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    PROCESS 51 Search Results

    PROCESS 51 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60BFG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP64-1414-0.80-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63BUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP52-1010-0.65-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS62AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP44-P-1010-0.80A Visit Toshiba Electronic Devices & Storage Corporation
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    PROCESS 51 Price and Stock

    ADLINK Technology Inc Core i5-7500T Processor 2.7GHz LGA1151

    CPU - Central Processing Units CPU, Core i5-7500T, 2.70GHz, 4-Core, 6MB SmartCache, Kaby Lake, CM8067702868115 SR337, Step:B0, MM# 953003
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics Core i5-7500T Processor 2.7GHz LGA1151
    • 1 $329.84
    • 10 $315.89
    • 100 $308.93
    • 1000 $308.93
    • 10000 $308.93
    		Get Quote

    ADLINK Technology Inc CPU i7-7700 Processor 3.6GHz LGA1151

    CPU - Central Processing Units CPU, Core i7-7700, 3.60GHz, 4-Core, 8MB SmartCache, Kaby Lake, CM8067702868314 SR338, Step:B0, MM# 953004
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics CPU i7-7700 Processor 3.6GHz LGA1151
    • 1 $480.85
    • 10 $466.38
    • 100 $466.38
    • 1000 $466.38
    • 10000 $466.38
    		Get Quote

    PROCESS 51 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    a1va

    Abstract: honeywell tdc manual temperature controller honeywell udc 1000
    Text: L 51-52-03-13 2/97 Page 1 of 12 UDC 6300 Process Controller and Process Indicator Specification Overview The UDC 6300 is our top-of-theline, stand-alone Process Controller. This price-performance leader combines unparalleled functionality and performance with


    Original     		PDF

    CPD05

    Abstract: 1N4001 1N3611 1N3614 1N4007 1N4245 1N4249 1N5059 1N5062 1N5391
    Text: PROCESS CPD05 General Purpose Rectifier 1 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 51 x 51 MILS Die Thickness 10.2 MILS Anode Bonding Pad Area 36 x 36 MILS Top Side Metalization Ni/Au - 5,000Å/2,000Å Back Side Metalization


    Original     		PDF CPD05 1N3611 1N3614 1N4001 1N4007 1N4245 1N4249 1N5059 1N5062 1N5391 CPD05 1N3614 1N4007 1N4249 1N5062

    BSW68

    Abstract: AG TRANSISTOR BUY49S CP349 chip die npn transistor
    Text: PROCESS CP349 Power Transistor NPN- High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 51 x 51 MILS Die Thickness 9.1 MILS Base Bonding Pad Area 7.9 x 15.7 MILS Emitter Bonding Pad Area 7.9 x 15.7 MILS Top Side Metalization Al - 30,000Å


    Original     		PDF CP349 BUY49S BSW68 BSW68 AG TRANSISTOR BUY49S CP349 chip die npn transistor

    CPD24

    Abstract: datasheet 1N4937 1N4933 1N4937 1N4942 1N4948 1N5615 1N5623 CMR1F-02M DIE CHIP 51
    Text: PROCESS CPD24 Fast Recovery Rectifier 1 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 51 x 51 MILS Die Thickness 11 MILS Anode Bonding Pad Area 35 x 35 MILS Top Side Metalization Ni/Au - 5,000Å/2,000Å Back Side Metalization


    Original     		PDF CPD24 1N4933 1N4937 1N4942 1N4948 1N5615 1N5623 CMR1F-02M 29-April CPD24 datasheet 1N4937 1N4937 1N4948 1N5623 DIE CHIP 51

    CMR1U-01M

    Abstract: UF4007 CMR1U-01 CPD16 UES1001 UES1003
    Text: PROCESS CPD16 Ultra Fast Rectifier 1 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 51 x 51 MILS Die Thickness 14 MILS Anode Bonding Pad Area 34 x 34 MILS Top Side Metalization Ni/Au - 5,000Å/2,000Å Back Side Metalization


    Original     		PDF CPD16 UES1001 UES1003 UF4001 UF4007 CMR1U-01 CMR1U-01M 22-March UF4007 CPD16 UES1003

    mil 43

    Abstract: process 65 die process information process 88
    Text: Section 6 Bipolar Transistor Dice Process 03 . 6-4 Process 05 . 6-4


    Original     		PDF

    transistor 2N3563

    Abstract: 2n3819 cross reference 2SK30 2SA726 2sk41e 2SC1026 transistor 2sc1417 2Sa1026 2SC2259 BC150 transistor
    Text: Section 1 Cross Reference Guide . 1-3 Process Selection Guides Preferred Part Numbers by Process .


    Original     		PDF

    PCN9915

    Abstract: EPF10K50V "lot Code" altera EPF10K
    Text: PROCESS CHANGE NOTIFICATION EPF10K50V DEVICE PROCESS TRANSITION Altera’s EPF10K50V devices will transition from a 0.30-micron triple metal layer to a 0.30-micron quad metal layer process using the same equipment and process flow. These devices will be pin-, function-, timing-, and programming file-compatible with existing


    Original     		PDF EPF10K50V 30-micron EPF10K50V PCN9915 "lot Code" altera EPF10K

    Untitled

    Abstract: No abstract text available
    Text: 9 Micron Metal Gate CMOS Process Process parameters Table 1: Features • Metal Gate Process • 13 µm Metal Pitch 9 µm Units • 16 Volts Maximum Operating Voltage Metal pitch width/space 8/5 µm • Simple Process (7 masks) Contact 8x8 µm • Very Short Cycle Time


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 9 Micron Metal Gate CMOS Process Process parameters Table 1: Features • Metal Gate Process • 13 µm Metal Pitch 9 µm Units • 16 Volts Maximum Operating Voltage Metal pitch width/space 8/5 µm • Simple Process (7 masks) Contact 8x8 µm • Very Short Cycle Time


    Original     		PDF

    CS1D-PA207R

    Abstract: No abstract text available
    Text: PLC-based Process Control Series Programmable Controllers CS1W-LC Loop Control Boards/Units Ver. 3.0 Version Upgrade CS1D-CPU P CS1D Process CPU Units (for Duplex-CPU Systems) WS02-LCTC1-EV5 CX-Process Tool Ver. 5.0 (Version Upgrade) CS1W-P Process Analog I/O Units 8-input Models Added to Series


    Original     		PDF WS02-LCTC1-EV5 16-input NL-2132 CS1D-PA207R

    water tank LOGIC CONTROL PLC

    Abstract: ABB automation controller Manual ABB master pt100 multiplexer heat exchanger process Water tank level control system based on PLC PID controller for temperature control PID controller Control master CM series ABB TECHNICAL CM30
    Text: Data sheet DS/CM30–EN Rev. E ControlMaster CM30 Universal process controller, 1/4 DIN Making process control easy Comprehensive display of process status — Crystal-clear, full-color TFT display — User-customizable — Historical trending Powerful control functionality


    Original     		PDF DS/CM30 water tank LOGIC CONTROL PLC ABB automation controller Manual ABB master pt100 multiplexer heat exchanger process Water tank level control system based on PLC PID controller for temperature control PID controller Control master CM series ABB TECHNICAL CM30

    ABB automation controller Manual ABB master

    Abstract: water tank LOGIC CONTROL PLC file for WATER LEVEL CONTROLLER history ABB TECHNICAL CM30 PID controller Control master CM series dosing pump Automatic water tank level controller
    Text: Data sheet DS/CM30–EN Rev. F ControlMaster CM30 Universal process controller, 1/4 DIN Making process control easy Comprehensive display of process status — Crystal-clear, full-color TFT display — User-customizable — Historical trending Powerful control functionality


    Original     		PDF DS/CM30 3KXC403001R1001 ABB automation controller Manual ABB master water tank LOGIC CONTROL PLC file for WATER LEVEL CONTROLLER history ABB TECHNICAL CM30 PID controller Control master CM series dosing pump Automatic water tank level controller

    81F64842B

    Abstract: No abstract text available
    Text: Introduction This document outlines Atmel’s process for conversion from FPGA/CPLD to ULC. Figure 1. ULC Conversion Flow Process FPGA/CPLD Netlist Retarget ULC Conversion Process Design & Supply Rules Verification Bonding Creation & Verification Scan, Bist, Jtag Insertion, ATPG Fault Coverage


    Original     		PDF 03-Dec-01 81F64842B

    5075MM

    Abstract: No abstract text available
    Text: Issued March 1999 232-5115 Data Pack A Data Sheet Statistical process control data processor and instruments Introduction Statistical process control SPC is a key concept for enhancing quality control and can achieve significant improvements in product quality.


    Original     		PDF 200ms 5075MM

    XH035

    Abstract: CMOS Process Family XH035 cmos process family passive inductor process 0.6 um cmos process 0.35 um CMOS gate area
    Text: 0.35 µm CMOS Process Family XH035 RF CMOS Modular mixed signal 0.35 µm CMOS process with passive Main Process Flow components available for mixed-signal/RF analog applications p-/p+ epi-substrate Independent retrograde n- and p-well Spiral top thick metal inductor


    Original     		PDF XH035 CMOS Process Family XH035 cmos process family passive inductor process 0.6 um cmos process 0.35 um CMOS gate area

    cbrhdsh1-40l

    Abstract: No abstract text available
    Text: PROCESS CPD56 Schottky Rectifier 1 Amp, Low VF Schottky Barrier Rectifier Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 46 x 46 MILS Die Thickness 11.8 MILS Anode Bonding Pad Area 32 x 32 MILS Top Side Metalization Ag - 20,000A Back Side Metalization


    Original     		PDF CPD56 CBRHDSH1-40L cbrhdsh1-40l

    regulateur

    Abstract: regulateur de temperature manuel OM076
    Text: 1/32-DIN Temperature Controller Operator's Manual -DIN TEMPERATURE CONTROLLER 1 32 OPERATOR’S MANUAL Part No. 59096 Scroll Key Down key Up key INDICATORS Green: Setpoint OFF - Process Variable less than ON Flashing - Process Variable equals Setpoint - Process Variable greater than


    Original     		PDF 1/32-DIN OM076 OM076G regulateur regulateur de temperature manuel OM076

    1.2 Micron CMOS Process Family

    Abstract: No abstract text available
    Text: 1.2 Micron CMOS Process Family Process parameters Features • Double Poly / Double Metal, • 2.4 µm Poly and Metal I Pitch, • 5.5 Volts Maximum Operating Voltage, • Twin-tub process on P-type or N-type wafers, • ProToDuctionTM Option for low cost prototypes,


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    0.6 um cmos process

    Abstract: CMOS Process Family xc06 transistor parameters DSASW0041938 XC-06 "X-Fab"
    Text: 0.6 µm CMOS Process Family XC06 With Embedded EEPROM, Flash and High Voltage Options Modular 0.6 µm CMOS process with the possibility to add a Main Process Features wide variety of medium and high voltage MOS transistors, passive elements and embedded EEPROM and Flash


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    omron k3nx operating manual

    Abstract: OMRON OC 222 CH K3NX-AD1A omron k3nx K3NX-VD2A K3NX-VD1A omron* AOI K3NX
    Text: Process Meter omRon Process Meter omRon K3NX Process Meter Operation Manual Produced January 1998 iv Notice: OMRON products are manufactured for use according to proper procedures by a qualified operator and only for the purposes described in this manual.


    OCR Scan     		PDF N90-E1-1 N90-E1-1 0198-2M omron k3nx operating manual OMRON OC 222 CH K3NX-AD1A omron k3nx K3NX-VD2A K3NX-VD1A omron* AOI K3NX

    Untitled

    Abstract: No abstract text available
    Text: CMOS SRAM KM684000A Family 512Kx8 bit High Speed CMOS Static RAM FEATURE SUMMARY GENERAL DESCRIPTION • Process Technology : 0.4 urn CMOS The KM684000A family is fabricated by SAMSUNG'S advanced CMOS process technology. The family • Organization : 512K x8


    OCR Scan     		PDF KM684000A 512Kx8 32-DIP, 32-SOP, 32-TSOP D23bSfl 7TL4142 0G23bSc

    TSOP 173 g

    Abstract: KM684000ALG-7 4000 CMOS KM684000ALGI-7L KM684000ALP-7L KM684000ALP-5L KM684000A KM684000AL KM684000ALI KM684000ALI-L
    Text: i, CMOS SRAM KM684000A Family 512Kx8 bit High Speed CMOS Static RAM FEATURE SUMMARY GENERAL DESCRIPTION • Process Technology: 0.4 um CMOS The KM684000A family is fabricated by SAMSUNG'S advanced CMOS process technology. The family • Organization : 512K x8


    OCR Scan     		PDF KM684000A 512Kx8 32-DIP, 32-SOP, 32-TSOP 71b4142 DD23bST TSOP 173 g KM684000ALG-7 4000 CMOS KM684000ALGI-7L KM684000ALP-7L KM684000ALP-5L KM684000AL KM684000ALI KM684000ALI-L

    Untitled

    Abstract: No abstract text available
    Text: PROCESS TIMER Low-cost Time Monitor Philips Technologies, Cheshire, CT USA Part Number Series T77240 The Airpax Process Timer is a single input digital instrument designed to offer fast response, high precision measurements of process times. It displays the time required


    OCR Scan     		PDF T77240