package 144 lead
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82365SL
Abstract: PCI1510 PCI1510GGU PCI1510GVF PCI1510PGE PCI1510PGEG4 PCI1510ZGU TPS2211A MTQF017A
Text: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package
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PCI1510
SLLA229
144-terminal
209-terminal
16-bit
TPS2211A
82365SL
PCI1510GGU
PCI1510GVF
PCI1510PGE
PCI1510PGEG4
PCI1510ZGU
MTQF017A
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SLLA229
Abstract: No abstract text available
Text: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package
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PCI1510
SLLA229
144-terminal
209-terminal
16-bit
TPS2211A
SLLA229
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144-TERMINAL
Abstract: 82365SL PCI1510 PCI1510GGU PCI1510PGE PCI1510PGEG4 PCI1510ZGU TPS2211A
Text: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package
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PCI1510
SLLA229
144-terminal
209-terminal
16-bit
TPS2211A
82365SL
PCI1510GGU
PCI1510PGE
PCI1510PGEG4
PCI1510ZGU
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MD 202
Abstract: 100P6S-A LQFP100-P-1414-0 QFP100-P-1420-0 MEB2 JEDEC Code
Text: Mitsubishi microcomputers M16C / 62 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER MMP 100P6S-A EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material Alloy 42 MD e JEDEC Code – 81 1 b2 100 ME HD D 80 I2 Recommended Mount Pad
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16-BIT
100P6S-A
QFP100-P-1420-0
100pin
1420mm
LQFP100-P-1414-0
1414mm
100P6Q-A
MD 202
100P6S-A
MEB2
JEDEC Code
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315HZ
Abstract: Teac head Dolby NR LCT-7001 CXA2559Q CXA2560Q CXA2561Q F120 MTT150 A-bex TCC-130
Text: CXA2559Q Playback Equalizer Amplifier with Music Sensor Description The CXA2559Q is an IC designed for use in car stereo cassette decks. Functions include playback equalizer amplifier and music sensor into a single chip. Features • Few external parts • Small package 40-pin QFP
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CXA2559Q
CXA2559Q
40-pin
CXA2561Q)
CXA2560Q)
40PIN
QFP-40P-L01
QFP040-P-0707
315HZ
Teac head
Dolby NR
LCT-7001
CXA2560Q
CXA2561Q
F120
MTT150
A-bex TCC-130
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Untitled
Abstract: No abstract text available
Text: 80S6 Metal seal 80pin 14✕20mm body QFP EIAJ Package Code – Weight g JEDEC Code – 19.2±0.2 14±0.2 65 65 24 41 +0.05 0.127 –0.02 25 0.8±0.2 40 0.38TYP 64 1 41 24 0.75TYP 64 20±0.2 1 80 25.2±0.2 80 40 25 3.17±0.5 Mar.’98
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80pin
38TYP
75TYP
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Untitled
Abstract: No abstract text available
Text: TA1360AFG TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA1360AFG YCbCr/YPbPr Signal and Sync Processor for Digital TV, Progressive Scan TV and Double Scan TV The TA1360AFG integrates an analog component signal YCbCr/YPbPr processor and sync processor in a 80-pin QFP plastic package. The IC is
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TA1360AFG
TA1360AFG
80-pin
525I/60,
625I/50,
525P/60,
625P/50,
1125I/50,
1125I/60,
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QFP208-P-2828-0
Abstract: No abstract text available
Text: 208P6Y-E Plastic 208pin 28✕28mm body QFP EIAJ Package Code QFP208-P-2828-0.50 Weight g 5.48 Lead Material Cu Alloy MD e JEDEC Code – b2 208 157 1 ME HD D 156 I2 Recommended Mount Pad 52 HE E Symbol 105 53 104 A L1 F b A1 c A2 e x M y L Detail F A A1 A2
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208P6Y-E
208pin
QFP208-P-2828-0
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QFP208-P-2828-0
Abstract: 208P6G-A
Text: 208P6G-A Plastic 208pin 28✕28mm body QFP EIAJ Package Code QFP208-P-2828-0.50 Weight g 4.61 Lead Material Alloy 42 MD e JEDEC Code – HD 208 ME D b2 157 1 156 I2 52 HE E Recommended Mount Pad Symbol 105 53 104 A L1 F A1 c A2 e b y L Detail F A A1 A2 b
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208P6G-A
208pin
QFP208-P-2828-0
208P6G-A
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QFP160-P-2424-0
Abstract: QFP160
Text: 160P6E-A Plastic 160pin 24✕24mm body QFP Weight g 3.39 JEDEC Code – Lead Material Alloy 42 MD e EIAJ Package Code QFP160-P-2424-0.50 160 b2 ME HD D 121 1 120 I2 HE E Recommended Mount Pad Symbol 81 40 41 80 A L1 F A1 c A2 e b y L Detail F A A1 A2 b c
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160P6E-A
160pin
QFP160-P-2424-0
QFP160
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UEI 15 SP 020
Abstract: 691 OHD 3 - 115 M VMUX to3a SAA7140A SAA7140B new 60 ypf UEI 20 SP 010
Text: Philips Semiconductors Objective specification High Performance Scaler HPS CONTENTS 1 FEATURES SAA7140A; SAA7140B 14 PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 3 ORDERING INFORMATION
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SAA7140A)
SAA7140B)
16-bit
SAA7140A;
SAA7140B
UEI 15 SP 020
691 OHD 3 - 115 M
VMUX
to3a
SAA7140A
SAA7140B
new 60 ypf
UEI 20 SP 010
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UEI 20 SP 010
Abstract: bord SAA7140A SAA7140B FEY G4 LQFP128 VR029 SAA7196 t3044 UL705
Text: Philips Semiconductors Objective specification High Performance Scaler HPS CONTENTS SAA7140A; SAA7140B 14 PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 1 FEATURES 2 GENERAL DESCRIPTION
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SAA7140A;
SAA7140B
SAA7140A)
SAA7140B)
711062b
UEI 20 SP 010
bord
SAA7140A
SAA7140B
FEY G4
LQFP128
VR029
SAA7196
t3044
UL705
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T02I
Abstract: HP 1121 G1 SAA7140A SAA7140B TT 2222 Horizontal Output voltage horizontal prescaling LQFP128 SAA7140 VR029 VR07 135
Text: Philips Semiconductors Objective specification SAA 7140 A; SAA 7140 B High Performance Scaler HPS CONTENTS PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 1 FEATURES 2 GENERAL DESCRIPTION
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SAA7140A;
SAA7140B
SAA7140A)
SAA7140B)
7110fl5fci
T02I
HP 1121 G1
SAA7140A
SAA7140B
TT 2222 Horizontal Output voltage
horizontal prescaling
LQFP128
SAA7140
VR029
VR07 135
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weight
Abstract: PLCC weight
Text: Package Outlines - Integrated Circuits Dimensions in mm 68-Pin PLCC Package Weight approx. 4.8 g 61 W rnjiJTi 10 -e 26 JUUUUUULTT 27 -2 5 * I 44-Pin PLCC Package Weight approx. 2.5 g 80-Pin QFP Plastic Package Weight approx. 1.61 g - 2 3 x 0 .8 = 18.4- 65 EE
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68-Pin
44-Pin
80-Pin
16-Pin
14-Pin
O-116
OT-89A
O-92UA
O-202
weight
PLCC weight
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