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    OF BALL GRID ARRAY Search Results

    OF BALL GRID ARRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417750RBP240DV Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP240 Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP200V Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
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    OF BALL GRID ARRAY Price and Stock

    Wakefield-Vette 65845AB

    Heat Sink - Square - 6 °C/W - For Ball Grid Arrays - Penguin Cooler - Pin Fin - BGA - Top Mount.
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com 65845AB 1,848
    • 1 -
    • 10 -
    • 100 $1.062
    • 1000 $0.804
    • 10000 $0.611
    		Buy Now

    TT Electronics Resistors CHC-CH034LF-4428

    Precision Ceramic Ball Grid Arrays
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com CHC-CH034LF-4428 155
    • 1 -
    • 10 $8.33
    • 100 $6.21
    • 1000 $5.11
    • 10000 $4.78
    		Buy Now

    Coto Technology USA B41-0001

    Ball Grid Array (BGA) 4 Channel RF relay
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com B41-0001 85
    • 1 $127.85
    • 10 $114.78
    • 100 $100.26
    • 1000 $100.26
    • 10000 $100.26
    		Buy Now

    OF BALL GRID ARRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PSR4000 AUS308

    Abstract: prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 GHPL-830 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG
    Text: Ball Grid Array Ball Grid Array • INTRODUCTION Ball Grid Array BGA is the one of package type which using the SMT. BGA package has several advantages for it's electrical, mechanical and thermal characteristics and these characteristics can come from it's outstanding structure. By using the PCB board and solder ball array


    Original     		PDF HL832 HL832-HS HL832-NB MCL-E-679W MCL-E-679BR MCL-E-679FG GHPL-830 GEA-679N MR600 GHPL-830 PSR4000 AUS308 prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG

    Solder Balls

    Abstract: V356
    Text: Plastic Packages for Integrated Circuits Heatsink Plastic Ball Grid Array Package HPBGA 27.00 A1 BALL PAD CORNER 0.20 (4X) V356.27x27C A 356 BALL HEATSINK PLASTIC BALL GRID ARRAY PACKAGE (HPBGA) 24.00 +0.35 -0.05 4X 10.00 B NO. OF LAYERS DIM “A” DIM “B”


    Original     		PDF 27x27C 5M-1994. 20x20. MS-034/A Solder Balls V356

    V356

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Package PBGA V356.27x27B 0.20 (4X) 27.00 24.00 A1 BALL PAD CORNER A 356 BALL PLASTIC BALL GRID ARRAY PACKAGE (PBGA) +0.35 -0.05 B 4X 10.00 NO. OF LAYERS DIM “A” DIM “B” NOTES 4 2.33±0.21


    Original     		PDF 27x27B 5M-1994. 20x20. MS-034/A V356

    Intel reflow soldering profile BGA

    Abstract: socket s1 REFLOW PROFILE intel topside mark outline of the heat slug for JEDEC heat pipes intel pbga package weight BGA OUTLINE DRAWING intel mother board circuit land pattern BGA 0,50 324 bga thermal
    Text: 2 14 An Introduction to Plastic Ball Grid Array PBGA Packaging 1/17/97 9:57 AM CH14WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 14 AN INTRODUCTION TO PLASTIC BALL GRID ARRAY (PBGA) PACKAGING 14.1. INTRODUCTION The plastic ball grid array (PBGA) is today on its way to becoming one of the most popular


    Original     		PDF CH14WIP Intel reflow soldering profile BGA socket s1 REFLOW PROFILE intel topside mark outline of the heat slug for JEDEC heat pipes intel pbga package weight BGA OUTLINE DRAWING intel mother board circuit land pattern BGA 0,50 324 bga thermal

    solder paste alpha WS609

    Abstract: WS609 Alpha WS609 solder entek Cu-56 epoxy adhesive paste cte table Alpha WS609 ceramic rework solder paste WS609 Cu-56 cbga
    Text: Ceramic Ball Grid Array Surface Mount Assembly Application Note 1298 1. Package Description Ceramic Ball Grid Array CBGA is a custom platform supporting a wide variety of performance applications. This package uses flip chip as the first level interconnection and solder ball as the second level


    Original     		PDF 5988-6603EN solder paste alpha WS609 WS609 Alpha WS609 solder entek Cu-56 epoxy adhesive paste cte table Alpha WS609 ceramic rework solder paste WS609 Cu-56 cbga

    BGA PROFILING

    Abstract: BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile
    Text: HITCE* Ball Grid Array Lead-free Surface Mount Assembly Application Note 5364 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.


    Original     		PDF 20ppm/ AV02-0768EN BGA PROFILING BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile

    entek Cu-56

    Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
    Text: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.


    Original     		PDF 20ppm/ 5989-0834EN AV02-0769EN entek Cu-56 bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile

    FC-BGA

    Abstract: T0812012 daewon tray
    Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.


    Original     		PDF AN-659-1 FC-BGA T0812012 daewon tray

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    g31 m7 te

    Abstract: LC2-D LA4-DA adsp20 Socket AM2 AL-20 bmsa
    Text: a Quad-SHARC DSP Multiprocessor Family AD14160/AD14160L OLE AD14160/ AD14160L GENERAL DESCRIPTION The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid Array CBGA puts the power of the first generation AD14060 (CQFP) DSP multiprocessor into a very high density ball grid


    Original     		PDF ADSP-21060 32-Bit 40-Bit 452-Lead QS-452) C3255 g31 m7 te LC2-D LA4-DA adsp20 Socket AM2 AL-20 bmsa

    MPC823

    Abstract: AN1231
    Text: Mechanical Data and Ordering Information 24.3 PACKAGE DIMENSIONS–PLASTIC BALL GRID ARRAY PBGA For more information on the printed circuit board layout of the PBGA package, including thermal via design and suggested pad layout, please refer to AN-1231/D, Plastic Ball Grid


    Original     		PDF AN-1231/D, MPC823 AN1231

    LC2D

    Abstract: SMD transistor n36 368C smd at6 TFSC0 AD14060 AD14160 AD14160L ADSP-21060 socket am3 mounting
    Text: a AD14160/ AD14160L GENERAL DESCRIPTION The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid Array CBGA puts the power of the first generation AD14060 (CQFP) DSP multiprocessor into a very high density ball grid array package; now with additional link and serial I/O pinned


    Original     		PDF AD14160/ AD14160L AD14160/AD14160L AD14060 ADSP-21060 AD14x60 C3255 LC2D SMD transistor n36 368C smd at6 TFSC0 AD14060 AD14160 AD14160L socket am3 mounting

    hbr Y1

    Abstract: lc1d
    Text: BACK a AD14160/ AD14160L GENERAL DESCRIPTION The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid Array CBGA puts the power of the first generation AD14060 (CQFP) DSP multiprocessor into a very high density ball grid array package; now with additional link and serial I/O pinned


    Original     		PDF ADSP-21060 32-Bit 40-Bit 452-Lead QS-452) C3255 hbr Y1 lc1d

    transistor nec 8772

    Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry

    NXR-1400

    Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 AN1231/D* NXR-1400 nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC

    BGA PROFILING

    Abstract: hot air bga bga rework fine BGA thermal profile reflow hot air BGA
    Text: 2xxxx-APP-002-A September 2006 SMT BGA Ball Grid Array Eutectic Solder Balls Application Note Introduction The objective of this application note is to provide the basic SMT design and process requirements necessary to ensure high assembly yield and product reliability for Ball Grid Array (BGA) packages. The BGA packages that can


    Original     		PDF 2xxxx-APP-002-A BGA PROFILING hot air bga bga rework fine BGA thermal profile reflow hot air BGA

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: ! j * . WPF1024K32-XPBX 1024Kx32 FLASH BALL GRID ARRAY PRELIMINARY * FEATURES • Access Times of 9 0 ,150ns ■ Organized as 1024Kx32 ■ Perimeter Ball Grid Packaging ■ Commercial and Industrial Temperature Ranges • 35mm BGA: ■ 5 Volt Power Supply, 12 V pp


    OCR Scan     		PDF WPF1024K32-XPBX 1024Kx32 150ns 1024Kx32 1024Kx8 1024K32 1024K 2048K

    DBGA

    Abstract: Scans-0066302 0836 1AMI amis
    Text: AMI A M I S E M IC O N D U C T O R s DBGA Packaging Capabilities . . Description Surface Mount The Dimpled Ball Grid Array consists of a dimpled structure achieving around 2X the board joint reliability compared to that of conventional ceramic Ball Grid Arrays.


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Arrays PGA / Z IF Pin Grid A rray / Zero Insertion Force (Pages 9-18) BGA / C SP (Ball Grid A rray / Chip Scale Packaging) (Pages 19-21) liBGA" / C SP (Micro Ball Grid A rray / Chip Scale Packaging) (Pages 22-30) ^iBGA is a a registered Tradem ark of Tessera Inc. All rights reserved.


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: WHITE /MICROELECTRONICS WPF1024K32-XPBX 1024Kx32 FLASH BALL GRID ARRAY PRELIMINARY* FEATURES • A c c e s s Tim es of 9 0 , 150ns ■ Organized a s 1024K x32 ■ Perim eter Ball Grid Pa ckaging ■ Com m ercial and Industrial Tem perature R a n ge s • 35m m BG A:


    OCR Scan     		PDF WPF1024K32-XPBX 1024Kx32 150ns 1024K 1024K32 2048K