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    PITCH 0.4 256P Search Results

    PITCH 0.4 256P Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CYD18S18V18-167BBAXC Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    MG80960MC-25 Rochester Electronics LLC RISC Microprocessor, 32-Bit, 25MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132 Visit Rochester Electronics LLC Buy
    A82380-25 Rochester Electronics LLC Multifunction Peripheral, CHMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132 Visit Rochester Electronics LLC Buy
    A82380-20 Rochester Electronics LLC Multifunction Peripheral, CHMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132 Visit Rochester Electronics LLC Buy
    CYD18S18V18-167BBAXI Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, 4ns, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy

    PITCH 0.4 256P Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


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    PDF C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B

    432W6

    Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P


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    PDF 240K6X-A 240P6Y-A 240P6Z-A 255F7F 256F7B 256F7X-A/B 256P6J-E 256P6K-E 272F7X-A/B 281S8-C 432W6 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G

    48P4B

    Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
    Text: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P


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    PDF 240K6X-A 30S1B 42S1B-A 52S1B-B 64S1B-E 124S8 135S8-F 145S8 149S8 177S8 48P4B P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A

    S1L50552

    Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
    Text: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells


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    PDF S1L60173F00A000 S1L50552 tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon

    SH7724

    Abstract: emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239
    Text: SuperH platform brochure SH-2/SH-2A microcontrollers SH-3/SH-4A microprocessors www.renesas.eu Introduction About Renesas Electronics Corporation Renesas Electronics Corporation TSE: 6723 , the world’s number one supplier of microcontrollers, is a premier supplier of advanced


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    PDF 32-bit 19-069F SH7724 emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


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    PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    ACTEL proASIC PLUS APA450

    Abstract: Actel APA075 OB33L PQ208A APA075 APA1000 APA150 APA300 APA450 APA600
    Text: Automotive Supplement PLUS Automotive-Grade ProASIC Features and Benefits • • • High Capacity • • • • • • • • • 0.22µ 4LM Flash-based CMOS Process Live at Power-Up, Single-Chip Solution No Configuration Device Required Retains Programmed Design during


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    PDF 32-Bit ACTEL proASIC PLUS APA450 Actel APA075 OB33L PQ208A APA075 APA1000 APA150 APA300 APA450 APA600

    28x28

    Abstract: MMV3
    Text: 256-PIN PLASTIC QFP FINE PITCH (28x28) A B 192 193 129 128 detail of lead end S C D Q 256 1 R 65 64 F G H I J M P K S N S NOTE Each lead centerline is located within 0.09 mm of its true position (T.P.) at maximum material condition. L M ITEM MILLIMETERS


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    PDF 256-PIN 28x28) S256GD-40-LMV 28x28 MMV3

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


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    PDF C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow

    marking code SMD Transistor 2ak

    Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


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    PDF C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste

    AB244A

    Abstract: R488A AD9361 AK2177 CMOS-9HD UPD65891 N526A PD65891 tqfp 64 thermal resistance nec PD65881
    Text: Design Manual CMOS Gate Array, Embedded Array Package Ver. 4.0 Target Series CMOS-N5 Series CMOS-9HD Series CMOS-10HD Series EA-9HD Series Document No. A16400EJ4V0DM00 4th edition Date Published December 2004 NS CP(N) NEC Electronics Corporation 2002


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    PDF CMOS-10HD A16400EJ4V0DM00 A16400EJ4V0DM IR50-203-3-37 IR50-207-3-37 AB244A R488A AD9361 AK2177 CMOS-9HD UPD65891 N526A PD65891 tqfp 64 thermal resistance nec PD65881

    GE4F

    Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


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    PDF C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00

    EPC16U88

    Abstract: No abstract text available
    Text: Designing With High-Density BGA Packages for Altera Devices Application Note 114 December 2007, ver. 5.1 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues


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    54SX72

    Abstract: A54SX32APQ FBGA-484 A54SX16A THERMAL Fuse m20 tf 115 c PAR64 REQ64 A54SX08A A54SX16 A54SX32A
    Text: Preliminary v1.1 SX-A Family FPGAs Leading Edge Performance • Configurable I/O Support for 3.3V/5.0V PCI, LVTTL, and TTL • Configurable Weak Resistor Pullup or Pulldown for Tri-Stated Outputs at Power Up • 250 MHz System Performance • 4ns Clock-to-Out Pin-to-Pin


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    PDF

    S12237-02P

    Abstract: No abstract text available
    Text: NEWS 01 2013 ELECTRON TUBE PRODUCTS PAGE 21 From Macro to Micro OPTO-SEMICONDUCTOR PRODUCTS Photo ICs for MOST 150 Optical Link PAGE 16 ELECTRON TUBE PRODUCTS Compact 2 W Xenon Flash Lamp Modules PAGE 25 SYSTEMS PRODUCTS Digital Camera ORCA-Flash4.0 PAGE 36


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    Untitled

    Abstract: No abstract text available
    Text: Advanced v1.6  Axcelerator Family FPGAs Le adi n g- E dg e P e rfo r ma nc e • • • • 350+ MHz System Performance 500+ MHZ Internal Performance High-Performance Embedded FIFOs 700Mb/s LVDS Capable I/Os S pe ci fi c at i on s • • • • • Up to 2 Million Equivalent System Gates


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    PDF 700Mb/s 295kbits

    Untitled

    Abstract: No abstract text available
    Text: Designing With High-Density BGA Packages for Altera Devices Application Note 114 January 2014, ver. 5.2 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues


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    PDF

    schematic diagram UPS 600 Power tree

    Abstract: schematic diagram ups 600 actel silicon sculptor APA075 APA1000 APA150 APA300 APA450 APA600 APA750 JESD22
    Text: v3 .4 PLUS ProASIC TM Flash Family FPGAs Features and Benefits • • High Capacity I/O • • • • • 75,000 to 1 million System Gates 27k to 198kbits of Two-Port SRAM 66 to 712 User I/Os Reprogrammable Flash Technology • • • • 0.22µ 4LM Flash-based CMOS Process


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    PDF 198kbits schematic diagram UPS 600 Power tree schematic diagram ups 600 actel silicon sculptor APA075 APA1000 APA150 APA300 APA450 APA600 APA750 JESD22

    OB33LN

    Abstract: ProASICPLUS Flash Family FPGAs v3.3
    Text: v3.3 ProASICPLUS TM Flash Family FPGAs Features and Benefits • • High Capacity I/O • • • • • 75,000 to 1 million System Gates 27k to 198kbits of Two-Port SRAM 66 to 712 User I/Os Reprogrammable Flash Technology • • • • 0.22µ 4LM Flash-based CMOS Process


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    PDF APA075, APA150, APA300 OB33LN ProASICPLUS Flash Family FPGAs v3.3

    Untitled

    Abstract: No abstract text available
    Text: Metallized Polypropylene Film Capacitors for Switching Circuits PMC • • • • Switching capacitor for industrial controls Motor Speed Controls SMPS Resonant circuit Operating Temperature Range -40˚C to +85˚C Capacitance Tolerance Rated Voltage • Induction Heaters


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    PDF -200ppm/ 100ppm/ 300/billion

    induction heater

    Abstract: induction heater circuit 406p M6 transistor SMPS 30
    Text: Metallized Polypropylene Film Capacitors for Switching Circuits PMC • • • • Switching capacitor for industrial controls Motor Speed Controls SMPS Resonant circuit • Induction Heaters • High frequency • High current Operating Temperature Range


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    PDF 100VDC induction heater induction heater circuit 406p M6 transistor SMPS 30

    Untitled

    Abstract: No abstract text available
    Text: Metallized Polypropylene Film Capacitors for Switching Circuits PMC • • • • Switching capacitor for industrial controls Motor Speed Controls SMPS Resonant circuit • Induction Heaters • High frequency • High current Operating Temperature Range


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    PDF 100VDC

    Untitled

    Abstract: No abstract text available
    Text: Metallized Polypropylene Film Capacitors for Switching Circuits PMC • • • • • Induction Heaters • High frequency • High current Switching capacitor for industrial controls Motor Speed Controls SMPS Resonant circuit Operating Temperature Range


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    PDF 100VDC C25uF

    QN132

    Abstract: No abstract text available
    Text: Advanced v0.7 IGLOO Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Advanced I/O • • • • Low Power • • • • • • 1.2 V or 1.5 V Core Voltage for Low Power Supports Single-Voltage System Operation 5 µW Power Consumption in Flash*Freeze Mode


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    PDF 130-nm, 128exers AGL250 QN132