Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    PARAMETERS OF FR4 SUBSTRATE WITH DIELECTRIC Search Results

    PARAMETERS OF FR4 SUBSTRATE WITH DIELECTRIC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMPM4GQF15FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP144-2020-0.50-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4GRF20FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP176-2020-0.40-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4KMFWAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4MMFWAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4NQF10FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP144-2020-0.50-002 Visit Toshiba Electronic Devices & Storage Corporation

    PARAMETERS OF FR4 SUBSTRATE WITH DIELECTRIC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Avago 9886

    Abstract: XFRV NE3210 FR4 substrate height and thickness rogers fll120 SKD-ONS-ST23-001 BFP949 Rohm Diodes
    Text: M O DE L I T HI CS EXEMPLAR LIBRARY LIBRARY USER MANUAL V11 For Agilent Technologies Advanced Design System MODELITHICS EXEMPLAR LIBRARY CONTENTS CONTENTS . 2 INSTALLATION INSTRUCTIONS . 8


    Original     		PDF com/peixun/antenna/116 //shop36920890 Avago 9886 XFRV NE3210 FR4 substrate height and thickness rogers fll120 SKD-ONS-ST23-001 BFP949 Rohm Diodes

    Untitled

    Abstract: No abstract text available
    Text: Preliminary Product Description SLX-2143 The Sirenza Microdevices’ SLX-2143 is a low noise amplifier module operating in the 1700 - 2200 MHz frequency band. This device has been optimized to serve high linearity base station applications where a high intercept point is


    Original     		PDF SLX-2143 SLX-2143 EDS-102501

    AS 108-120

    Abstract: C0603C100J5GAC C0603C103K5RAC C0603C221J5GAC SLX-2143 EDS-102501
    Text: Preliminary Product Description SLX-2143 The Sirenza Microdevices’ SLX-2143 is a low noise amplifier module operating in the 1700 - 2200 MHz frequency band. This device has been optimized to serve high linearity base station applications where a high intercept point is


    Original     		PDF SLX-2143 SLX-2143 EDS-102501 AS 108-120 C0603C100J5GAC C0603C103K5RAC C0603C221J5GAC

    Untitled

    Abstract: No abstract text available
    Text: OBSOLETE Product Description SLX-2143 The Sirenza Microdevices’ SLX-2143 is a low noise amplifier module operating in the 1700 - 2200 MHz frequency band. This device has been optimized to serve high linearity base station applications where a high intercept point is


    Original     		PDF SLX-2143 SLX-2143 EDS-102501

    Untitled

    Abstract: No abstract text available
    Text: 3 Bonding Film AF111 for Electronics Applications Technical Data Product Description March, 2004 3M Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials epoxy and phenolic .


    Original     		PDF AF111 AF111 1-1W-10,

    C0603C100J5GAC

    Abstract: C0603C103K5RAC C0603C221J5GAC SLX-2043
    Text: Preliminary Product Description SLX-2043 The Sirenza Microdevices’ SLX-2043 is a low noise amplifier module operating in the 1700 - 2200 MHz frequency band. This device has been optimized to serve high linearity basestation applications where a high intercept point is


    Original     		PDF SLX-2043 SLX-2043 EDS-102235 C0603C100J5GAC C0603C103K5RAC C0603C221J5GAC

    Untitled

    Abstract: No abstract text available
    Text: VISHAY SFERNICE www.vishay.com Film Resistors Application Note Thermal Management on SMD Thick Film Resistors DTO25, D2TO20, D2TO35 By Elyes Guezguez Vishay has completed its range of resistors using the thick film technology. After the well-known resistors RTO, LTO (TO-220


    Original     		PDF DTO25, D2TO20, D2TO35) O-220 D2TO20 O-263 D2TO35 DTO25 O-252

    sirenza LNA

    Abstract: C0603C100J5GAC C0603C103K5RAC C0603C221J5GAC SLX-2143 x10015
    Text: Preliminary Product Description SLX-2143 The Sirenza Microdevices’ SLX-2143 is a low noise amplifier module operating in the 1700 - 2200 MHz frequency band. This device has been optimized to serve high linearity base station applications where a high intercept point is


    Original     		PDF SLX-2143 SLX-2143 EDS-102501 sirenza LNA C0603C100J5GAC C0603C103K5RAC C0603C221J5GAC x10015

    uhf pcb antenna

    Abstract: UHF rfid antenna RFID loop antenna design nxp proximity antenna design NXP UCODE G2XM Types of Radar Antenna UHF RFID pcb antenna chip antenna rfid UHF FR4 substrate with dielectric constant 4.4 nxp rfid uhf transponder
    Text: AN 1715 UHF RFID PCB antenna design Rev. 3.0 – January 21 2010 Application note Document information Info Content Keywords UCODE EPC G2, G2XM, G2XL, Reference Design, Antenna Design, PCB Abstract This application note provides basic antenna knowledge, which is


    Original     		PDF

    1204 SMD resistor

    Abstract: D2TO20 metal film resistors SMD
    Text: VISHAY SFER NICE Resistive Products Application Note Thermal Management on SMD Thick Film Resistors D2TO20, D2TO35 Vishay has completed its range of resistors using the thick film technology. After the well-known resistors RTO, LTO (TO-220 packages) for application with mounting on heatsink, three new surface mounted devices SMD resistors are now available with


    Original     		PDF D2TO20, D2TO35) O-220 D2TO20 O-263/D2PAK D2TO35 D2TO35 D2TO20 O-252 1204 SMD resistor metal film resistors SMD

    "10 watt led"

    Abstract: 10 watt led 10 watt L.E.D FR4 dielectric constant vs temperature parameters of FR4 substrate with dielectric BERGQUIST XB900 imst m/L.E.D Moving Display Board
    Text: Modeling Results - Infinite Heat Sink Thermal Clad MP FR-4 Temperature °C Thermal Clad LTI Temperature (°C) Temperature (°C) > 63.654 > 63.7 > 63.7 53.991 54.025 54.025 44.327 44.35 44.35 34.664 34.675 34.675 < 25 < 25 < 25 FIGURE 6 PACKAGING CONCLUSION


    Original     		PDF ISO9001 "10 watt led" 10 watt led 10 watt L.E.D FR4 dielectric constant vs temperature parameters of FR4 substrate with dielectric BERGQUIST XB900 imst m/L.E.D Moving Display Board

    D3PAK

    Abstract: tunnel diode application to247 pcb footprint FR4 substrate height and thickness APT9503 APT4016SN "tunnel diode" chip assembly Thermalcote THE 249
    Text: APPLICATION NOTE APT9503 By Kenneth W. Dierberger and Denis R. Grafham INNOVATIVE MOUNTING TECHNIQUES ENHANCE THERMAL PERFORMANCE OF THE SURFACE-MOUNT D3 PAK PACKAGE PRESENTED AT POWERSYSTEMS WORLD INTERNATIONAL CONFERENCE & EXHIBIT SEPTEMBER 12, 1995 Page 1


    Original     		PDF APT9503 B-1330 O-247, D3PAK tunnel diode application to247 pcb footprint FR4 substrate height and thickness APT9503 APT4016SN "tunnel diode" chip assembly Thermalcote THE 249

    FR4 epoxy dielectric constant 4.4

    Abstract: FR4 substrate with dielectric constant 4.4 PCB Rogers RO4003 substrate FR4 substrate epoxy dielectric constant 4.4 FR4 substrate epoxy dielectric constant 4.6 ro4003 FR4 dielectric constant 4.3 FR4 4.9 dielectric constant FR4 dielectric constant 4.6 RO3003
    Text: HF Transmission Introduction This document deals with HF Transmission issues in high-speed and broadband applications using Atmel ADCs and DACs. It stresses the hardware choices to be made to reach an optimum tradeoff between high-speed, broadband performances and system


    Original     		PDF 352A-BDC-10/03 FR4 epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 PCB Rogers RO4003 substrate FR4 substrate epoxy dielectric constant 4.4 FR4 substrate epoxy dielectric constant 4.6 ro4003 FR4 dielectric constant 4.3 FR4 4.9 dielectric constant FR4 dielectric constant 4.6 RO3003

    RD91 triac heat sink

    Abstract: H 14 A triac sot 223 BTA16-600c equivalent bta16-600 aluminium pop rivet BTA16-600C Triac Heat Sink assembly silicon thermal grease 600c rd91 grease RD91 package
    Text: AN533 APPLICATION NOTE SCRs, TRIACs and AC switches: Thermal Management Precautions for Handling and Mounting INTRODUCTION The behaviour of a semiconductor device depends on the temperature of its silicon chip. This is why electrical parameters are given at a specified temperature.


    Original     		PDF AN533 RD91 triac heat sink H 14 A triac sot 223 BTA16-600c equivalent bta16-600 aluminium pop rivet BTA16-600C Triac Heat Sink assembly silicon thermal grease 600c rd91 grease RD91 package

    OM338

    Abstract: technical of tamura solder paste technical of tamura solder mask luxeon F1 LUXEON Rebel LED Tamura Of America tamura solder paste PROFILE 210WP tamura solder paste E38152
    Text: Application Brief AB32 LUXEON Rebel Assembly and Handling Information Introduction This application brief covers the recommended board design and assembly procedures for LUXEON® Rebel LEDs. LUXEON Rebel is a revolutionary, ultra compact, surface mount high


    Original     		PDF

    RD91 triac heat sink

    Abstract: BTA08-600SW BTA16-600C Triac Heat Sink assembly bta16-600 BTA16 rd91 grease AN533 BTB16-600C RD91
    Text: AN533 Application note SCRs, TRIACs, and AC switches, thermal management precautions for handling and mounting Introduction The behavior of a semiconductor device depends on the temperature of its silicon chip. This is why electrical parameters are given at a specified temperature.


    Original     		PDF AN533 RD91 triac heat sink BTA08-600SW BTA16-600C Triac Heat Sink assembly bta16-600 BTA16 rd91 grease AN533 BTB16-600C RD91

    FR4 1.6mm substrate

    Abstract: Thermagon t-lam CLD-AP25 Fabrication process steps mcpcb FR-4 substrate 1.6mm NEMA FR-4 led mcpcb large copper trace thermal Thermagon pcb fabrication process kapton
    Text: Optimizing PCB Thermal Performance for Cree XLamp® LEDs Table of Contents 1. Introduction. 2 2. Thermal Management Principles. 2


    Original     		PDF CLD-AP37 FR4 1.6mm substrate Thermagon t-lam CLD-AP25 Fabrication process steps mcpcb FR-4 substrate 1.6mm NEMA FR-4 led mcpcb large copper trace thermal Thermagon pcb fabrication process kapton

    HMC414

    Abstract: No abstract text available
    Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0103 HMC414MS8G PRODUCT NOTE Designing w/ The HMC414MS8G PA Utilizing a Low Cost Laminated Printed Circuit Board


    Original     		PDF HMC414MS8G HMC414

    GETEK FR4

    Abstract: FR4 dielectric constant at 2.4 Ghz Rogers 4350 r04350 FR4 substrate height and thickness FR4 dielectric constant vs temperature relative permittivity of fr4 HMC414MS8G RO4350 loss tangent of FR4
    Text: v00.0103 HMC414MS8G PRODUCT NOTE Designing w/ The HMC414MS8G PA Utilizing a Low Cost Laminated Printed Circuit Board General Description The HMC414MS8G is a high efficiency GaAs InGaP Hetrojunction Bipolar Transistor HBT MMIC power amplifier, which operates between 2.2 - 2.8 GHz. The amplifier is packaged in a low cost, surface mount 8


    Original     		PDF HMC414MS8G GETEK FR4 FR4 dielectric constant at 2.4 Ghz Rogers 4350 r04350 FR4 substrate height and thickness FR4 dielectric constant vs temperature relative permittivity of fr4 RO4350 loss tangent of FR4

    CROSS SEIKO

    Abstract: toshiba onenand ARM1176JZ-STM Baw delay line tdk cross reference wildpasstm
    Text: February 2008 NWR150 Low Insertion Loss BAW Filter for GPS Data Sheet Revision 2.4 Communication Solutions Edition 2008-02-11 Published by Infineon Technologies AG 81726 Munich, Germany 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer


    Original     		PDF NWR150 NWR150 CROSS SEIKO toshiba onenand ARM1176JZ-STM Baw delay line tdk cross reference wildpasstm

    EPSON s21 circuit diagram

    Abstract: GL-LN-22TM ARM926EJ-S C166 JESD22-A114 JESD22-A115 NWR150 R150 bandpass filter for GPS xgoldtm
    Text: May 2008 NWR150 Low Insertion BAW Filter for GPS Data Sheet Revision 2.42 Communication Solutions Edition 2008-05-06 Published by Infineon Technologies AG 81726 Munich, Germany 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or


    Original     		PDF NWR150 NWR150 EPSON s21 circuit diagram GL-LN-22TM ARM926EJ-S C166 JESD22-A114 JESD22-A115 R150 bandpass filter for GPS xgoldtm

    ltcc

    Abstract: ltcc antenna FR4 substrate with dielectric constant 4 LTCCAAB62 parameters of FR4 substrate with dielectric LTCCJHB62 ltcc chip ltcc filter ltcc antenna 9GHZ KYOCERA vco
    Text: LTCC Low Temperature Co-fired Ceramics With increasing demands for high density and miniature modules, Kyocera LTCC featuring thick film printing and multi-layer technologies offers the best fit solutions for those market demands. This LTCC is especially suited for telecom devices such as RF power amplifier, antenna


    Original     		PDF JHB62) JIB62) AAB62) ACB62) ltcc ltcc antenna FR4 substrate with dielectric constant 4 LTCCAAB62 parameters of FR4 substrate with dielectric LTCCJHB62 ltcc chip ltcc filter ltcc antenna 9GHZ KYOCERA vco

    motorola MN transistor

    Abstract: FR4 dielectric constant vs temperature AR338
    Text: AR338 METAL-BACKED BOARDS IMPROVE THERMAL PERFORMANCE OF POWER By PCIM Staff With Contributions by Herb Fick/Bergquist Company Al Pshaenich and Dave Hollander/Motorola Semiconductor Scott LindblomTexas Instruments Reprinted from Powerconversion & Intelligent Motion,


    OCR Scan     		PDF AR338 -------AR338/D AR338/D motorola MN transistor FR4 dielectric constant vs temperature AR338

    thermal PCB D2PAK

    Abstract: AR348 HTGB ERS -112 assembly motorola transistor dpak marking
    Text: AR348/D HIGHER POWER LEVELS IN SURFACE MOUNT DESIGNS Prepared By Dave Hollander Motorola Semiconductor Products Sector Phoenix, Arizona "Reprinted by permission from the September issue of Surface Mount Technology; Copyright 1990, P.O. Box 159f 17730 W. Peterson Road, Libertyville, IL 60048 U.S.A."


    OCR Scan     		PDF AR348/D OT-23 2PHX26222G-1 thermal PCB D2PAK AR348 HTGB ERS -112 assembly motorola transistor dpak marking