Untitled
Abstract: No abstract text available
Text: VG111 The Communications Edge TM • MTTF > 100 years GND GND GND GND VA CTRL 2 1 28 GND 27 GND Amp GND 10 26 GND RF IN 11 25 RF OUT GND 12 24 GND Variable Attenuator 23 GND GND 14 22 GND 15 16 17 18 19 20 21 N/C • 6x6 mm 28-pin QFN package 3 GND 9 GND 13
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VG111
28-pin
VG111
dyn800-WJ1-4401
VG111"
1-800-WJ1-4401
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variable inductor 17 18
Abstract: No abstract text available
Text: VG101 The Communications Edge TM Cellular-band Variable Gain Amplifier • MTTF > 100 years GND GND GND VA CTRL GND GND 2 1 28 GND 27 GND Amp GND 10 26 GND RF IN 11 25 RF OUT GND 12 24 GND Variable Attenuator 23 GND GND 14 22 GND 15 16 17 18 19 20 21 GND • 6x6 mm 28-pin QFN package
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VG101
28-pin
VG101
1-800-WJ1-4401
VG101"
variable inductor 17 18
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CHL8228G
Abstract: CHL8228G-00CRT CHL8228 CHL8225G-00CRT qfn 8x8 reel CHL822 qfn 52 6x6 A/sh 40/085/21/QFN-6x6
Text: CHL8225G/8G Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN packages APPLICATIONS Multiphase GPU systems The CHL8225G/8G provides extensive OVP, UVP, OCP and OTP fault protection and includes thermistor based
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CHL8225G/8G
200kHz
CHL8225G
CHL8228G
CHL8228G-00CRT
CHL8228
CHL8225G-00CRT
qfn 8x8 reel
CHL822
qfn 52 6x6
A/sh 40/085/21/QFN-6x6
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Untitled
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
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CHL8228G-00CRT
Abstract: No abstract text available
Text: CHL8225G/8G Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN, MSL2 package APPLICATIONS Multiphase GPU systems The CHL8225G/8G provides extensive OVP, UVP, OCP and OTP fault protection and includes thermistor based
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CHL8225G/8G
40-pin
56-pin
CHL8225G/8G
CHL8228G
CHL8228G
CHL8228G-00CRT
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tray qfn 6x6
Abstract: tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5
Text: Supertex Packaging Specifications Suffix Package Type B1 B2 FB FG FG FG FG GA GA K1 K1 K2 K4 K4 K5 K6 K6 K6 K6 K6 K6 K6 K6 K6 K6 K7 K7 K7 K7 K7 K7 LG L / LL MG MG N2 N3 N3 N5 N8 NG NG P P P P PG PG PG PG PJ PJ PJ SG T TG WG WG WG WG 26L BCC 84L BCC+ 64B FCBGA
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O-236AB
OT-23)
OT-23
O-220
O-252
OT-223
QFN00/Reel
490/Tray
tray qfn 6x6
tqfp 7x7 tray
QFN tray 5x5
QFN tray
QFn Package tray
QFN tray qfn 4x4
QFN tray 4x4
LQFP Package tray
6x6 TRAY
tray QFN 5x5
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Untitled
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
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QFN leadframe
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
QFN leadframe
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AK08D300-CLCC
Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
AK08D300-CLCC
AK08D300-LFCSP2X3 .5mm
AK08D300-LFCSP3x3 .5mm
AK08D300-MLP.65mm
AK10D300-8SON .65mm
MLP 3X3
MLP 4X4
AK22D300-DFN
AK24D300-LLP
MLP 5X5
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NP364
Abstract: QFN11T032-003 QFN11T048-008 QFN11T040-006 QFN 56 7x7 0.5 NP445-048-001 NP445-064-002 NP364-01649 QFN11T032-004 NP445-032-003
Text: QFN Quad Flat Non-leaded Packages TH Sockets - Open Top and Clamshell Types SMT Devices Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp.Range: Contact Force: 10,000MΩ min. at 100V DC 500V AC for 1 minute 30mΩ max. at 10mA/20mV max.
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10mA/20mV
NP445
NP364
QFN11T040-005
QFN11T040-006
QFN11T048-005
QFN11T048-008
QFN11T048-008
A101121-001
NP364
QFN11T032-003
QFN11T040-006
QFN 56 7x7 0.5
NP445-048-001
NP445-064-002
NP364-01649
QFN11T032-004
NP445-032-003
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Untitled
Abstract: No abstract text available
Text: Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, QFN packages APPLICATIONS Intel VR12 & AMD® SVI based systems High Performance Desktops CPU VRs Value Servers CPU & DDR Memory VRs ISEN_L2 3.3V +10%/-15% supply voltage; 0ºC to 85ºC
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200kHz
CHL8103/04/13)
CHL8102/03/04/13
CHL8103/04/13
CHL8104
CHL8103)
CHL8103/4
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PIC18F45K22
Abstract: PIC18F46K22 pic18f25k22 PIC18F26k22 PIC18F23K22 PIC18F67K22 40 pin PIC18F46K22 Pic18f24k22 DS41398 PIC18LF46K22
Text: PIC18F “K22” Family of Microcontrollers Broadest Line of Low Power, 5V 8-bit MCUs Summary The nanoWatt XLP PIC18F “K22” Flash Family of microcontrollers offer all of the advantages of the well recognized PIC18F High Performance MCUs; C compiler optimized architecture and an industry leading peripheral
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PIC18F
PIC18F
12-bit
com/PIC18K22
DS41438A
DS41438A*
PIC18F45K22
PIC18F46K22
pic18f25k22
PIC18F26k22
PIC18F23K22
PIC18F67K22
40 pin PIC18F46K22
Pic18f24k22
DS41398
PIC18LF46K22
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Untitled
Abstract: No abstract text available
Text: Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, QFN packages APPLICATIONS Intel VR12 & AMD® SVI based systems High Performance Desktops CPU VRs Value Servers CPU & DDR Memory VRs ISEN_L2 3.3V +10%/-15% supply voltage; 0ºC to 85ºC
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200kHz
CHL8103/04/13)
CHL8102/03/04/13
CHL8103/04/13
CHL8104
CHL8103)
CHL8103/4
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Untitled
Abstract: No abstract text available
Text: Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, QFN packages APPLICATIONS Intel VR12 & AMD® SVI based systems High Performance Desktops CPU VRs Value Servers CPU & DDR Memory VRs 40 39 38 37 36 ISEN_L2 3.3V +10%/-15% supply voltage; 0ºC to 85ºC
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CHL8103/04/13)
200kHz
CHL8103/4
CHL8104
CHL8103)
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Untitled
Abstract: No abstract text available
Text: CHL8225G/8G Digital Multi-Phase Buck Controller FEATURES DESCRIPTION APPLICATIONS • Multiphase GPU systems RCSP IRTN1 ISEN1 IRTN2 ISEN2 IRTN3 ISEN3 IRTN4 ISEN4 IRTN5 ISEN5 PIN DIAGRAM 40 39 38 37 36 35 34 33 32 31 1 30 ISEN6 Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN
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CHL8225G/8G
40-pin
56-pin
CHL8225G/8G
CHL8225G
CHL8228G
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Untitled
Abstract: No abstract text available
Text: 36 Pin to 40 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
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6MM-40
AK40D600-TSOP
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VG111-PCB1900
Abstract: MOTOROLA TRANSISTOR JESD22-A114 MMBT2222 VG111 VG111-PCB2100 QFN-6x6 package capacitor 22 pf DNP
Text: VG111 The Communications Edge TM PCS/UMTS-band Variable Gain Amplifier Applications GND 5 GND 6 GND Vctrl 7 GND GND The VG111 is a PCS / UMTS-band high dynamic range variable gain amplifier VGA packaged in a 6x6 mm surface-mount package. The +22 dBm output
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VG111
VG111
1-800-WJ1-4401
VG111-PCB1900
MOTOROLA TRANSISTOR
JESD22-A114
MMBT2222
VG111-PCB2100
QFN-6x6 package
capacitor 22 pf DNP
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QFN "100 pin" PACKAGE
Abstract: JEDEC qfn tape QFN 3x4 SOT23 JEDEC standard orientation MP transistor SOIC16 SOIC24 SOIC28 TSSOP16 TSSOP28
Text: Tape & Reel Packaging for Automated Handling The Future of Analog IC Technology General Overview Surface mount products are available in Tape & Reel packaging. Below is a table of standard Tape & Reel configurations. These packages conform to EIA-481-1/2/3 and JEDEC standards. All products are lead
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EIA-481-1/2/3
TSOT23
QFN "100 pin" PACKAGE
JEDEC qfn tape
QFN 3x4
SOT23 JEDEC standard orientation
MP transistor
SOIC16
SOIC24
SOIC28
TSSOP16
TSSOP28
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TG2H214220-FL
Abstract: TGA2572 TGA2573 lte transceiver TGA2540-FL TQM963014 TGA2517 TQM6M9069 TQP6M9002 TQM7M5013
Text: Product Selection Guide Choose TriQuint’s Innovative RF Solutions Connecting the Digital World to the Global Network Welcome to Our Product Selection Guide Table of Contents About TriQuint Semiconductor.3 Guide by Market Automotive. 4
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P1050-QJ
Abstract: No abstract text available
Text: 7.1 - 8.5 GHz Linear Power Amplifier 6x6mm QFN P1050-QJ June 2008 - Rev 06-Jun-08 Features 16 dB Small Signal Gain 49 dBm Third Order Intercept Point OIP3 Integrated Power Detector 6x6mm QFN Package, RoHS Compliant 100% RF Testing General Description The XP1050-QJ is a packaged linear power amplifier
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06-Jun-08
P1050-QJ
XP1050-QJ
P1050-QJ
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Untitled
Abstract: No abstract text available
Text: 7.1 - 8.5 GHz Linear Power Amplifier 6x6mm QFN P1050-QJ August 2008 - Rev 18-Aug-08 Features 16 dB Small Signal Gain 49 dBm Third Order Intercept Point OIP3 Integrated Power Detector 6x6mm QFN Package, RoHS Compliant 100% RF Testing General Description The XP1050-QJ is a packaged linear power amplifier
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18-Aug-08
P1050-QJ
XP1050-QJ
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1000-pin bga 0,8 mm
Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
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Unit2607
REJ01K0003-0300
1000-pin bga 0,8 mm
HQFP1414-64
HLQFP 176 Package
BGA and QFP Package mounting
HLQFP1414-100
MO-235 FOOTPRINT
QFN 64 8x8 footprint
footprint WSON
LFPAK footprint Renesas
"General Catalog"
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Untitled
Abstract: No abstract text available
Text: 7.1 - 8.5 GHz Linear Power Amplifier 6x6mm QFN P1050-QJ October 2008 - Rev 01-Oct-08 Features 14.5 dB Small Signal Gain 49 dBm Third Order Intercept Point OIP3 Integrated Power Detector 6x6mm QFN Package, RoHS Compliant 100% RF Testing General Description
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01-Oct-08
P1050-QJ
XP1050-QJ
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CHV2710-QJ
Abstract: CHV2710-QJ-0G00 CHV2710-QJ-0G0T PB-CHV2710-0000 RO4003
Text: 2.5 GHz InGaP HBT 5W Linear Power Amplifier CHV2710-QJ August 2007 - Rev 30-Aug-07 Features Internal Pre-matching Single Supply operation, 12V Power Gain 9 dB ESD Protection on board Current Control for multiple applications 2.5% EVM @ 29 dBm avg power, 802.16 OFDM
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CHV2710-QJ
30-Aug-07
CHV2710
CHV2710-QJ
CHV2710-QJ-0G00
CHV2710-QJ-0G0T
PB-CHV2710-0000
RO4003
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