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    PACKAGE DRAWINGS Search Results

    PACKAGE DRAWINGS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE DRAWINGS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SO20 Package

    Abstract: SO8 package BGA and QFP Package 44 pin plcc package drawing fg676 packages pc44 plcc how package PQ304 SOIC package
    Text: Package Drawings R Package Drawings Ceramic DIP Package - DD8 0-28 R Package Drawings Plastic DIP Package - PD8 11 0-29 R Package Drawings SOIC and TSOP Packages - SO8, VO8 0-30 R Package Drawings SOIC Package - SO20 11 0-31 R Package Drawings PLCC Packages - PC20, PC28, PC44, PC68, PC84


    Original     		PDF CS144 CS280 280-BALL CS280) PG475, PG559 CB100 XC3000 CB164 XC3000) SO20 Package SO8 package BGA and QFP Package 44 pin plcc package drawing fg676 packages pc44 plcc how package PQ304 SOIC package

    PGA 1027

    Abstract: SO20 Package SO8 package BGA and QFP Package bg22 transistor CB228 PG68 PQ304 TQ100 PC44
    Text:  November 13, 1997 Version 1.2 Package Drawings 10* Package Drawings Ceramic DIP Package - DD8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Plastic DIP Package - PD8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


    Original     		PDF PG223, PG299 PG411 PG475, PG559 CB100 XC3000 CB164 CB100, CB164, PGA 1027 SO20 Package SO8 package BGA and QFP Package bg22 transistor CB228 PG68 PQ304 TQ100 PC44

    TSOP 1138

    Abstract: BG560 CS144 CS48 PC44 PC84 SO20 VQ44 HQ10 CB228
    Text: Package Drawings February 2, 1999 Version 1.3 11 R Package Drawings Ceramic DIP Package - DD8 11-24 February 2, 1999 (Version 1.3) R Package Drawings Plastic DIP Package - PD8 11 February 2, 1999 (Version 1.3) 11-25 R Package Drawings SOIC and TSOP Packages - SO8, VO8


    Original     		PDF 11-sion CB100, CB164, CB196 XC4000 CB228 FG256 FG456 FG600 FG680 TSOP 1138 BG560 CS144 CS48 PC44 PC84 SO20 VQ44 HQ10 CB228

    CC44

    Abstract: packages
    Text: Package Drawings February 2, 1999 Version 1.3 11 R Package Drawings Ceramic DIP Package - DD8 11-24 February 2, 1999 (Version 1.3) R Package Drawings Plastic DIP Package - PD8 11 February 2, 1999 (Version 1.3) 11-25 R Package Drawings SOIC and TSOP Packages - SO8, VO8


    Original     		PDF CB164 XC3000) CB100, CB164, CB196 XC4000 CB228 FG256 FG456 FG680 CC44 packages

    PLCC18

    Abstract: No abstract text available
    Text: Package Information Package Information Package Drawings Page Plastic Dual–In–Line Package PDIP 8–2 Plastic J–Lead Chip Carrier (PLCC) 8–2 Plastic Small Outline Package (SOIC) 8–3 Plastic Quad Flatpack 8–4 Plastic Very–Thin Quad Flatpack*1.0mm (VQFP)


    Original     		PDF TQFP44 VQFP64 VQFP44 VQFP80 VQFP100 330mm/13" PLCC18

    oki naming format

    Abstract: DIP42-P-600-2 HQFP208-P-4040-0 R400 S115 0.65mm pitch BGA PLCC DIMENTIONS oki marking 20 soj
    Text: 1. PACKAGE CLASSIFICATIONS 1-5. 1 1 Package Symbols and Codes Package code The package codes given on the outline view are those specified in ED-7401-2 General Rules for Preparation of Outline Drawings if Integrated Circuits Package Name and Code) established by


    Original     		PDF ED-7401-2 oki naming format DIP42-P-600-2 HQFP208-P-4040-0 R400 S115 0.65mm pitch BGA PLCC DIMENTIONS oki marking 20 soj

    reflow soldering profile BGA

    Abstract: FC-5312
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 FC5312 reflow soldering profile BGA FC-5312

    EIA-556-A

    Abstract: xilinx packaging label polystyrene EIA-556A
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 equipmQ100 TQ144 VQ100 EIA-556-A xilinx packaging label polystyrene EIA-556A

    ipc-sm-786A

    Abstract: No abstract text available
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 J-STD-020 ipc-sm-786A

    EFTEC-64

    Abstract: OPQ0014
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 HQ160 HQ208 HQ240 HQ304 MO-108DDI OPQ0021 143-FA OPQ0020 MO-143-GA EFTEC-64 OPQ0014

    FG676

    Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 TQ100 TQ128 TQ144 TQ176 VQ100 FG676 PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100

    Untitled

    Abstract: No abstract text available
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02

    MS-034-AAn-1

    Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		PDF Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002

    AUGAT DIP SOCKETS

    Abstract: No abstract text available
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Socket Manufacturers Table 1 lists manufacturers known to offer sockets for Xilinx Package types. This summary does not


    Original     		PDF Q1-02 AUGAT DIP SOCKETS

    Untitled

    Abstract: No abstract text available
    Text: Package Drawings November 13, 1997 Version 1.2 10 Package Drawings Ceramic DIP Package - DD8 10-22 November 13, 1997 (Version 1.2)


    Original     		PDF

    SSOP20 300 mil

    Abstract: DIP20 SC603 Package Outline philips ic06
    Text: INTEGRATED CIRCUITS DATA SHEET Package outline drawings January 1996 File under Integrated Circuits, IC06 Philips Semiconductors Package outline drawings INDEX PACKAGE VERSIONS DESCRIPTION PAGE DIP SOT27-1 plastic dual in-line package; 14 leads 300 mil 3


    Original     		PDF OT27-1 OT38-4 OT146-1 OT101-1 OT222-1 OT117-1 OT96-1 OT108-1 OT355-1 MO-153AD SSOP20 300 mil DIP20 SC603 Package Outline philips ic06

    land pattern for sot109-1

    Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
    Text: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products


    Original     		PDF DO-35 DO-41 DO-34 OD80C OD123F HXSON12) OT983 land pattern for sot109-1 TSSOP-8 footprint and soldering sot-23 SOD87 footprint

    Untitled

    Abstract: No abstract text available
    Text: Package Drawings Unit = Inch mm Glass DO-35 DO7 DO-15 Glass / Plastic DO-41 D-1 Package Drawings Unit = Inch (mm) DO-201AD A-405 R-1 R-6 D-2 Package Drawings Unit = Inch (mm) HVM without Terminal Ends RA / SRA Mini MELF DL-41 / MELF D-3 Package Drawings


    Original     		PDF DO-35 DO-15 DO-41 DO-201AD DL-41 O-220AB O-220AC OT-23 DO-214AA DO-214AB

    TO111 package

    Abstract: TO61 package TO63 package MOSFET F24 S06 rectifier
    Text: PACKAGE OUTLINE DRAWINGS TO-18 PACKAGE TO-5 PACKAGE —seâtaao h i m TO-33 PACKAGE 0Ct9 t?s 1 tf— II i-t 4'fiC> ?y H TO-72 PACKAGE TO-3 PACKAGE MODIFIED TO-3 PACKAGE 60mil pins SE* Ft t -L SEATU 'i "01I6 02' °’6 .225 205 JO -66 PACKAGE F-24 PACKAGE


    OCR Scan     		PDF 60mil O-111 LCC-28 nms-11 TO111 package TO61 package TO63 package MOSFET F24 S06 rectifier

    Untitled

    Abstract: No abstract text available
    Text: Q Packaging Information QSI uses a two character package code in the part numbers of its products to indicate the package. The package code is uniform over all part numbers unless otherwise noted. The following is a table of these package codes and their corresponding package. The package outline drawings for each of these packages


    OCR Scan     		PDF MO-047 PL28A MS-013AC PS20A APOP-00005-00

    Untitled

    Abstract: No abstract text available
    Text: Digital Attenuator Outline Drawings .625” Gullwing Package SG4 .800” x 1.37” DIP Package (DP5) .990” x 1.99” DIP Package (DP8) - 466 - Digital Attenuator Outline Drawings .775” Sq. DIP Package (DP11) Attenuator SMA Connectorized Housing 1


    OCR Scan     		PDF

    TO8 package

    Abstract: SM19 TO -8 package
    Text: Amplifier Outline Drawings TO-8 Package T4 TO-8B Package (T8) TO-12 Package (T7) TO-39 Package (T10) .500” Fiatpack (FP4) .625”Gullwing (SG4) - 460- Amplifier Outline Drawings .450” Sq. Surface Mount (SM-3) .375” Sq. Surface Mount (SM-11) .188 j— a ( .050 db.015


    OCR Scan     		PDF SM-11) SM-19) TO8 package SM19 TO -8 package

    package drawings

    Abstract: 16pin 617
    Text: General Information Package Drawings UNITRODE CORPORATION • 5 FORBES ROAD LEXINGTON. MA 02173 • TEL. 617 861-6540 TWX (710) 326-6509 • TELEX 95-1064 12-27 P R IN T E D IN U .S A General Information Package Drawings 3-Pin TO-220 T Package TO-3 Metal K Package


    OCR Scan     		PDF O-220 16-Pin DIL-16 24-Pin package drawings 16pin 617

    TO8 package

    Abstract: Linearizer SQ package SG412
    Text: Voltage Variable and Linearized Attenuators & Linearizer Outline Drawings 5 Pin TO-8 Package T5 .625” Sq. Package (SG4) 12 Pin TO-8B Package (T9) - 468- Voltage Variable and Linearized Attenuators & Linearizer Outline Drawings SMA Connectorized Housing


    OCR Scan     		PDF