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    Abstract: WED3C7410E16M-400BX WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8M-XBX 21mmx25mm
    Text: PowerPC 755E/8Mbit SSRAM Multi-Chip Package Optimum Density and Performance in One Package WED3C755E8M-XBX Features • 300 or 350 MHz 755E Rev RISC µProcessor • 8 Mbit of Synchronous pipeline burst SRAM configured as 128Kx72 L2 Cache • Extended temperature modules 2.0V (Core)/3.3V (I/0) for


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    755E/8Mbit WED3C755E8M-XBX 128Kx72 25x21mm, 525mm2. WED3C755E8M-XBX x64/x72 WED3C755E8M MIF2032 with or without underfill WED3C7410E16M-400BX WED3C750A8M-200BX WED3C7558M-XBX 21mmx25mm PDF