PITCH 0.3 QFP 256P Search Results

PITCH 0.3 QFP 256P Result Highlights (5)

Part	Manufacturer	Description
8501002YC	Rochester Electronics LLC	Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68
8501001YA	Rochester Electronics LLC	Microprocessor, 16-Bit, 8MHz, CMOS, CQFP68, CERAMIC, QFP-68
NG82370-16	Rochester Electronics LLC	Multifunction Peripheral, CMOS, PQFP100, PLASTIC, QFP-100
MQ80C196KB-12	Rochester Electronics LLC	Microcontroller, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68
TMC2081KBC	Rochester Electronics LLC	Consumer Circuit, PQFP128, METRIC, PLASTIC, QFP-128

PITCH 0.3 QFP 256P Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
NEC A39A Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES	Original	PDF	C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
432W6 Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P	Original	PDF	240K6X-A 240P6Y-A 240P6Z-A 255F7F 256F7B 256F7X-A/B 256P6J-E 256P6K-E 272F7X-A/B 281S8-C 432W6 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
marking code SMD Transistor 2ak Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written	Original	PDF	C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
S1L50552 Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon Text: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells	Original	PDF	S1L60173F00A000 S1L50552 tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
GE4F Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00 Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written	Original	PDF	C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
116-Pin Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size	Original	PDF	C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
35 x 35 PBGA, 580 100 balls Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8	Original	PDF	C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR Abstract: uPD65837 uPD65869 X17512 upd65839 RF Transistors Ceramic MARKING F25 marking code F302 535 D65841 uPD65851 X46358 Text: Design Manual CMOS-8L Family CMOS Gate Array Ver. 5.0 Document No. A12158EJ5V0DM00 5th edition Date Published June 1999 N CP(K) 1997, 1998 Printed in Japan 1 [MEMO] 2 Design Manual A12158EJ5V0DM00 NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS	Original	PDF	A12158EJ5V0DM00 Semiconductor2/9044 MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR uPD65837 uPD65869 X17512 upd65839 RF Transistors Ceramic MARKING F25 marking code F302 535 D65841 uPD65851 X46358
a1274 Abstract: A1389 OPENCAD CMOS Block library A13258E circuit diagram for simple IR robots FM11 RF 08 A1430 A13195E OSB4 A13195 Text: Design Manual CB-9 Family VX/VM Type 0.35 µm CMOS Cell-Based IC Document No. A12745EJ4V0DM00 4th edition Date Published July 2000 N CP(K) 1999 Printed in Japan [MEMO] 2 Design Manual A12745EJ4V0DM00 NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS	Original	PDF	A12745EJ4V0DM00 electricity88-6130 a1274 A1389 OPENCAD CMOS Block library A13258E circuit diagram for simple IR robots FM11 RF 08 A1430 A13195E OSB4 A13195
48P4B Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A Text: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P	Original	PDF	240K6X-A 30S1B 42S1B-A 52S1B-B 64S1B-E 124S8 135S8-F 145S8 149S8 177S8 48P4B P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
AB244A Abstract: R488A AD9361 AK2177 CMOS-9HD UPD65891 N526A PD65891 tqfp 64 thermal resistance nec PD65881 Text: Design Manual CMOS Gate Array, Embedded Array Package Ver. 4.0 Target Series CMOS-N5 Series CMOS-9HD Series CMOS-10HD Series EA-9HD Series Document No. A16400EJ4V0DM00 4th edition Date Published December 2004 NS CP(N) NEC Electronics Corporation 2002	Original	PDF	CMOS-10HD A16400EJ4V0DM00 A16400EJ4V0DM IR50-203-3-37 IR50-207-3-37 AB244A R488A AD9361 AK2177 CMOS-9HD UPD65891 N526A PD65891 tqfp 64 thermal resistance nec PD65881
A12212 Abstract: 702 sot 23 74284 MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR 364-pin A12-212 circuit diagram for simple IR robots marking h02 sot 363 RBHB RSB 7900 Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid	Original	PDF	d588-6130 A12212 702 sot 23 74284 MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR 364-pin A12-212 circuit diagram for simple IR robots marking h02 sot 363 RBHB RSB 7900
S29JL032H70 Abstract: No abstract text available Text: FUJITSU MICROELECTRONICS PRODUCT GUIDE 2009.10 Product Guide [ ASSP•Memory•ASIC ] PG00-00091-3E Technical Documentation of Electronic Devices DATA BOOK PRODUCT GUIDE DVD (GENERAL) DATA SHEET MANUAL FUJITSU SEMICONDUCTOR DATA SHEET Semiconductor Data Book	Original	PDF	PG00-00091-3E ACD-10131 CD-10131 DS04-27211-5E MB3789 S29JL032H70
EPC16U88 Abstract: No abstract text available Text: Designing With High-Density BGA Packages for Altera Devices Application Note 114 December 2007, ver. 5.1 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues	Original	PDF

0.3mm pitch csp package Abstract: 116PIN qfp 20x20 0.3mm pitch package bga Text: CSP Chip Size Package small! CSP Chip Size Package • CSP（Chip Size Package）とは？チップサイズとほぼ同じ大きさにつくることのできるパッケージを総称して「CSP」といいます。チップサイズとパッケージ外形サイズが同じものは特にリアルチップサイズタイプと呼ばれて	Original	PDF	8mm120 5mm208 C13185JJ2V0PF00 0.3mm pitch csp package 116PIN qfp 20x20 0.3mm pitch package bga
proteus Abstract: HQFP 208 pbga 144 XC4036XLA-HQ240 R4036XLA-I-160H xc4036xl-hq240i XC4013XL-PQ240C XC4013XL-HT176C xc4013xla-pq208c xc4036xlahq208 Text: FPGA Replacement for 3.3-Volt Xilinx Products Introduction Proteus is a Chip Express FPGA • replacement program. In its initial release, supplies Proteus is available as a 5-volt product family serving the needs of specific Xilinx 4000E/EX devices and a Proteus 3.3-volt	Original	PDF	4000E/EX 4000XL/XLA 1-800-95CHIPX proteus HQFP 208 pbga 144 XC4036XLA-HQ240 R4036XLA-I-160H xc4036xl-hq240i XC4013XL-PQ240C XC4013XL-HT176C xc4013xla-pq208c xc4036xlahq208
BC 1098 Abstract: EPM7384 ALTERA 68 PLCC t187 Text: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.	Original	PDF	232-pin 240-pin 100-pin 256-pin 484-pin 672-pin BC 1098 EPM7384 ALTERA 68 PLCC t187
pitch 0.4 QFP 256p Abstract: MB86292 FPT-256P-M09 MB86290A MD57 MD58 MD59 MD60 pitch 0.3 QFP 256p pitch 0.4 256p Text: FUJITSU SEMICONDUCTOR DATA SHEET DS04-31103-1E ASSP for Graphics Control Graphics Display Controller MB86292 • DESCRIPTION The MB86292 is an evolved version of the Fujitsu MB86290A graphics controller designed for use in a car navigation system or amusement equipment. The MB86292 is a graphics display controller with an on-chip	Original	PDF	DS04-31103-1E MB86292 MB86292 MB86290A pitch 0.4 QFP 256p FPT-256P-M09 MD57 MD58 MD59 MD60 pitch 0.3 QFP 256p pitch 0.4 256p
EP20K100E Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA Text: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.	Original	PDF	49-pin 169-pin EP20K100E EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Theta JC of FBGA Abstract: cpga dimensions cpga weight 84 pin plcc ic base Text: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)	Original	PDF
transistors BC 458 Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance Text: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.	Original	PDF
ms-029 Abstract: FBGA1152 Text: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)	Original	PDF
uPD95 Abstract: nec 2561 equivalent transistor tba 222 SH NEC 2561 NEC open cad pwc NEC 2561* D 431 Text: NEC NEC Electronics Inc. CB-C8 0.5-Micron CMOS Cell-Based ASIC Design Manual March 1995 Document No. 70226-1 1995 NEC Electronics lnc./Printed in U.S.A. • b427525 ÜGÔ3304 bT3 ■ ft CONTENTS CHAPTER 1 GENERAL DESCRIPTION.	OCR Scan	PDF	b427525 uPD95 nec 2561 equivalent transistor tba 222 SH NEC 2561 NEC open cad pwc NEC 2561* D 431
BTS 7246 Abstract: No abstract text available Text: Order this document by DSP56004/D Rev. 2 MOTOROLA SEMICONDUCTOR TECHNICAL DATA DSP56004 DSP56007 Symphony Audio DSP Family 24-Bit Digital Signal Processors The Symphony™ family of high-performance, programmable Digital Signal Processors DSPs is suitable for a variety of digital audio functions, including Dolby Pro Logic, ATRAC, and Lucasfilm	OCR Scan	PDF	DSP56004/D DSP56004 DSP56007 24-Bit DSP56004, DSP56004RC DSP56007, DSP56L007 80-pin BTS 7246

Privacy Settings

PITCH 0.3 QFP 256P Search Results

PITCH 0.3 QFP 256P Result Highlights (5)

PITCH 0.3 QFP 256P Datasheets Context Search

NEC A39A

432W6

marking code SMD Transistor 2ak

S1L50552

GE4F

116-Pin

35 x 35 PBGA, 580 100 balls

MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR

a1274

48P4B

AB244A

A12212

S29JL032H70

EPC16U88

0.3mm pitch csp package

proteus

BC 1098

pitch 0.4 QFP 256p

EP20K100E

Theta JC of FBGA

transistors BC 458

ms-029

uPD95

BTS 7246