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    PACKAGE THERMAL CHARACTERIZATION Search Results

    PACKAGE THERMAL CHARACTERIZATION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE THERMAL CHARACTERIZATION Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    PACKAGE THERMAL CHARACTERIZATION National Semiconductor Package Thermal Characterization Original PDF

    PACKAGE THERMAL CHARACTERIZATION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    hot wire anemometer

    Abstract: TA7802 G43-87 THE POWER OF MYTH JESD 51-7, ambient measurement FLUID level measurement kapton 5413 G30-88 G38-87 G42-88
    Text: u Chapter 5 Package Characterization CHAPTER 5 PACKAGE CHARACTERIZATION Introduction Terminology Measurement Methods Thermal Characterization Parameter ψJT Thermal Test Boards Thermal Data Reports Electrical Characterization Methodology Bond Wire Series Inductance and Resistance


    Original     		PDF

    FG676

    Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 TQ100 TQ128 TQ144 TQ176 VQ100 FG676 PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100

    Untitled

    Abstract: No abstract text available
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02

    MS-034-AAn-1

    Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002

    EIA-556-A

    Abstract: xilinx packaging label polystyrene EIA-556A
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 equipmQ100 TQ144 VQ100 EIA-556-A xilinx packaging label polystyrene EIA-556A

    ipc-sm-786A

    Abstract: No abstract text available
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 J-STD-020 ipc-sm-786A

    EFTEC-64

    Abstract: OPQ0014
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 HQ160 HQ208 HQ240 HQ304 MO-108DDI OPQ0021 143-FA OPQ0020 MO-143-GA EFTEC-64 OPQ0014

    reflow soldering profile BGA

    Abstract: FC-5312
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 FC5312 reflow soldering profile BGA FC-5312

    AUGAT DIP SOCKETS

    Abstract: No abstract text available
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Socket Manufacturers Table 1 lists manufacturers known to offer sockets for Xilinx Package types. This summary does not


    Original     		PDF Q1-02 AUGAT DIP SOCKETS

    SZZA003

    Abstract: thermal resistance of low power semiconductor
    Text: Package Thermal Characterization Methodologies Application Report 1999 Printed in U.S.A 0399 SZZA003 Package Thermal Characterization Methodologies SZZA003 March 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products


    Original     		PDF SZZA003 MIL-STD-883 SCAA022A SZZA003 thermal resistance of low power semiconductor

    TO-220 package thermal resistance

    Abstract: THM7023 Multiwatt st AN257 P432 LAYOUT Multiwatt AC00151
    Text: AN257 Application note Thermal characteristics of the Multiwatt package Introduction This Application Note provides a complete thermal characterization of the Multiwatt package multilead double TO-220 - Figure 1 . Characterization is performed according with recommendations included in the G32-86


    Original     		PDF AN257 O-220 G32-86 TO-220 package thermal resistance THM7023 Multiwatt st AN257 P432 LAYOUT Multiwatt AC00151

    38.3008

    Abstract: NCP500 ON TSOP-5 MAY sc70l
    Text: AND8080/D TSOP vs. SC70 Leadless Package Thermal Performance Prepared by David Billings ON Semiconductor Thermal Characterization Laboratory http://onsemi.com APPLICATION NOTE Introduction Leadless packages are becoming a popular method to reduce the size of a package while keeping the same silicon


    Original     		PDF AND8080/D SC70LL r14525 38.3008 NCP500 ON TSOP-5 MAY sc70l

    THM7023

    Abstract: LAYOUT Multiwatt LAYOUT Multiwatt 15 P432
    Text: APPLICATION NOTE THERMAL CHARACTERISTICS OF THE MULTIWATT PACKAGE By R. TIZIANI INTRODUCTION This Application Note provides a complete thermal characterization of the Multiwatt  package multilead double TO-220 - fig. 1 . Characterization is performed according with recomandations included in the G32-86 SEMI guideline,


    Original     		PDF O-220 G32-86 THM7023 LAYOUT Multiwatt LAYOUT Multiwatt 15 P432

    THM7023

    Abstract: LAYOUT Multiwatt P432
    Text: APPLICATION NOTE THERMAL CHARACTERISTICS OF THE MULTIWATT PACKAGE By R. T IZ IANI INTRODUCTION This Application Note provides a complete thermal characterization of the Multiwatt  package multilead double TO-220 - fig. 1 . Characterization is performed according with recomandations included in the G32-86 SEMI guideline,


    Original     		PDF O-220 G32-86 THM7023 LAYOUT Multiwatt P432

    THM7023

    Abstract: AN258 P432 transistor B42 350 15-20W AC00151
    Text: AN258 Application note Thermal characteristics of the Pentawatt & Heptawatt packages Introduction This Application Note is aimed to give a complete thermal characterization of the Heptawatt and Pentawatt package Figure 1 . Characterization is performed according with recommendations included in the G32-86


    Original     		PDF AN258 G32-86 THM7023 AN258 P432 transistor B42 350 15-20W AC00151

    Melcor peltier

    Abstract: peltier melcor Peltier element Melcor thermo peltier Melcor footprint soic28 Melcor peltier 40 peltier peltier cooler peltier application notes
    Text: MEASURING THE EFFECTS OF ENERGY FLOW ON IC PACKAGE THERMAL PERFORMANCE APPLICATION NOTE AN-160 Integrated Device Technology, Inc. By Chris Wyland ABSTRACT Heat to Air This paper is an examination of how to model PCB conduction effects when modeling IC package thermal performance.


    Original     		PDF AN-160 EIA/JESD51-1 MRL-92-TIR-2 EIA/JESD51-3 Melcor peltier peltier melcor Peltier element Melcor thermo peltier Melcor footprint soic28 Melcor peltier 40 peltier peltier cooler peltier application notes

    3b6 it manufacture

    Abstract: intel MOTHERBOARD pcb design in 100C G749 thermal solution thermal test vehicle -intel
    Text: Intel® Pentium® 4 Processor in the 423-pin Package Thermal Solution Functional Specification November 2000 Order Number: 249204-001 Intel® Pentium® 4 Processor Thermal Solution Functional Specification Date 11/00 2 Revision 1.0 ! ! ! Description Add TTV-to-CPU thermal correction factor


    Original     		PDF 423-pin 3b6 it manufacture intel MOTHERBOARD pcb design in 100C G749 thermal solution thermal test vehicle -intel

    P432

    Abstract: THM7023 AN-258 HEPTAWATT LAYOUT PENTAWATT
    Text: APPLICATION NOTE THERMAL CHARACTERISTICS OF THE PENTAWATT-HEPTAWATT PACKAGES By R. T IZ IANI INTRODUCTION This Application Note is aimed to give a complete thermal characterization of the Heptawatt and Pentawatt package fig. 1, 2 . Characterization is performed according with recomendationsincludedin theG32-86SEMI guideline,by


    Original     		PDF theG32-86SEMI P432 THM7023 AN-258 HEPTAWATT LAYOUT PENTAWATT

    BGA reflow guide

    Abstract: No abstract text available
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives


    Original     		PDF Q1-02 XAPP415 J-STD-020 BGA reflow guide

    P432

    Abstract: THM7023
    Text: APPLICATION NOTE THERMAL CHARACTERISTICS OF THE PENTAWATT-HEPTAWATT PACKAGES By R. TIZIANI INTRODUCTION This Application Note is aimed to give a complete thermal characterization of the Heptawatt and Pentawatt package fig. 1, 2 . Characterization is performed according with recomendations included in the G32-86 SEMI guideline, by


    Original     		PDF G32-86 P432 THM7023

    VRM Section of laptop Motherboard

    Abstract: heat sensor with fan cooling working laptop processor socket pin out PGA423 Acoustics Cache Intel Pentium 4 Processors G749 outline of the heat sink for Theta JC laptop motherboard circuits elements 423-pin
    Text: Intel Pentium® 4 Processor In the 423-pin Package Thermal Design Guidelines ORDER NUMBER: 249203-001 NOVEMBER, 2000 Pentium® 4 processor in the 423-pin package Thermal Design Guidelines Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF 423-pin VRM Section of laptop Motherboard heat sensor with fan cooling working laptop processor socket pin out PGA423 Acoustics Cache Intel Pentium 4 Processors G749 outline of the heat sink for Theta JC laptop motherboard circuits elements

    hand movement based fan speed control

    Abstract: FC-PGA2 370 ZIF socket design guidelines heatsink design OEM PRESSURE SILICON DIE PGA370 socket pga370
    Text: R Intel Pentium® III Processor in the FC-PGA2 Package Thermal Design Guidelines June 2001 Order Number: 249660-001 Intel® Pentium® III Processor in the FC-PGA2 Package Thermal Design Guidelines R Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF

    PACKAGE THERMAL CHARACTERIZATION

    Abstract: pcb board heat transfer thermal analysis of heat sink MS011816-3
    Text: Package Thermal Characterization Introduction Effective heat removal from the IC chip, through the package, to the adjacent environment is crucial to maintain an allowable device junction temperature. The latter directly affects the electrical circuit performance both at the


    Original     		PDF RADC-TR-86-97, PACKAGE THERMAL CHARACTERIZATION pcb board heat transfer thermal analysis of heat sink MS011816-3

    PSSO36

    Abstract: 8ohm .20W speaker
    Text: STA515 40V 3.0A QUAD POWER HALF BRIDGE 1 FEATURES Figure 1. Package „ MULTIPOWER BCD TECHNOLOGY „ MINIMUM INPUT OUTPUT PULSE WIDTH DISTORTION „ 200mΩ RdsON COMPLEMENTARY DMOS OUTPUT STAGE „ CMOS COMPATIBLE LOGIC INPUTS „ THERMAL PROTECTION „ THERMAL WARNING OUTPUT


    Original     		PDF STA515 PSSO36 STA515 PSSO36 8ohm .20W speaker