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    PACKAGING INFORMATION Search Results

    PACKAGING INFORMATION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGING INFORMATION Datasheets (20)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    PACKAGING INFORMATION Integrated Silicon Solution 330-mil Plastic SOP Package Code: U (28-pin) Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution Mini Ball Grid Array Package Code: M (36-pin) Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution 150-mil Plastic SOP Package Code: G, GR Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution TQFP (Thin Quad Flat Pack Package) Package Code: TQ Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution 300-mil Plastic DIP Package Code: N,P Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution LQFP (Low Profile Quad Flat Pack) Package Code: LQ (44-pin) Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution Mini Ball Grid Array Package Code: B (48-pin) Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution Ball Grid Array Package Code: B (165-pin) Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution PlasticMSOP Package Code: S Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution Plastic TSOP - 28-pins Package Code: T (Type I) Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution Plastic TSOP Package Code: T (Type II) Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution 400-mil Plastic SOJ Package Code: K Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution Plastic QFN (Quad Flat No-lead) Package Code:QF(48-pin) Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution 300-mil Plastic SOJ Package Code: J Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution 450-mil Plastic SOP Package Code: Q (32-pin) Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution Plastic Ball Grid Array Package Code: B (119-pin) Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution PQFP (Plastic Quad Flat Pack Package) Package Code: PQ Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution Mini Ball Grid Array Package Code: B (36-pin) Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution Plastic STSOP - 32 pins Package Code: H (Type I) Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution Plastic TSOP-Type I Package Code: T (32-pin) Original PDF

    PACKAGING INFORMATION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    smd code marking 56 sot23-6

    Abstract: marking code 604 SOT23-6 PD-1503 smd zG sot 23 smd marking sot23 W16 ic SMD MARKING CODE ad 5.9 ic ap 2068 PD2029 SMD MARKING ed sot23-5 MARKING CODE SMD IC sot23-5
    Text: PACKAGING Package Information Packaging & Ordering Packaging Solutions for Modern Electronic Design In addition to standard legacy packaging, Pericom leads the industry in smaller, more advanced packaging profiles and footprints for today’s designers. Our offerings include very small packages,


    Original     		PDF PI3USB412 PI74STX1GU04A PI3USBA03 PI74STX2G04 PI3USBA201 PI74STX2G14 PI5A121 PI74STX2G4245 PI5A122 smd code marking 56 sot23-6 marking code 604 SOT23-6 PD-1503 smd zG sot 23 smd marking sot23 W16 ic SMD MARKING CODE ad 5.9 ic ap 2068 PD2029 SMD MARKING ed sot23-5 MARKING CODE SMD IC sot23-5

    VARISTOr Mv

    Abstract: VARISTOR
    Text: Multilayer Technology Varistor Plus Packaging / Marking Information Packaging Information – ZV/ ZVX/ZVE/AV SMD Series . . . . . . . . . . 50 Packaging Information – ZV/AV Leaded Series . . . . . . . . . . . . . . . . . . 51 Packaging Information – MV/OV Leaded Dual Function Series . . . . . . 52


    Original     		PDF

    VQFN48

    Abstract: XE8000 SO20 SOIC20 SOIC28 tn8000 JEDEC MS-026 so20w
    Text: Technical Note TN8000.07 XE8000 Packaging Information TN8000.07 Technical Note XE8000 packaging information Rev 1 February 2006 www.semtech.com 1 Technical Note TN8000.07 XE8000 Packaging Information 1 INTRODUCTION This application note describes the packaging of XE8000 circuits.


    Original     		PDF TN8000 XE8000 000TW 000BF 000WP VQFN48 SO20 SOIC20 SOIC28 JEDEC MS-026 so20w

    sm58a

    Abstract: DO215AA EIA 481-C RGP10E DO-221
    Text: Packaging Information www.vishay.com Vishay General Semiconductor Packaging Information PACKAGING ORDERING CODE PREFERRED ANTI-STATIC PACKAGE CODE PACKAGE CODE 51 PACKAGING DESCRIPTION Bulk 52, 52T P DO-214AA SMB /DO-215AA (SMBG), 12 mm tape, 7" diameter plastic reel


    Original     		PDF DO-214AA /DO-215AA DO-218AB DO-218AB, 481-C 08-Aug-12 sm58a DO215AA EIA 481-C RGP10E DO-221

    Untitled

    Abstract: No abstract text available
    Text: Packaging Information www.vishay.com Vishay General Semiconductor Packaging Information PACKAGING ORDERING CODE ANTI-STATIC PREFERRED PACKAGE CODE PACKAGE CODE 51 PACKAGING DESCRIPTION Bulk 52, 52T P DO-214AA SMB /DO-215AA (SMBG), 12 mm tape, 7" diameter plastic reel


    Original     		PDF DO-214AA /DO-215AA DO-218AB DO-218AB, 481-C 02-Mar-15

    packaging

    Abstract: No abstract text available
    Text: Packaging and Order Information www.vishay.com Vishay Semiconductors Packaging and Order Information PACKAGING SURVEY RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the dry bag has been opened to prevent moisture absorption. TABLE 1 - PACKAGING OPTIONS OF


    Original     		PDF TEKS5400S TEKT5400S TSKS5400S BP104 BPW34 BP104S BPW34S BP104S 02-Mar-15 packaging

    do-204

    Abstract: T1 Packaging vishay
    Text: Packaging Information Vishay High Power Products Packaging Information SUMMARY CASE TYPE PACKAGING MODE PACKAGING DESCRIPTION PER T/R/B QUANTITY MOQ TO-220 Tube Anti-static plastic tubes 50 1000 TO-220FP Tube Anti-static plastic tubes 50 1000 TO-218 Tube Anti-static plastic tubes


    Original     		PDF O-220 O-220FP O-218 O-247 05-Mar-10 DO-41 DO-201 DO-204 do-204 T1 Packaging vishay

    Untitled

    Abstract: No abstract text available
    Text: Cordset Technical Information Cord & Cordset Cordset Product Coding System Cordset Packaging and Color Codes Example: 03302.63.04 Product Number Jacket Color Code Identification Numbers Packaging Code Identification Numbers CODE PACKAGING 13 60 61 63 Clamshell


    Original     		PDF

    EIA364-1000

    Abstract: EIA-540-BOAE Land Grid Array EIA chip tray
    Text: PRODUCT SPECIFICATION LAND GRID ARRAY, SINGLE CONTACT, SOLDERLESS INTERPOSER SERIES 74988, 75150 AND 75154 Series 74988 with packaging plate Series 75150 (with packaging plate) Series 75154 (shown without packaging plate) REVISION: B ECR/ECN INFORMATION: TITLE:


    Original     		PDF PS-74988-001 EIA364-91. EIA364-1000 EIA-540-BOAE Land Grid Array EIA chip tray

    EP3SE50

    Abstract: No abstract text available
    Text: Section VI. Packaging Information This section provides packaging information for the Stratix III device. • Chapter 17, Stratix III Device Packaging Information Revision History Refer to each chapter for its own specific revision history. For information on when


    Original     		PDF SIII51017-1 EP3SE50

    MEMS pressure sensor

    Abstract: mems sensor wafer sensors mems integrated sensor pressure mems sensor cost MEMS and IC advantage MEMS
    Text: 14 Nov 2006 1 3 WHAT IS AHEAD IN THE PACKAGING ROADMAP OF MEMS? Packaging of ICs goes wafer level and 3D Wafer level packaging, WLP, and 3D-packaging are the major trends in packaging of semiconductor devices. WLP converts the whole packaging process to a wafer-level


    Original     		PDF

    BGA PACKAGE thermal resistance

    Abstract: EP3SE50
    Text: Section VI. Packaging Information This section provides packaging information for the Stratix III device. • Revision History Altera Corporation Chapter 17, Stratix III Device Packaging Information Refer to each chapter for its own specific revision history. For information


    Original     		PDF SIII51017-1 pac17 BGA PACKAGE thermal resistance EP3SE50

    coto relay

    Abstract: 5v ceramic reed relay active and passive electronic components coto relay 3200 reed switch DCR test circuit coto 5V SPST Reed Relay competitor analysis, reed automatic change over switch circuit relay coto relays static relay coto
    Text: Technical & Applications Information [Relays] Reed Relay Packaging Relay packaging consists of antistatic tubes or trays depending upon relay model. Several Coto surface mount reed relays are available in Tape & Reel packaging. Listed below are the dimensions by Coto series and


    Original     		PDF

    DO-35 BLUE CATHODE

    Abstract: No abstract text available
    Text: DO-35 Tape and Reel Data DO-35 Packaging Configuration: Figure 1.0 Soabar Label Corrugated Outer Liner White Anode Red/Blue (Cathode) T50R TNR Options Kraft Paper Wound Between Layers DO-35 Packaging Information Table: Figure 2.0 DO-35 Packaging Information


    Original     		PDF DO-35 IN5225A 254x79x794 406x267x184 279x133x108 102mm DO-35 BLUE CATHODE

    240 PIN QFP ALTERA DIMENSION

    Abstract: 403-pin 304-pin dimensions bga EPM9560 pinout 4572 IC 8PIN altera flex10k 256 PIN QFP ALTERA DIMENSION
    Text: Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998 • package options • pin compatibility Advanced • design flexibility Packaging Solutions Table of Contents Advanced Packaging Solutions . . . . . . . . . . . . . . . . . . . . . .2


    Original     		PDF 100-Pin 256-Pin 484-Pin 672-Pin 225-Pin 7000S, M-GB-ALTERAPKG-01 240 PIN QFP ALTERA DIMENSION 403-pin 304-pin dimensions bga EPM9560 pinout 4572 IC 8PIN altera flex10k 256 PIN QFP ALTERA DIMENSION

    APPLICATION NOTE BpW34

    Abstract: BPW34 smd BPW34S BPW34 application note BPW34 BPW34 application BPW 34 datasheet MS21 TEMT6200FX01 TEMD1000
    Text: Packaging and Order Information Vishay Semiconductors Packaging and Order Information PACKAGING SURVEY RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the dry bag has been opened to prevent moisture absorption. The following conditions should be observed if dry boxes are


    Original     		PDF TEKS5400S TEKT5400S TSKS5400S BP104 BPW34 BP104S BPW34S 27-Aug-08 APPLICATION NOTE BpW34 BPW34 smd BPW34S BPW34 application note BPW34 BPW34 application BPW 34 datasheet MS21 TEMT6200FX01 TEMD1000

    TSSOP8

    Abstract: No abstract text available
    Text: Packaging Information Mechanical Dimensions TSSOP-8 Rev. 1.3 Aug. 2006 Unit: mm inch www.bcdsemi.com 1 Packaging Information TSSOP-8 Rev. 1.3 Aug. 2006 www.bcdsemi.com 2


    Original     		PDF

    SOT23-3

    Abstract: SOT233 sot-23-3
    Text: Packaging Information Mechanical Dimensions SOT-23-3 Rev. 1.4 Jul. 2008 Unit: mm inch www.bcdsemi.com Packaging Information SOT-23-3 Rev. 1.4 Jul. 2008 www.bcdsemi.com


    Original     		PDF OT-23-3 SOT23-3 SOT233 sot-23-3

    TO126B

    Abstract: TO-126B
    Text: Packaging Information Mechanical Dimensions TO-126B Rev. 1.3 Aug 2006 Unit: mm inch www.bcdsemi.com 1 Packaging Information TO-126B Rev. 1.3 Aug 2006 www.bcdsemi.com 2


    Original     		PDF O-126B TO126B TO-126B

    DIN 41652

    Abstract: 214642
    Text: Verpackt in Tray Verpackungseinheit 16 St. tray packaging packaging unit 16 pcs 1 Sonstige Angaben siehe 204630/Additional indications please see 204630 Verpackt in Gurt Verpackungseinheit 125 St. tape & reel packaging packaging unit 125 pcs Abspulrichtung


    Original     		PDF 204630/Additional 2768-m 37-SMD-Eurostyle 37-SMD-Eurostyle DIN 41652 214642

    Untitled

    Abstract: No abstract text available
    Text: Aluminum Electrolytic Capacitors General Information Packaging Quantities Packaging Quantities Radial lead type bulk unit: pcs Long lead Case size [mm] Axial lead type bulk Lead formed Long lead Case size [mm] Inner packaging Outer packaging 03, 04, 05, 06.3 x 5 - 7


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: VISHAY PACKAGING CODE INFORMATION T PACKAGING CODE INFORMATION PART TYPE MOQ MULTI PACKAGING TYPE PACKAGING CODE T R IM M E R S ST-22-A/B-value-A/G-W 1000 1000 TAPE AND REEL 1000 PIECES R52* ST-22-A/B-value-A/G-X 1000 1000 TAPE AND REEL 1000 PIECES R53* ST-23-A/B-vaiue-A/G-W


    OCR Scan     		PDF ST-22-A/B-value-A/G-W ST-22-A/B-value-A/G-X ST-23-A/B-vaiue-A/G-W ST-23-A/B-value-A/G-X ST-30-A-value-A/B-W ST-30-A-value-A/B-X TSM43 T11/TA11

    Untitled

    Abstract: No abstract text available
    Text: GENERAL INFORMATION LEAD TAPING AND PACKAGING LEAD TAPING AND PACKAGING OF AXIAL COMPONENTS FOR AUTOMATIC AND ROBOT INSERTION MACHINES Packaging detail T echnical term s: IEC 60286-1 A vaila ble reel 355 mm only. Reel Description Symbol Dimensions mm Component diameter


    OCR Scan     		PDF 0355mm 0500mm

    Untitled

    Abstract: No abstract text available
    Text: Packaging Information Vishay Ceramic Disc Capacitors Cera-Mite www.vishay.com 4 Document Number: 42001 Revision 02-Jan-02 Packaging Information VISHAY Vishay TAPE AND REEL PACKAGING EIA-468-A in in c h e s [m illim e te r s ] STANDARD ITEM CODE EIA OPTIONS


    OCR Scan     		PDF 02-Jan-02 EIA-468-A) 540mm] 350mm] 525mm]