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    MVP/ID/8165 Search Results

    MVP/ID/8165 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54121-108081650LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    10131318-16522GPLF Amphenol Communications Solutions Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 100u\\ Matte Tin plating, Black Color, 16 Positions, LCP, GW Compatible, Tray Packing, With Pegs. Visit Amphenol Communications Solutions
    10131318-16521GRLF Amphenol Communications Solutions Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 100u\\ Matte Tin plating, Black Color, 16 Positions, GW Compatible Nylon66, Tape and Reel. Visit Amphenol Communications Solutions
    10131318-16522GRLF Amphenol Communications Solutions Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 100u\\ Matte Tin plating, Black Color, 16 Positions, LCP, GW Compatible, Tape and Reel. Visit Amphenol Communications Solutions
    54121-408081650LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions