10x10
Abstract: MLF 9X9
Text: Device Orientation Vishay Siliconix Device Orientation MLF 9x9/10x10 DEVICE ORIENTATION Package Method MLF 9 x 9 T1 MLF 10 x 10 T1 User Direction of Feed Revision control of this drawing is maintained through Document Control, Pack Specification—PACK-0007-20
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9x9/10x10
Specification--PACK-0007-20
T-05206,
10x10
MLF 9X9
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses
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PCB design for 0.2mm pitch csp package
Abstract: led matrix 8x8 mini circuits 0.3mm pitch csp package E30JA Amkor CSP mold compound Soldering guidelines and SMD footprint design led 3mm 8x8 matrix mlf 0.3mm pitch MLF 6x6 guideline pad dimension 1210
Text: Application Notes for Surface Mount Assembly of Amkor’s MicroLeadFrame MLF® Packages December 2003 Page 1 December 2003 Rev. E Contents 1.0 Introduction 3 2.0 Surface Mount Consideration 3 3.0 PCB Design Requirements 4 3.1 4 4 8 8 10 3.2 3.3 Page 2
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SG-BGA-6046
Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.
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025mm
FR4/G10
Sn63Pb37
SG-BGA-6046
SG-MLF-7004
156 QFN 12X12
diode sg 87
1mm pitch BGA socket
SG-BGA-6094
BGA Solder Ball compressive force
17X17* BGA 289
SG-MLF-7003
SG-BGA-6033
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21315-BRF-001-A
Abstract: GS1575 424M M21315
Text: > Product Overview HD/SD MLF Compatible Auto-rate Reclocker w/ 4:1 Selector The M21315 is a high-speed, low-power reclocker designed to remove both random and inter-symbol interference ISI jitter from the input data for SMPTE and DVB-ASI serial digital video applications. Mindspeed’s high performance
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M21315
M21315-BRF-001-A
M21315G-11
21315-BRF-001-A
GS1575
424M
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KSZ8893BML
Abstract: Power line load switch for portable dvd china KSZ8842-16MBL MIC22400 MIC5322 MIC5325 SY88212L SY89297U
Text: Q2 2008 Volume 31 Micrel Inc., is a leading global manufacturer of IC solutions for the worldwide analog, Ethernet and highbandwidth markets. The Company’s Micrel New Product Highlights products include advanced mixedsignal, analog and power semiconductors; high performance
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SE-169
M0055-041808
KSZ8893BML
Power line load switch for portable dvd china
KSZ8842-16MBL
MIC22400
MIC5322
MIC5325
SY88212L
SY89297U
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Untitled
Abstract: No abstract text available
Text: Page 1 of 2 AS8223 FlexRay Active Star Device AS8223 FlexRay™ Active Star Device Description The AS8223 is a monolithic FlexRay™ compliant Active Star device which manages communication traffic between the communication controller interfacen and four FlexRay branches. It's also expandable to more branches through an
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AS8223
ts/Interfaces/FlexRay-Transceivers/AS8223
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LQFP-128L
Abstract: LQFP128L
Text: SPECIFICATION NO. REV. 2000-0026 M DOCUMENT TITLE: SMD PACKAGE MOISTURE SENSITIVITY TABLE OWNER: RELIABILITY MANAGER REQUIRED APPROVALS: RELIABILITY MANAGER QUALITY MANAGER SR. PRODUCT ENGINEERING MANAGER PLANNING AND LOGISTICS DIRECTOR WW TEST OPERATIONS MANAGER
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FCQFN46-34L
FQFN33-16L,
FQFN44-26L,
H3QFN1212-64L
H3QFN88-52L
H4QFN1010-52L
QFN56-30L
H4QFN1212-64L
LGA5032-06L
LGA5555-76L
LQFP-128L
LQFP128L
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q406 transistor
Abstract: SI9120 equivalent Q406 q406 SUM65N20-30 Si3456BDV SPICE Device Model sud*50n025 Si4304DY 0038 tsop Si2325DS
Text: Power MOSFETS for DC/DC Applications Vishay Siliconix 2201 Laurelwood Road P.O. Box 54951 Santa Clara, CA 95056 Phone: +1 408 988 8000 Fax: +1 408 567 8950 www.vishay.com NOTICE Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no
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SiP41109
SiP41110
SiP41111
75/2A
q406 transistor
SI9120
equivalent Q406
q406
SUM65N20-30
Si3456BDV SPICE Device Model
sud*50n025
Si4304DY
0038 tsop
Si2325DS
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1f1-1717-a19
Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O
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60WMBG
60M/54WBGA-8
10X15
10-8X12-A
LA69-00635A
48TBGA
48-TBGA-10
0-8X16-O
LA69-00267A
ADS11981
1f1-1717-a19
153FBGA
BGA 6x6 tray
FBGA tray kostat
tray bga 6x6
169fbga-12.0x16.0-8x16-0
78BOC-11
78BOC
ePAK BGA 5x5 tray
153FBGA-9
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atmel 93C46
Abstract: SM0402 RC0402FR-0710KL 93c46 atmel atmega32l SSQ-105-02-T-D-RA PRPN051PAEN 93c46 pc MI0805K400R-00 RC0805JR-070RL
Text: Features Description The USB to SMBusTM Interface board allows communication between a Zilker Labs Digital-DC evaluation board and a PC. This interface board has been designed to bridge PMBus commands from a PC application program to the SMBus. The PMBus command
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ZLUSBREF01DSR1
atmel 93C46
SM0402
RC0402FR-0710KL
93c46 atmel
atmega32l
SSQ-105-02-T-D-RA
PRPN051PAEN
93c46 pc
MI0805K400R-00
RC0805JR-070RL
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sud*50n025-06p
Abstract: SUD70N03-04P SI9120 sum45n25 SI9119 Si7810DN sud*50n025-09p SI2301ADS SI4732CY si9110
Text: SELECTOR GUIDE V I S H A Y I N T E R T E C H N O L O G Y, I N C . Power MOSFETs for DC/DC Applications Siliconix LITTLE FOOT LITTLE FOOT® Plus Tr e n c h F E T ® WFET ChipFET® P ow e r PA K ® Application-Specific MOSFETs w w w. v i s h a y. c o m
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VSA-SG0019-0310
sud*50n025-06p
SUD70N03-04P
SI9120
sum45n25
SI9119
Si7810DN
sud*50n025-09p
SI2301ADS
SI4732CY
si9110
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AK08D300-CLCC
Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
AK08D300-CLCC
AK08D300-LFCSP2X3 .5mm
AK08D300-LFCSP3x3 .5mm
AK08D300-MLP.65mm
AK10D300-8SON .65mm
MLP 3X3
MLP 4X4
AK22D300-DFN
AK24D300-LLP
MLP 5X5
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SCB-0340N
Abstract: WLL6160-D99 KSB0405HA M470T2864QZ3-CF7 AR5B95 BA59-02608A M470T2864QZ3-CE6 RT8205AGQW T77H121 M470T2864EH3-CF7
Text: - This Document can not be used without Samsung's authorization - Part List : NP-N128-DA01RU Ver. Location 0001 A0010 Part Number 3903-000444 CBF-POWER CORD;DT,EU/KR,CP3,IEC320 C5,25 Part Name & Specification Q'ty SA/SNA 1 SA Parent Part 0001 A1001 BA46-11503A S/W CD;UTILITY,SPRINGFIELD,-,1.0,EXPORT,
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NP-N128-DA01RU
A0010
A1001
B0001
B0003
B0009
B0013
B0302
B0303
B0402
SCB-0340N
WLL6160-D99
KSB0405HA
M470T2864QZ3-CF7
AR5B95
BA59-02608A
M470T2864QZ3-CE6
RT8205AGQW
T77H121
M470T2864EH3-CF7
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Untitled
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
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P9010
Abstract: 305 A SOIC20 MLF 9X9 V30114 V30114-T1
Text: DG401B/403B/405B New Product Vishay Siliconix Low-Power, High-Speed CMOS Analog Switches FEATURES D D D D D D D D 44-V Supply Max Rating "15-V Analog Signal Range On-Resistance—r DS on : 23 W Low Leakage—ID(on): 40 pA Fast Switching—tON: 100 ns Upgrade to DG401/403/405
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DG401B/403B/405B
DG401/403/405
DG403B
DG401B/403B/405B
power-20
S-40347--Rev.
29-Mar-04
91-5209-x
05-Apr-04
P9010
305 A SOIC20
MLF 9X9
V30114
V30114-T1
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Untitled
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
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APW7141QAITRG
Abstract: SCB-0350M samsung ba92 G546A4P1UF BA92-05996A g546a4 M471B5673EH1-CF8 KSB0705HA AF82801IBM EB88CTGM
Text: - This Document can not be used without Samsung's authorization - Part List : NP-R530-JA05RU Ver. Location 0001 A0010 Part Number 3903-000444 CBF-POWER CORD;DT,EU/KR,CP3,IEC320 C5,25 Part Name & Specification Q'ty SA/SNA 1 SA Parent Part BA99-15303A 0001 B0001
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NP-R530-JA05RU
A0010
B0001
B0003
B0009
B0010
B0100
B0302
B0303
B0402
APW7141QAITRG
SCB-0350M
samsung ba92
G546A4P1UF
BA92-05996A
g546a4
M471B5673EH1-CF8
KSB0705HA
AF82801IBM
EB88CTGM
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AN315
Abstract: an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer
Text: AN315 Thermal Considerations for QFN Packaged Integrated Circuits Over the past few years, Quad Flat No-Lead QFN packages have become very popular for audio amplifier applications needing efficient power dissipation in small footprints. These packages, shown in Figure 1, are
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AN315
AN315REV1
AN315
an315 audio power
an315 audio
AN315 AUDIO AMPLIFIER
QFN PACKAGE thermal resistance
"thermal via"
QFN 9X9
QFN PACKAGE Junction to PCB thermal resistance
CS4525
Signal Path Designer
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G577BSR91U
Abstract: M470T5663EH3-CF7 AF82801IBM 7SZ14 R5538 BA92-05617A NP-R420-XA02RU BA96-04188A samsung ba92 TPS51125RGER
Text: - This Document can not be used without Samsung's authorization - Part List : NP-R420-XA02RU Ver. Location 0001 A1001 Part Number BA46-11159A S/W CD;UTILITY,QingDao-Int,Vista,1.0,Exp Part Name & Specification Q'ty SA/SNA 1 SA NP-R420-XA02RU Parent Part 0001
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NP-R420-XA02RU
A1001
B0001
B0003
B0005
B0009
B0010
B0013
B0204
G577BSR91U
M470T5663EH3-CF7
AF82801IBM
7SZ14
R5538
BA92-05617A
NP-R420-XA02RU
BA96-04188A
samsung ba92
TPS51125RGER
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AF82801IBM
Abstract: M470T5663RZ3-CF7 TS-L633 KSB0705HA m470t5663qz3-cf7 M470T5663EH3-CF7 RT8207GQW TM-01020-003 tps51620 KSB0705HA-8J1X
Text: - This Document can not be used without Samsung's authorization - 5.Part List NP-R469-XS01RU Location Part Code Specification Qty SA/SNA A0010 3903-000115 CBF-POWER CORD;DT,EU,CP3,IEC320 C5,250/2 1 SA A1001 BA46-10703A S/W CD;UTILITY,BONN,CDS6,-,All_Lang,CD,1
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NP-R469-XS01RU
A0010
A1001
B0001
B0003
B0005
B0009
B0010
B0013
AF82801IBM
M470T5663RZ3-CF7
TS-L633
KSB0705HA
m470t5663qz3-cf7
M470T5663EH3-CF7
RT8207GQW
TM-01020-003
tps51620
KSB0705HA-8J1X
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apm 7113
Abstract: No abstract text available
Text: Datasheet AS8223 FlexRay Active Star Device 1 General Description This document is subject to change without notice. The AS8223 is a monolithic FlexRay compliant Active Star Device that manages communication traffic among four FlexRay branches of the network, expandable to more branches through an Interstar
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AS8223
AS8223
com/AS8223
apm 7113
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SCB-1000S
Abstract: NH82801HBM AD-9019S le88clpm BA92-04575A LTN154P4-L02-G venice 6.5 NH82801HB LTN154P4-L02 samsung ltn154
Text: - This Document can not be used without Samsung's authorization - 5. Exploded view and Part List SYSTEM ASSY LCD T0010 I0006 T0001 M0001 T0005 G0003 I0001 G0008 M3001 I0002 D0001 I0009 M3004 B0013 M4001 W3007 B0205 B0008 B2000 B0001 G0011 B0150 I0005 B0003
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I0006
T0010
T0001
M0001
T0005
G0003
G0008
I0001
I0002
D0001
SCB-1000S
NH82801HBM
AD-9019S
le88clpm
BA92-04575A
LTN154P4-L02-G
venice 6.5
NH82801HB
LTN154P4-L02
samsung ltn154
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