Nitto 5015
Abstract: nitto denko adhesive DAC2450CT1 nitto denko 5015 N5015 nitto tape
Text: ANTENNA ELEMENT FOR 2.4 GHz DESCRIPTION The DAC Series is a miniature dielectric antenna element for 2.4 GHz wireless LAN systems. This antenna has vertical polarization characteristics. TOKO's proprietary ceramic dielectric material provides excellent stability
|
Original
|
PDF
|
DAC2450CT1
CF-162-DACDS297
0397O2
Nitto 5015
nitto denko adhesive
DAC2450CT1
nitto denko 5015
N5015
nitto tape
|
SMD LED 5680
Abstract: LC-1500 MAX PLUS II free X362 3M reflective tape nitto tape, 500
Text: American Opto Plus LED BL-S3547LW-F 34.7mm x 46.70mm V.A.: 30.74mm x x36.24mm FPC Type White Side-Look LCD Backlight PACKAGE DIMENSIONS Notes: 1. All dimensions are in millimeters monitoring Rev. 1.0 July 2006 2. Not Specified tolerance is ± 0.2mm 3.
|
Original
|
PDF
|
BL-S3547LW-F
LC-1500
SMD LED 5680
LC-1500
MAX PLUS II free
X362
3M reflective tape
nitto tape, 500
|
Denko
Abstract: NITTO DENKO H9004 1.5DS 5Cs transistor separator nitto denko GT13S-1S-HU H9004 1.5CS
Text: MITSUMI Film Antenna for Digital Terrestrial Broadcasting Receiver DCA-C01 Telecommunication component OUTLINE This film antenna receives the terrestrial digital broadcast signal. Antenna unit can be mounted on the glass window of the car with ease, and has a built-in
|
Original
|
PDF
|
DCA-C01
14dBi
Recepti50
H9004
GT13S-1S-HU
Denko
NITTO DENKO H9004
1.5DS
5Cs transistor
separator nitto denko
GT13S-1S-HU
H9004
1.5CS
|
TSS463
Abstract: Nitto MP8000 MARKING Z86 1000 BASE Isolation Modules 5000V EOS ESD S 61.1 hmt design data book MOLDING MATERIAL MP8000 HT Q100 temic gateway EIA-556-A
Text: Qualpack TSS463 / TSS461C TSS463 VAN Van Controller Serial Interface TSS461C VAN Van Controller TSS463/TSS461C VAN Controllers 1999 January TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY Rev. 2 – January 1999 1 Qualpack TS80C31X2/C32X2 1. Contents 1. Contents. 2
|
Original
|
PDF
|
TSS463
TSS461C
TSS461C
TSS463/TSS461C
TS80C31X2/C32X2
Nitto MP8000
MARKING Z86
1000 BASE Isolation Modules 5000V
EOS ESD S 61.1
hmt design data book
MOLDING MATERIAL MP8000
HT Q100
temic gateway
EIA-556-A
|
TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
|
Original
|
PDF
|
|
MP 130B
Abstract: sumitomo epoxy LPV324M MP 130B 02 cf 5097 nitto UV tape A193K NSC marking code PB eme-7351ls eme marking sot23
Text: LPV321/358/324 Qualification Package 9µA Op Amp Family With 150kHz GBW NEW LPV FAMILY Part # Function Package LPV321 LPV358 LPV324 Single Dual Quad SC70-5, SOT23-5 SOIC, MSOP SOIC, TSSOP LPV Series LMV Series National’s Low-Power LPV300 Familiy IN SC70 Packaging
|
Original
|
PDF
|
LPV321/358/324
150kHz
LPV321
LPV358
LPV324
SC70-5,
OT23-5
LPV300
150kHz
LPV321/LPV358/LPV324
MP 130B
sumitomo epoxy
LPV324M
MP 130B 02
cf 5097
nitto UV tape
A193K
NSC marking code PB
eme-7351ls
eme marking sot23
|
TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features 2 Designed for high-performance, double-balanced mixers ● Three barrier heights available ● Schottky diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Available lead Pb -free, RoHS-compliant, and Green
|
Original
|
PDF
|
SMS392x-099
SMS3926
SMS3927
|
Nitto 5015
Abstract: DAC2450CT1 PIFA DAC2450CT3 INVERTED F PCB ANTENNA
Text: DIELECTRIC ANTENNA ELEMENT FOR WIRELESS LAN SYSTEMS 2.4GHz無線LAN用誘電体アンテナ素子 DAC Series The DAC Series is a miniature dielectric antenna for 2.4GHz band wireless LAN systems. This antenna has vertical polarization characteristics. It is manufactured using high-performance
|
Original
|
PDF
|
DAC2450CT1
DAC2450CT2
DAC2450CT3
2450MHz
2500MHz2
5015NITTO
shipmentP/NDAC2450CT1-T
P/NDAC2450CT1-T
Nitto 5015
DAC2450CT1
PIFA
DAC2450CT3
INVERTED F PCB ANTENNA
|
nitto tape
Abstract: No abstract text available
Text: PIN Diode Chips Supplied on Film Frame SMP1320-099, SMP1322-099, SMP1340-099, SMP1353-099 Features • Designed for High Performance Switch Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame
|
Original
|
PDF
|
SMP1320-099,
SMP1322-099,
SMP1340-099,
SMP1353-099
3/02A
nitto tape
|
yellow 5mm LED basic
Abstract: LVY9033 nitto tape, 500
Text: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT TYPE AND REEL LVY9033/TR2 DATA SHEET DOC. NO : QW0905-LVY9033/TR2 REV. : A DATE : 09 - Jun - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8 PART NO. LVY9033/TR2 Package Dimensions
|
Original
|
PDF
|
LVY9033/TR2
QW0905-LVY9033/TR2
MIL-STD-750D
J-STD-020
ED-M80HYU
NT-301H-11000
yellow 5mm LED basic
LVY9033
nitto tape, 500
|
pin diode SMP
Abstract: SMP1302-099
Text: PIN Diode Chips Supplied on Film Frame Features • Designed for High Performance Switch and Attenuator Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame ■ Low Cost Description The SMP series of PIN diodes are designed for high
|
Original
|
PDF
|
SMP1302-099
12/02A
pin diode SMP
|
MO-150
Abstract: C194 MP8000AN G600 MO-137 amkor
Text: LEADFRAME data sheet SSOP Features: Shrink Small Outline SSOP Packages: How do you reduce an SOP size and its board footprint demand? Amkor did it by taking a family of SOPs and shrinking them. The body size was compressed and the lead pitch tightened to obtain a smaller
|
Original
|
PDF
|
MO-150
MO-118
MO-150
C194
MP8000AN
G600
MO-137
amkor
|
Untitled
Abstract: No abstract text available
Text: PIN Diode Chips Supplied on Film Frame Features • Designed for High Performance Switch and Attenuator Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame ■ Low Cost Description The SMP series of PIN diodes are designed for high
|
Original
|
PDF
|
SMP1302-099
SMP1304-099
4/03A
|
|
|
Cosel
Abstract: No abstract text available
Text: SLIM STICK S-TYPE LED MODULE APPLICATIONS MANUAL WARNING ・ Direct LED emission can seriously damage the eyes. Never view a LED emission directly. ・ Never use a disassembled LED module. ・ A LED generates heat while it is emitting. The ambient temperature is increased by 20℃
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features 2 Designed for high performance double balanced mixers ● Three barrier heights available ● Schottky diodes supplied 100% tested, sawn, mounted on film frame ● Low cost 2 ● 1
|
Original
|
PDF
|
SMS392x-099
SMS3926
SMS3927
|
underfill
Abstract: with or without underfill intel C4 package underfill for good adhesion and low viscosity Low viscosity underfill for flip chip microwave oven
Text: Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging Tom Dory, Assembly Technology Development, Intel Corp. Kenji Takahashi, Japan Package Technology Development, Intel Corp. Tomomi Kume, Japan Package Technology Development, Intel Corp.
|
Original
|
PDF
|
|
200165
Abstract: SMS3927-099 SMS3926 SMS3926-099 SMS3927 SMS3928 SMS3928-099 Schottky diode wafer
Text: DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features 2 Designed for high-performance, double-balanced mixers ● Three barrier heights available ● Schottky diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Available lead Pb -free, RoHS-compliant, and Green
|
Original
|
PDF
|
SMS392x-099
SMS3926
SMS3927
200165
SMS3927-099
SMS3926-099
SMS3928
SMS3928-099
Schottky diode wafer
|
FEBFSL126MR_H432V1
Abstract: sck053 ceramic buss SR-5 UU9.8 ferrite core E157822 468-2FC sck-053 E85640 Nitto 31ct KUHS-225
Text: User Guide for FEBFSL126MR_H432v1 Evaluation Board 5V, 12V Green-Mode Fairchild Power Switch FPS Featured Fairchild Product: FSL126MR Direct questions or comments about this evaluation board to: “Worldwide Direct Support” Fairchild Semiconductor.com
|
Original
|
PDF
|
FEBFSL126MR
H432v1
FSL126MR
H432v1
FEBFSL126MR_H432V1
sck053 ceramic
buss SR-5
UU9.8 ferrite core
E157822
468-2FC
sck-053
E85640
Nitto 31ct
KUHS-225
|
5252 F 1008
Abstract: transistor 1FX sd 1074 transistor SCR SN 100 folded cascode current mirror op amp FSC20000512 LMV712 MSOP-10 MSOP-10L Q-2000
Text: LMV712 Rail-to-Rail I/O, Dual Op Amp Qualification Package National’s LMV712 Dual Op Amp Offers 5V/µs Slew Rate, 5 MHz GBW LLP-10 • 0.1 µA Shutdown Current • Noise at <20 nV/√ Hz @ 1 kHz • Drives 600Ω Load @ 2.7V Actual Size 3 mm x 3 mm x .75 mm
|
Original
|
PDF
|
LMV712
LLP-10
LLP-10
MSOP-10
LMV712
5252 F 1008
transistor 1FX
sd 1074 transistor
SCR SN 100
folded cascode current mirror op amp
FSC20000512
MSOP-10L
Q-2000
|
A48 sc70
Abstract: FSC20010035 LMV301 LMV321 LMV821 SC70-5 SC70-5L LMV301MGX
Text: LMV301 Low Input Bias Current, Single Op Amp Qualification Package National’s LMV301–Low Power, Low Voltage, Single Op Amp Delivers RR/O in a Space Saving SC70 Package IBIAS Current vs. VCM 5 VS =5V 4 IBIAS pA - • Low Input Bias Current (0.18 pA Typ.)
|
Original
|
PDF
|
LMV301
SC70-5
A48 sc70
FSC20010035
LMV321
LMV821
SC70-5L
LMV301MGX
|
SMP1302-099
Abstract: SMP1304-099 SMP1320 SMP1320-099 SMP1322 SMP1322-099 SMP1340 SMP1340-099 SMP1353-099
Text: DATA SHEET PIN Diode Chips Supplied on Film Frame Features Designed for high performance switch and attenuator applications ● Preferred device for module applications ● PIN diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Description
|
Original
|
PDF
|
SMP1302-099
SMP1304-099
SMP1320
SMP1320-099
SMP1322
SMP1322-099
SMP1340
SMP1340-099
SMP1353-099
|
lm6642
Abstract: NATIONAL SEMICONDUCTOR MARKING CODE 277 marking code 604 SOT23-6 sumitomo epoxy Nitto UV MARKING 5501 SOT23-5 sot23-6 marking code 593 nitto UV tape NS Package Number MF05A operational amplifier discrete schematic
Text: LMH Products Qualification Package LMH6642, LMH6643, LMH6645, LMH6646, LMH6647, LMH6654, LMH6655 and LMH6672 National's LMH66xx family of operational amplifiers is a new series of high-speed products based on the VIP10 process. The first members of the
|
Original
|
PDF
|
LMH6642,
LMH6643,
LMH6645,
LMH6646,
LMH6647,
LMH6654,
LMH6655
LMH6672
LMH66xx
VIP10TM
lm6642
NATIONAL SEMICONDUCTOR MARKING CODE 277
marking code 604 SOT23-6
sumitomo epoxy
Nitto UV
MARKING 5501 SOT23-5
sot23-6 marking code 593
nitto UV tape
NS Package Number MF05A
operational amplifier discrete schematic
|
transistor KSP 42
Abstract: irf950 IRFP100 transistor KSP 56 transistor KSP 92 G 23 ksp 36 93 IRF9500 transistor KSP 13 Samsung "NAND Flash" "ordering information" IRFP p-channel
Text: ORDERING INFORMATION KSV 3100A C N/ + BURN-IN OPTIONAL (SEE BURN-IN PROGRAM) PACKAGE TYPE (SEE EACH SPEC OF DEVICE) OPERATING TEMP IC’S ONLY BLANK: SEE INDIVIDUAL SPEC C : 0 - 70°C I : - 40 - 85°C M : - 5 5 - + 125°C DEVICE NUMBER AND SUFFIX (OPTIONAL)
|
OCR Scan
|
PDF
|
OT-23
O-220
100ns
120ns
150ns
200ns
16bit
transistor KSP 42
irf950
IRFP100
transistor KSP 56
transistor KSP 92 G 23
ksp 36 93
IRF9500
transistor KSP 13
Samsung "NAND Flash" "ordering information"
IRFP p-channel
|
