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    QFP 100 SOCKET Search Results

    QFP 100 SOCKET Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB15SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB15SKT0-000 D-Subminiature (DB15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD15SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD15SK-000 High-Density D-Subminiature (HD15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB50SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB50SKT0-000 D-Subminiature (DB50 Female D-Sub) Connector, 50-Position Socket Contacts, Solder-Cup Terminals Datasheet

    QFP 100 SOCKET Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    100P6S-A

    Abstract: 100p6s PCA4687A 100-PIN
    Text: PCA4687A Converter for Connecting 100-pin 0.65mm-pitch QFP to 100-pin 0.65mm-pitch LCC Function The PCA4687A is a board for converting 100-pin 0.65mm-pitch QFP 100P6S-A to 100-pin 0.65mm-pitch LCC (100D0). Application Solder an MCU housed in the 100-pin 0.65mm-pitch QFP


    Original     		PDF PCA4687A 100-pin 65mm-pitch 100-pin PCA4687A 65mm-pitch 100P6S-A) 100P6S-A 100p6s

    QFP-100

    Abstract: QFP100 MB2132-465 l/QFP100
    Text: PREFACE Thank you for purchasing the QFP-100 *1 Probe Cable <NQPACK version> (MB2132-465). The QFP-100 Probe Cable is used to connect an emulator for F2MC (*2)-16LX to a user system. This manual explains the handling and operation of the QFP-100 Probe Cable <NQPACK version>


    Original     		PDF QFP-100 MB2132-465) QFP-100 -16LX MB2132-465. HQPACK100RB179 NQPACK100RB QFP100 MB2132-465 l/QFP100

    F2MC-16LX

    Abstract: QFP-100
    Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-44003-2E F2MC-16LX QFP-100 PROBE CABLE NQPACK VERSION MB2132-465 OPERATION MANUAL PREFACE Thank you for purchasing the QFP-100 *1 Probe Cable (NQPACK version) (MB2132-465). The QFP-100 Probe Cable is used to connect an emulator for F2MC *2 -16LX to a user system.


    Original     		PDF SS01-44003-2E F2MC-16LX QFP-100 MB2132-465 QFP-100 MB2132-465) -16LX MB2136-465) F2MC-16LX

    NQPACK100RB179-A

    Abstract: QFP-100 F2MC-16LX MB2132-464 QFP100 NQPACK 100RB179-A
    Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-44010-1E F2MC-16LX QFP-100 PROBE CABLE NQPACK VERSION MB2132-464 OPERATION MANUAL PREFACE Thank you for purchasing the QFP-100*1 Probe Cable (NQPACK version) (MB2132-464). The QFP-100 Probe Cable is used to connect an F2MC*2-16LX family emulator to a user system.


    Original     		PDF SS01-44010-1E F2MC-16LX QFP-100 MB2132-464 MB2132-464) 2-16LX NQPACK100RB179-A F2MC-16LX MB2132-464 QFP100 NQPACK 100RB179-A

    100P6S-A

    Abstract: 100p6s 64-pin qfp 80p6n LCC 18 Pin Package 80d0
    Text: SEAL100FP Sealed Conversion Board for Converting from 100-pin 0.65mm-pitch QFP 100P6S-A or LCC (100D0) to 100-pin Standard Pitch Function The SEAL100FP is a board for converting the foot pattern of an MCU with a 100-pin 0.65mm-pitch QFP (100P6S-A) or LCC


    Original     		PDF SEAL100FP 100-pin 65mm-pitch 100P6S-A) 100D0) SEAL100FP 100P6S-A 100p6s 64-pin qfp 80p6n LCC 18 Pin Package 80d0

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 96-100M65 36000M65 -or96-100M65-P 100-PGM13071-30

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 96-100M65 Allor96-100M65-P 100-PGM13071-30

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 96-100M65 UNor96-100M65-P 100-PGM13071-30

    Untitled

    Abstract: No abstract text available
    Text: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 95-100I25 Allr95-100I25-P 100-PGM13069-30

    100-PGM13069-30

    Abstract: No abstract text available
    Text: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 95-100I25 UNr95-100I25-P 100-PGM13069-30

    ASTM-B16-85

    Abstract: No abstract text available
    Text: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 95-100I25 95-100I25 -or95-100I25-P 100-PGM13069-30 ASTM-B16-85

    IC198-100-2000

    Abstract: IC198-100-2001
    Text: IC198 Series SMT Quad Flat Package (QFP) - 100 pins 100 Pins QFP - (25 x 25 pins) 0.5 mm pitch Socket Dimensions Specifications Current Rating: Rated Voltage: Contact Resistance: 0.3 A 50V DC 30mΩ max. at 10mA and 20mV max. Insulation Resistance: 500MΩ min. at 500V DC


    Original     		PDF IC198 250Veff UL94V-0) IC198-100-2000 IC198-100-2001 IC198-100-2000 IC198-100-2001

    ASTM-B16-85

    Abstract: No abstract text available
    Text: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 96-100M65 96-100M65 -or96-100M65-P 100-PGM13071-30 ASTM-B16-85

    ASTM-B16-85

    Abstract: No abstract text available
    Text: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 95-100I25 95-100I25 -or95-100I25-P 100-PGM13069-30 ASTM-B16-85

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 96-100M65 360cify -or96-100M65-P 100-PGM13071-30

    ASTM-B16-85

    Abstract: MIL-T-10727 QQN-290
    Text: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 95-100I25 95-100I25 -or95-100I25-P 100-PGM13069-30 ASTM-B16-85 MIL-T-10727 QQN-290

    ASTM-B16-85

    Abstract: MIL-T-10727
    Text: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 96-100M65 96-100M65 -or96-100M65-P 100-PGM13071-30 ASTM-B16-85 MIL-T-10727

    Untitled

    Abstract: No abstract text available
    Text: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 95-100I25 100-PGM13069-30

    IC198-1000-1000

    Abstract: IC198-1000-1001
    Text: IC198A Series SMT Quad Flat Package (QFP) - Low Inductance 100 Pins QFP - (20 x 30 pins) 0.65 mm pitch Socket Dimensions Specifications Current Rating: Rated Voltage: Contact Resistance: 0.3 A 50V DC 30mΩ max. at 10mA and 20mV max. Insulation Resistance:


    Original     		PDF IC198A 125Veff UL94V-0) IC198-1000-1000 IC198-1000-1001

    B4402

    Abstract: xeltek sa636 SA675 SA248 SA663 xeltek sa663 SA684 sa245a sa683 sa673
    Text: Xeltek Inc. : Socket Adapter: QFP 1 #QFP44 Page 1 of 4 E Advanced search Socket Adapter: QFP(1) Back to Socket Adapter page SuperPro 3000U SuperPro 3000U-100 SuperPro 3000U Cluster SuperPro 580U SuperPro 280U SA:QFPN8 Part # BottomPCB W*L(mm) Pitch Pin #


    Original     		PDF QFP44 3000U 3000U-100 3000U SA683 9000U SA684 QFN20 QFP64 S625A B4402 xeltek sa636 SA675 SA248 SA663 xeltek sa663 SA684 sa245a sa683 sa673

    telephone KEYPAD

    Abstract: telephone hybrid cordless phone circuit telephone handset pin RJ11 rj11 telephone Z87000 Z8700000TSC ENCODER "Development Kit" Z8700001ZCO
    Text: Z8700001ZCO CP95WRL0703 CUSTOMER PROCUREMENT SPECIFICATION Z8700001ZCO Z87000 DEVELOPMENT KIT FEATURES • Supported Devices Packages 100-Pin QFP 84-Pin PLCC 44-Pin QFP 44-Pin PLCC ■ Evaluation Programming/Emulation Z8700016FSC N/A Z8700016VSC N/A Z8701016FSC


    Original     		PDF Z8700001ZCO CP95WRL0703 Z87000 100-Pin 84-Pin 44-Pin Z8700016FSC Z8700016VSC telephone KEYPAD telephone hybrid cordless phone circuit telephone handset pin RJ11 rj11 telephone Z8700000TSC ENCODER "Development Kit" Z8700001ZCO

    telephone hybrid

    Abstract: telephone KEYPAD Z87000 Z8700000TSC Z8700000ZEM Z8700001ZCO Z8700016FSC Z8700016VSC Z87010 Z8701016FSC
    Text: Z8700001ZCO CP95WRL0703 CUSTOMER PROCUREMENT SPECIFICATION Z8700001ZCO Z87000 DEVELOPMENT KIT FEATURES • Supported Devices Packages 100-Pin QFP 84-Pin PLCC 44-Pin QFP 44-Pin PLCC ■ Evaluation Programming/Emulation Z8700016FSC N/A Z8700016VSC N/A Z8701016FSC


    Original     		PDF Z8700001ZCO CP95WRL0703 Z87000 100-Pin 84-Pin 44-Pin Z8700016FSC Z8700016VSC telephone hybrid telephone KEYPAD Z8700000TSC Z8700000ZEM Z8700001ZCO Z8700016FSC Z8700016VSC Z87010 Z8701016FSC

    100p6s

    Abstract: 100P6S-A
    Text: M3T-DUMMY100S Dummy IC for 100-pin 0.65mm-pitch QFP 100P6S-A, 100P6S-E Dimensions Function This accessory tool connects the probe of an emulation pod and the target, or an MCU and the target. Its dimensions are the same as those of the MCU for the 100-pin 0.65mm-pitch QFP (100P6S, 100P6S-E)


    Original     		PDF M3T-DUMMY100S 100-pin 65mm-pitch 100P6S-A, 100P6S-E) 100P6S, M3T-DUMMY100S 100p6s 100P6S-A

    socket Yamaichi IC201

    Abstract: IC201 IC201-1004-008
    Text: QFP- PC Board Layouts IC200 to IC248 Series Top View from Socket Recommended PC Board Layouts Reference Only QFP IC201-1004-008 (100 Pins) QFP IC201-1004-050 (100 Pins) 34.67±0.05 28.67+0.05 29.59±0.05 5 - 0.65x29=18.85±0.1 29.59±0.05 QFP IC201-1004-016 (100 Pins)


    OCR Scan     		PDF IC200 IC248 IC201-1004-008 IC201-1004-050 IC201-1004-016 65x29 IC216-1004-001 IC201-1004-028 IC201-1204-017 socket Yamaichi IC201 IC201 IC201-1004-008