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    MIL 45204 Search Results

    MIL 45204 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MD28F020-12/R Rochester Electronics LLC 28F020 - 256K X 8 Flash, Mil Temp Visit Rochester Electronics LLC Buy
    COM1553A/B Rochester Electronics LLC COM1553A/B - Mil-Std-1553B Smart Controller Visit Rochester Electronics LLC Buy
    MD28F020-90/R Rochester Electronics LLC 28F020 - 256K X 8 Flash, Mil Temp Visit Rochester Electronics LLC Buy
    MR28F010-90/R Rochester Electronics LLC 28F010 - 128K X 8 Flash, Mil Temp Visit Rochester Electronics LLC Buy
    MD28F010-90/R Rochester Electronics LLC 28F010 - 128K X 8 Flash, Mil Temp Visit Rochester Electronics LLC Buy

    MIL 45204 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: AMPLIMITE Connectors, ULTRA-LITE Connectors ULTRA-LITE Connector Plugs and Receptacles, Series 90 Connector Material and Finish Shell — Aluminum alloy, gold plated per MIL-G-45204 over nickel per MIL-C-26074. Insert — Blue diallyl phthalate per MIL-M-14 or black Polyphenylene


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    PDF MIL-G-45204 MIL-C-26074. MIL-M-14 MIL-M-24519 MIL-M-24519 ZZ-R-765,

    Amphenol

    Abstract: M81969 M12883 SAE-AS39209 m22520 M39029 CNS101553 MIL-C-39029 B 1403 N dn2 relay
    Text: Crimp Removable Socket Contacts MIL-C-39029/5, MIL-C-39029/101 Materials: Body: Copper Alloy, Hard Gold Plated per MIL-G-45204 Hood: Stainless Steel Passivated M39029/5 Contact Dimensions 1st A B 3rd Performance: Performance: Performance in Accord with SAE-AS39209 and Related


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    PDF MIL-C-39029/5, MIL-C-39029/101 MIL-G-45204 M39029/5 SAE-AS39209 M12883/40, M39029/101 M12883/44, Amphenol M81969 M12883 m22520 M39029 CNS101553 MIL-C-39029 B 1403 N dn2 relay

    Untitled

    Abstract: No abstract text available
    Text: AMPLIMITE Connectors, ULTRA-LITE Connectors ULTRA-LITE Connector Plugs and Receptacles, Series 109 Connector Material and Finish B Shell — Aluminum alloy, gold plated per MIL-G-45204 over nickel per MIL-C-26074. Insert — Blue diallyl phthalate per MIL-M-14 or black Polyphenylene


    Original
    PDF MIL-G-45204 MIL-C-26074. MIL-M-14 MIL-M-24519 MIL-M-24519 ZZ-R-765,

    Untitled

    Abstract: No abstract text available
    Text: SMK - 50 Ohm Connectors 2.92mm INCHES (MILLIMETERS) • Plug to Jack In-Series Adapter GOLD PLATED 145-0901-821 MATERIAL SPECIFICATIONS Bodies: Stainless steel per QQ-B-626, gold plated* per MIL-G-45204 .00005" min. or passivated per MIL-F-14072 B (EL) 300


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    PDF QQ-B-626, MIL-G-45204 MIL-F-14072 QQ-C-530, ZZ-R-765 MIL-STD-348 MIL-STD-348,

    Untitled

    Abstract: No abstract text available
    Text: SMK - 50 Ohm Connectors 2.92mm INCHES (MILLIMETERS) • Plug to Plug In-Series Adapter GOLD PLATED 145-0901-811 MATERIAL SPECIFICATIONS Bodies: Stainless steel per QQ-B-626, gold plated* per MIL-G-45204 .00005" min. or passivated per MIL-F-14072 B (EL) 300


    Original
    PDF QQ-B-626, MIL-G-45204 MIL-F-14072 QQ-C-530, ZZ-R-765 MIL-STD-348 MIL-STD-348,

    Untitled

    Abstract: No abstract text available
    Text: SMK - 50 Ohm Connectors 2.92mm INCHES (MILLIMETERS) • Jack to Jack In-Series Adapter GOLD PLATED 145-0901-801 MATERIAL SPECIFICATIONS Bodies: Stainless steel per QQ-B-626, gold plated* per MIL-G-45204 .00005" min. or passivated per MIL-F-14072 B (EL) 300


    Original
    PDF QQ-B-626, MIL-G-45204 MIL-F-14072 QQ-C-530, ZZ-R-765 MIL-STD-348 MIL-STD-348,

    Untitled

    Abstract: No abstract text available
    Text: P\-oS-o\ a company built on proven reliability MICROWAVE Chip Capacitors Bond Strength — exceeds Mil Std-883, Method 2011 Sheer Strength — exceeds Mil Std-883, Method 2019 Metalization — Gold, Mil-G-45204 Type III Grade A Quality Control System approved to Mil-l-45208


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    PDF Std-883, Mil-G-45204 Mil-l-45208 Mil-C-49464 Mil-Std-883, 2302bb7

    C5586

    Abstract: Capacitor ceramic c70 C-30 N1500 N2200 P180 c5587 2302B c50710 c557
    Text: f\-0S -0\ a company built on proven reliability MICROWAVE Chip Capacitors Bond Strength — exceeds Mil Std-883, Method 2011 Sheer Strength — exceeds Mil Std-883, Method 2019 Metalization — Gold, Mil-G-45204 Type III Grade A Quality Control System approved to Mil-l-45208


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    PDF Std-883, Mil-G-45204 Mil-l-45208 Mil-C-49464 Mil-Std-883, 2302bb7 D00DD54 C5586 Capacitor ceramic c70 C-30 N1500 N2200 P180 c5587 2302B c50710 c557

    MIL-C-83446

    Abstract: 10582
    Text: Series 105/108 Micro i Chip Inductors Military Specifications Series 105 MIL-C-83446 Reference Series 108 MIL-C-83446/8 (Reference) Mechanical Configuration Units are epoxy encapsulated. Contact areas for reflow soldering are gold plated per MIL-G-45204 Type 1-Grade A. Internal


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    PDF MlL-C-83446 MIL-C-83446/8 MIL-G-45204 108-823K 108-104K 105-102KS 108-473KS) 0737R70 00DD74b MIL-C-83446 10582

    C1106

    Abstract: No abstract text available
    Text: NOTES: 1. MATERIALS: 2. PLATING: BERYLLIUM COPPER QQ-C-530, BRASS QQ-B-626. TEFLON M IL-P-19468. HARD GOLD PLATE MIL-G-45204 .00005 MIN., HARD GOLD PLATE MIL-G-45204 .0001 MIN. 3. INTERFACE PER MIL-C-39012. 4. ELECTRICAL CHARACTERISTICS: NOMINAL IMPEDANCE: 50 OHMS


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    PDF QQ-C-530, QQ-B-626. IL-P-19468. MIL-G-45204 MIL-C-39012. C1106

    Untitled

    Abstract: No abstract text available
    Text: NOTES: 1. INTERFACE TO BE IN ACCORDANCE WITH MIL-STD-348 FIG. 313-2. 2. MATERIALS: INSULATOR-TEFLON. ASTM-D-4894 CENTER CONTACT-BER. COP., ASTM-B-196 SHRINK TUBING-POLYOLEFIN PER MIL-I-23053/5 BODY-BRASS, ASTM-B16 3. FINISHES: CENTER CONTACT-GOLD PLATE PER MIL-G-45204


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    PDF MIL-STD-348 ASTM-D-4894 ASTM-B-196 MIL-I-23053/5 ASTM-B16 MIL-G-45204 IMPEDANCE-50 VOLTAGE-500 127-37D

    C1106

    Abstract: No abstract text available
    Text: .98 REF. NOTES: 1. MATERIALS: BERYLLIUM COPPER QQ-C-530, BRASS QQ-B-626, TEFLON M IL -P -19468. 2. PLATING: HARD GOLD PLATE MIL-G-45204 .00005 MIN., HARD GOLD PLATE MIL-G-45204 .0001 MIN. 3. INTERFACE PER MIL-C-39012. 4. ELECTRICAL CHARACTERISTICS: NOMINAL IMPEDANCE: 50 OHMS


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    PDF QQ-C-530, QQ-B-626, MIL-G-45204 MIL-C-39012. 8791115S C1106

    Untitled

    Abstract: No abstract text available
    Text: SF2950—6067. NOTES: 1. MATING: Interface dimensions per Mil-C-39012/SMA Series and Solitron/Microwave MD-107. 2. MATERIALS: Body: Contact: Insulator: 3. FINISH: Body: Contact: 4. Passivate per QQ-P-35A, Type I. Gold per Mil-G-45204, Type II, Grade C, Class 2; over Copper per Mil-C-14550,


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    PDF SF2950â Mil-C-39012/SMA MD-107. QQ-P-35A, Mil-G-45204, Mil-C-14550, QQ-S-764, QQ-C-530, Mil-P-19468 MIL-STD-202

    Untitled

    Abstract: No abstract text available
    Text: Discrete Crimp-to-Wire Pins/Receptacles/ Housings 2.54 x 2.54 mm 0.100 x 0.100 in. Centerlines Latching System I Features Specifications • ■ ASTMB-122 ■ ASTM B-579 MIL-G-45204 ASTMB-159 MIL-M-20693 MIL-P-46129 QQ-N-290 QQ-B-613


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    PDF ASTMB-122 B-579 MIL-G-45204 ASTMB-159 MIL-M-20693 MIL-P-46129 QQ-N-290 QQ-B-613 QQ-C-533 E66906

    Untitled

    Abstract: No abstract text available
    Text: Materials All metal parts: Kovar, gold plated per MIL-G-45204 type II, grade C, class 1 over nickel per MIL-C-26074, class 1, over copper per MIL-C-14550. Glass: Corning glass as noted: Frequency range: DC-26 GHz. Insertion loss: .1 Db max to 12.4 GHz. .2 Db max to 18 GHz.


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    PDF MIL-G-45204 MIL-C-26074, MIL-C-14550. DC-26 MIL-STD-202,

    Untitled

    Abstract: No abstract text available
    Text: unted Term inations & Resis MECHANICAL SPECIFICATIONS Heat Sink Substrate Contact Copper, Nickel Plated per MIL-C-26074, Class 2. Beryllium Oxide Ceramic. Beryllium Copper, Gold Plated per MIL-G-45204. Thickness .004" ± .002". Alumina Ceramic. ± .010" unless specified.


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    PDF MIL-C-26074, MIL-G-45204. CST-20 CSR-20

    Untitled

    Abstract: No abstract text available
    Text: smM Specifications in the event of any conflict between these specifications and General Specification MIL-C-39012 and MiL-C-83517 these specifications shall govern These specifications are subject to change according to the latest revision oi MIL-C-39012 and M!L-C-83517.


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    PDF MIL-C-39012 MiL-C-83517 L-C-83517. Mll-STD-202

    Untitled

    Abstract: No abstract text available
    Text: HOLLINGSWORTH .100 2,54 000 Ili 101 000 RECOMMENDED PCB PATTERN .100 (2,54) SPECIFICATIONS: MATERIALS: HOUSING: TERMINAL: PLATING: GLASS FILLED THERMOPLASTIC, U.L. 94V-0, BLACK PHOSPHOR BRONZE GOLD PER MIL-G-45204 TIN/LEAD PER MIL-T-81728 NICKEL PER QQ-N-290


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    PDF MIL-G-45204 MIL-T-81728 QQ-N-290 RS-364, 100fj

    ASTM-D-1457

    Abstract: C1106
    Text: NOTES: 1. INTERFACE PER MIL-STD-348. FIG. 314-1. 2. MATERIALS: INSULATOR: TEFLON, ASTM-D-1457 CENTER CONIACI i BRASS' ASTM-BI6 3 FINISHES* CENTER CONTACT: GOLD PLATE PER MIL-G-45204 BODY: KINGS TARNISH RESISTANT FINISH TR-5 4. ELECTRIAL CHARACTERISTICS:


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    PDF MIL-STD-348. ASTM-D-1457 MIL-G-45204 KAM0392 1Q707 C1106

    Untitled

    Abstract: No abstract text available
    Text: SMA SPECIFICATIONS MATERIALS ELECTRICAL Continued Bodies, nuts - Corrosion Resistant Steel per QQ-S-763 Contacts - Beryllium Copper per QQ-C-530 Insulators - Teflon per MIL - P -19468 Gaskets - Silicone Rubber per ZZ-R-765 ^FINISH Contact - .000050 min Gold per MIL-G-45204


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    PDF QQ-S-763 QQ-C-530 ZZ-R-765 MIL-G-45204 -60DB 312HEX 040jSQ[

    Untitled

    Abstract: No abstract text available
    Text: DRAWING Nil 1. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE ±.010” .254mm REV, 12-0003 B MATERIALS: BODY & COUPLING NUT: S.S. PER ASTM A582 CONTACT: BERYLLIUM COPPER PER ASTM B196 RESISTIVE: NICHROME FINISH: BODY: GOLD PER MIL-G-45204 CONTACT: GOLD PER MIL-G-45204


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    PDF 254mm) MIL-G-45204 QQ-P-35 2Y194 120003A3 MIL--STD--202

    Untitled

    Abstract: No abstract text available
    Text: Series 3090 Micro i Low Profile Chip Inductors SERIES 3090 IRON CORE MIL-C-83446 Reference for testing methods only. Mechanical Configuration Units are epoxy encapsulated. Contact area for reflow soldering are gold plated per MIL-G-45204 Type 1 Grade A. Internal


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    PDF MIL-C-83446 MIL-G-45204 3090-1OOM 3090-150M 3090-220M 3090-330K 3090-390K 3090-470K 3090-560K 3090-680K

    Untitled

    Abstract: No abstract text available
    Text: Series 3090 Micro i Low Profile Chip Inductors SERIES 3090 IRON CORE MIL-C-83446 Reference for testing methods only. Mechanical Configuration Units are epoxy encapsulated. Contact area for reflow soldering are gold plated per MIL-G-45204 Type 1 Grade A. Internal


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    PDF 3090-100M 3090-150M 3090-220M 3090-330K 3090-390K 3090-470K 3090-560K 3090-680K 3090-820K 3090-101K

    Untitled

    Abstract: No abstract text available
    Text: 2702-6015 NOTES MATING: Interface dimensions per Mil-C-39012/ssMâ Series and Solitron/Microwave MD-114. i MATERIAL : ' Body & '• Coupling Nut:Lockring Gasket:- FINISH: Body & Coupling Nut:Lockr ing :— — . — 4. -Gold per Mil-G-45204, Type II, Grade C, Class 1.


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    PDF Mil-C-39012/ssMÃ MD-114. Mil-G-45204, AMS-5640, QQ-C-530, Mil-R-5847, MIL-STD-202