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    PLASTIC MOLD PACKAGE Search Results

    PLASTIC MOLD PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PLASTIC MOLD PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PCN0602

    Abstract: sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg G700 sumitomo g700 mold compound sumitomo epoxy G700
    Text: PROCESS CHANGE NOTIFICATION PCN0602 MOLD COMPOUND CHANGE FOR CYCLONE II PQFP & TQFP PACKAGES Change Description: Altera is adopting the Sumitomo G700 series mold compound as the standard mold material on its Cyclone™ II low-k dielectric Plastic Quad Flat Pack PQFP and Plastic Thin Quad


    Original     		PDF PCN0602 E730SJ Sumitomo-G700 EME-E730SJ x10-5/ x102N/mm2 UL-94 PCN0602 sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg G700 sumitomo g700 mold compound sumitomo epoxy G700

    PCN0702

    Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
    Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line


    Original     		PDF PCN0702 PCN0702, 6300HJ G700M PCN0702 MP8000CH4 48hrs) X10-5 UL-94 SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound sumitomo G700 Tg

    PCN0516

    Abstract: G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo
    Text: PROCESS CHANGE NOTIFICATION PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES Change Description: Altera is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array PBGA packaged devices. Devices in 225, 256, and 672 pin PBGA


    Original     		PDF PCN0516 x10-5/C x102N/mm2 UL-94 1X10E12 PCN0516 G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo

    low noise hemt transistor

    Abstract: MGF4714CP InGaAs HEMT mitsubishi
    Text: MITSUBISHI SEMICONDUCTOR GaAs FET MGF4714CP PLASTIC MOLD PACKAGED LOW NOISE InGaAs HEMT DESCRIPTION The MGF4714CP low-noise HEMT High Electron Mobility OUTLINE DRAWING Unit:millimeters (0.6 Transistor) is designed for use in L to Ku band amplifiers. 1 The plastic mold package offer high cost performance, and has a


    Original     		PDF MGF4714CP MGF4714CP 12GHz low noise hemt transistor InGaAs HEMT mitsubishi

    Untitled

    Abstract: No abstract text available
    Text: AU K CORP. Photo Transistor KDT3001A Description The KDT3001A is a high-sensitivity NPN silicon phototransistor mounted in 3mm T-1 all plastic mold type. Pin Connection 1. Emitter 2. Collector Features 3mm(T-1) all plastic mold type Colorless transparency lens


    Original     		PDF KDT3001A KDT3001A 000lux,

    container

    Abstract: No abstract text available
    Text: PLASTIC TUBE DIMENSIONS 2. PLASTIC TUBE CONTAINER DIMENSIONS DIP, SDIP, DMP, SDMP, SOP packages can pack in the plastic tube container the dimensions are mentioned as follows. • PLASTIC TUBE CONTAINER FOR DUAL IN LINE PLASTIC MOLD PACKAGE Plastic Tube Container for DIP16, SDIP22pin


    Original     		PDF DIP16, SDIP22pin 494mm 25pcs/tube 508mm 20pcs/tube 505mm DIP20pin SDIP24pin container

    Untitled

    Abstract: No abstract text available
    Text: AUK CORP. Photo Transistor KDT3001A Description The KDT3001A is a high-sensitivity NPN silicon phototransistor mounted in Φ 3mm T-1 all plastic mold type. Pin Connection 1. Emitter 2. Collector Features Φ3mm(T-1) all plastic mold type Colorless transparency lens


    Original     		PDF KDT3001A KDT3001A 000lux,

    DIP18

    Abstract: DIP20 TO-220F-4
    Text: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as follows. 1. Plastic Tube Container for dual-in-line plastic mold


    Original     		PDF 50pcs/tube DIP14/16 DIP14 25pcs/tube DIP16 25ype) O-220F O-220F-4 DIP18 DIP20 TO-220F-4

    EMP24-E3

    Abstract: EMP20-E2 DIP18 DIP20 702 mini transistor 25PCS
    Text: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as follows. 1. Plastic Tube Container for dual-in-line plastic mold


    Original     		PDF 50pcs/tube DIP14/16 DIP14 25pcs/tube DIP16 25ype) O-220F O-220F-4 EMP24-E3 EMP20-E2 DIP18 DIP20 702 mini transistor 25PCS

    DIP18

    Abstract: DIP20
    Text: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as follows. 1. Plastic Tube Container for dual-in-line plastic mold


    Original     		PDF 50pcs/tube DIP14/16 DIP14 25pcs/tube DIP16 25ype) O-220F O-220F-4 DIP18 DIP20

    DIP18

    Abstract: DIP20 DIP40 702 mini transistor
    Text: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as fillows. 1. Plastic Tube Container for dual-in-line plastic mold


    Original     		PDF 50pcs/tube DIP14/16 O-220F O-220F-4 25pcs/tube PLCC28-M2 DIP18 DIP20 DIP40 702 mini transistor

    A2ND

    Abstract: KELD001
    Text: NEW PRODUCT Infrared Emitting Diode GaAs KELD001 Description The KELD001, high-power GaAs IRED mounted in a 2nd Mold package, is compact, and easy to mount. Features - Compact - Side-looking with plastic package - RoHS Compliance - Small 2nd Mold Package


    Original     		PDF KELD001 KELD001, A2ND KELD001

    QFJ032-P-R450-2

    Abstract: No abstract text available
    Text: PLASTIC LEADED CHIP CARRIER 32 PIN PLASTIC LCC-32P-M02 EIAJ code : ∗QFJ032-P-R450-2 32-pin plastic QFJ PLCC Lead pitch 50mil Package width x package length 450 × 550mil Lead shape J bend Sealing method Plastic mold (LCC-32P-M02) 32-pin plastic QFJ (PLCC)


    Original     		PDF LCC-32P-M02 QFJ032-P-R450-2 50mil 550mil 32-pin LCC-32P-M02) QFJ032-P-R450-2

    BGA-320P-M06

    Abstract: No abstract text available
    Text: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 320 PIN PLASTIC BGA-320P-M06 320-pin plastic PBGA Lead pitch 1.27 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.46 mm Max


    Original     		PDF BGA-320P-M06 320-pin BGA-320P-M06) BGA320006S-c-2-1 BGA-320P-M06

    MA 17358

    Abstract: B/TDA 16840
    Text: O K I electronic components KGF1312_ Power FET for UHF-Band Frequencies Plastic Mold Type GENERAL DESCRIPTION The KGF1312, housed in an SOT-89 type plastic-mold package, is a discrete UHF band power FET that features high efficiency and high output power. The KGF1312 specifications are


    OCR Scan     		PDF KGF1312_ KGF1312, OT-89 KGF1312 KGF1312 72M2MD L724240 MA 17358 B/TDA 16840

    Untitled

    Abstract: No abstract text available
    Text: O K I electronic components KGF1323 Power FET for UHF-Band and PCS Frequencies Plastic Mold Type GENERAL DESCRIPTION The KGF1323, housed in an SOT-89 type plastic-mold package, is a discrete UHF-band power FET that features high efficiency and high output power. The KGF1323 specifications are


    OCR Scan     		PDF KGF1323 KGF1323, OT-89 KGF1323 resi061 2424D 0QE27T7 0Q227T6

    GM 2310 A

    Abstract: low noise hemt transistor MGF4714CP L to Ku GAAS L to Ku band amplifiers transistor GC 40103 HEMT
    Text: MITSUBISHI SEMICONDUCTOR GaAs FET MGF4714CP PLASTIC MOLD PACKAGED LOW NOISE InGaAs HEMT DESCRIPTION The MGF4714CP OUTLINE DRAWING low-noise HEMT(High Electron Unit:m illim eters Mobility Transistor) is designed for use in L to Ku band amplifiers. The plastic mold package offer high cost performance, and has a


    OCR Scan     		PDF MGF4714CP MGF4714CP 12GHz GD-22 GM 2310 A low noise hemt transistor L to Ku GAAS L to Ku band amplifiers transistor GC 40103 HEMT

    Untitled

    Abstract: No abstract text available
    Text: O K I electronic components KGF1283_ Power FET for UHF-Band and PCS Frequencies Plastic Mold Type GENERAL DESCRIPTION The KGF1283, housed in an SOT-89 type plastic-mold package, is a discrete UHF-band power FET that features high efficiency, high output power, and high gain. The KGF1283 specifications


    OCR Scan     		PDF KGF1283_ KGF1283, OT-89 KGF1283 b724240 KGF1283 b72424D

    c 1181 H

    Abstract: lD-10mA
    Text: MITSUBISHI SEMICONDUCTOR GaAs F ET MGF4714CP PLASTIC MOLD PACKAGED LOW NOISE InGaAs HEMT DESCRIPTION T he M GF4714CP OUTLINE DRAWING low-noise HEMT(High Electron Unit:millimeters Mobility T ransistor) is designed for use in L to Ku band amplifiers. T he plastic mold package offer high cost performance, and has a


    OCR Scan     		PDF MGF4714CP GF4714CP GD-22 c 1181 H lD-10mA

    Untitled

    Abstract: No abstract text available
    Text: O K I electronic components KGF1313 Power FET for UHF-Band and PCS Frequencies Plastic Mold Type GENERAL DESCRIPTION The KGF1313, housed in an SOT-89 type plastic-mold package, is a discrete power FET with frequencies ranging from the UHF band to the L band. This device features high efficiency and


    OCR Scan     		PDF KGF1313 KGF1313, OT-89 KGF1313 2424D D227c

    901 704 16 08 55

    Abstract: marking S111 amplifier KGF1313 3301 dbm sot89 sot-89 marking ct 8511
    Text: O K I electronic components KGF1313 Power FET for UHF-Band and PCS Frequencies Plastic Mold Type GENERAL DESCRIPTION The KGF1313, housed in an SOT-89 type plastic-mold package, is a discrete power FET with frequencies ranging from the UHF band to the L band. This device features high efficiency and


    OCR Scan     		PDF KGF1313 KGF1313, OT-89 KGF1313 2M24G 901 704 16 08 55 marking S111 amplifier 3301 dbm sot89 sot-89 marking ct 8511

    cq 721

    Abstract: ma 17393 KGF1323 P0* DBM SOT89 T4 0660
    Text: O K I electronic components KGF1323 Power FET for UHF-Band and PCS Frequencies Plastic Mold Type G E N E R A L DESCRIPTION The KGF1323, housed in an SOT-89 type plastic-mold package, is a discrete UHF-band power FET that features high efficiency and high output power. The KGF1323 specifications are


    OCR Scan     		PDF KGF1323 KGF1323, OT-89 KGF1323 resistance90 7E424G 002E7T7 F1323 cq 721 ma 17393 P0* DBM SOT89 T4 0660

    HA 16630

    Abstract: DBM-188 171-09 KGF1284
    Text: O K I electronic components KGF1 284 Power FET for UHF-Band and PCS Frequencies Plastic Mold Type GENERAL DESCRIPTION The KGF1284, housed in an SOT-89 type plastic-mold package, is a discrete pow er FET with frequencies ranging from the U H F to the L band. This device features high efficiency, high


    OCR Scan     		PDF KGF1284 KGF1284, OT-89 KGF1284 D02277b b72M240 F1284 HA 16630 DBM-188 171-09

    819 39a

    Abstract: KGF1283 HA 17458
    Text: O K I electronic components KGF1283 _ Power FET for UHF-Band and PC S Frequencies Plastic Mold Type G EN ER A L D ESC RIPT IO N The KGF1283, housed in an SOT-89 type plastic-mold package, is a discrete UHF-band power FET that features high efficiency, high output power, and high gain. The KGF1283 specifications


    OCR Scan     		PDF KGF1283_ KGF1283, OT-89 KGF1283 227bcà KGF1283 b72M24Q 0Q2E77D 819 39a HA 17458