CMOS Process Family
Abstract: 0.6 um cmos process
Text: 4 Micron CMOS Process Family February 1996 Features • • • • • • Process Parameters Double Poly / Double Metal 8 µm Poly and Metal Pitch 10 Volts Maximum Operating Voltage 15 Volts High Voltage Option Isolated Vertical PNP Bipolar Module Low TCR Resistor Module
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-10mA
CMOS Process Family
0.6 um cmos process
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micron resistor TCR
Abstract: CMOS Process Family micron resistor 1.2 Micron CMOS Process Family
Text: 5 Micron CMOS Process Family June 1995 Process Parameters Features • Double Poly / Double Metal • 10 µm Poly and Metal Pitch • Low TCR Resistor Module Description The Mitel 5µm process is a double poly/double metal CMOS process with an operating voltage range from
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50x50
micron resistor TCR
CMOS Process Family
micron resistor
1.2 Micron CMOS Process Family
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P-MOSFET
Abstract: mosfet 4800 micron resistor 0.6 um cmos process 3-Micron-CMOS-Process 4800 mosfet MOSFET dynamic parameters 1.2 Micron CMOS Process Family
Text: 3 Micron CMOS Process Family June 1995 Process Parameters Features • Double Poly / Double Metal • 6 µm Poly Pitch; 7 µm Metal Pitch • 7 Volts Maximum Operating Voltage • 2.7~3.6 Volts Low Voltage Option • 10 Volts High Voltage Option • Low TCR Resistor Module
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Untitled
Abstract: No abstract text available
Text: AP5025 8 Watt Current Sense Chip Resistors A very high power current sense chip resistor capable of dissipating 8 watts with recommended thermal management architecture on the PCB. • Power Dissipation 8 watts with 700 micron PCB thermal Pad • Low resistance values
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AP5025
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RESISTOR 5025 1W
Abstract: R002F RESISTOR 5025 R005-F R003F r005f micron marking code information r001 175C R001F
Text: 8W CURRENT DETECT CHIP RESISTORS Features…………………………………………………………. Non inductive design. Low TCR, typically less than 30ppm/°C. Low profile surface mount package. Excellent pulse/surge performance. 8W power rating.
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30ppm/
RESISTOR 5025 1W
R002F
RESISTOR 5025
R005-F
R003F
r005f
micron marking code information
r001
175C
R001F
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R005F
Abstract: R002F r001f R003F RESISTOR 5025 1W RESISTOR 5025 R004F R005-F RESISTOR 5025 8W r001
Text: 8W CURRENT DETECT CHIP RESISTORS Features…………………………………………………………. Non inductive design. Low TCR, typically less than 30ppm/°C. Low profile surface mount package. Excellent pulse/surge performance. 8W power rating.
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30ppm/
R005F
R002F
r001f
R003F
RESISTOR 5025 1W
RESISTOR 5025
R004F
R005-F
RESISTOR 5025 8W
r001
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equivalent of 662K
Abstract: MICRON POWER RESISTOR MLS micron fuse resistors mps 0851 MICRON POWER RESISTOR 24W 662k MPR 55 F resistor ceramic MDS-1212 ML10L meg05n
Text: Micron Power Resistors Part Numbering System M N S Type MP - Pin terminal MH - Lug terminal MN - Vertical lead terminal MNS 0 5 Rated power 02 - 2W 10 - 10W 15 - 15W Element G-wire -wound type ceramic core S-Wire -wound type. (glass fiber core) R-Metal Oxide Film
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0.6 um cmos process
Abstract: CMOS Process Family micron resistor TCR 1.2 Micron CMOS Process Family
Text: 3 Micron CMOS Process Family February 1996 Features • • • • • • Process Parameters LOVMOS Process 2.7~3.6 Volts Low Voltage Option Double Poly / Double Metal 6 µm Poly Pitch; 7 µm Metal Pitch 7 Volts Maximum Operating Voltage 10 Volts High Voltage Option
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fam10-04
0.6 um cmos process
CMOS Process Family
micron resistor TCR
1.2 Micron CMOS Process Family
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CMOS Process Family
Abstract: 1.5um cmos process family
Text: 1.5 Micron CMOS Process Family February 1996 Features Technology Outline • • • • • • • • LOVMOS Processes 2.7~3.6 Volts Low Voltage Option 1.2 Volts Very Low Voltage Option 5.5 Volts Maximum Operating Voltage Double Poly / Double Metal
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r001f
Abstract: No abstract text available
Text: 8W Current Sense Chip Resistors BCS 8 Series • Non inductive design. · Low TCR, typically less than 100ppm/°C. · Low profile surface mount package. · Excellent pulse/surge performance. · 8W power rating. Applications · Current sense applications · Over current protection in Battery chargers.
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100ppm/
R001F
r001f
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Untitled
Abstract: No abstract text available
Text: 8W Current Sense Chip Resistors BCS 8 Series • · · · · Non inductive design. Low TCR, typically less than 100ppm/°C. Low profile surface mount package. Excellent pulse/surge performance. 8W power rating. Applications Current sense applications Over current protection in Battery chargers.
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100ppm/Â
R001ance
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CMOS Process Family
Abstract: P-MOSFET transistor P-MOSFET process of mosfet micron resistor
Text: 2 Micron CMOS Process Family June 1995 Process Parameters Features • Double Poly / Double Metal • 4 µm Poly and Metal I Pitch • 320 ps Delay per stage Ring Osc. • 5.5 Volts Maximum Operating Voltage • 2.7~3.6 Volts Low Voltage Option • Shrinkable to Mitel 1.5µm Process
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p-mosfet
Abstract: Bipolar Junction Transistor MOSFET 1000 VOLTS p7094 0.7 um CMOS process parameters
Text: 4 Micron CMOS Process Family June 1995 Process Parameters Features 4µm 4µm • Double Poly / Double Metal • 8 µm Poly and Metal Pitch • 10 Volts Maximum Operating Voltage Metal I pitch width/space 4/4 4 /4 µm • 15 Volts High Voltage Option
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-10mA
p-mosfet
Bipolar Junction Transistor
MOSFET 1000 VOLTS
p7094
0.7 um CMOS process parameters
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micron resistor
Abstract: CMOS Process Family
Text: 2 Micron CMOS Process Family February 1996 Features • • • • • • • • • Process Parameters Double Poly / Double Metal 4 µm Poly and Metal I Pitch 320 ps Delay per stage Ring Osc. 5.5 Volts Maximum Operating Voltage 2.7~3.6 Volts Low Voltage Option
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1.2 Micron CMOS Process Family
Abstract: CMOS Process Family 5-Micron-CMOS-Process 1.5um cmos process family 0.6 um cmos process
Text: 1.5 Micron CMOS Process Family June 1995 Features Process Parameters • Double Poly / Double Metal • 3 µm Poly and Metal I Pitch • 5.5 Volts Maximum Operating Voltage • 2.7~3.6 Volts Low Voltage Option • 1.5µm Process Parameters 5volts & 3volts
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Untitled
Abstract: No abstract text available
Text: ALA400/401 LINEAR ARRAY Description The ALA400/401 Linear Array Family is fabricated using the complementary bipolar integrated circuit CBIC process that offers the advantages of vertical NPN and vertical PNP transistors. CBIC technology offers the advantage of
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ALA400/401
ALA400/401
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Untitled
Abstract: No abstract text available
Text: ALA300/301 9Q-V0LT LINEAR ARRAYS Description The ALA300/301 Linear Arrays provide design engineers the means to obtain 90 V semi-custom integrated circuits. The single-module array ALA300 consists of 13 vertical NPN and 15 vertical PNP transistors, three 6 pF capacitors, and 1k
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ALA300/301
ALA300/301
ALA300)
ALA301)
90-VQLT
90-VOLT
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Untitled
Abstract: No abstract text available
Text: * AT&T Preliminary Data Sheet ALA400/401 Linear Array Family Description The ALA400/401 Linear Array Family is fabricated using the complementary bipolar integrated circuit CBIC process that offers the advantages of vertical NPN and vertical PNP transistors. CBIC technology
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ALA400/401
51AL230240
D-8000
DS87-61LBC
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pnp 8 transistor array
Abstract: ALA400 transistor BIPOLAR npn 8 transistor array 1000 volt pnp transistor JFET 401 ARRAY resistor DS87-61LBC kss 216 complementary JFET
Text: AT&T Preliminary Data Sheet ALA400/401 Linear Array Fam ily Description The ALA400/401 Linear Array Family is fabricated using the complementary bipolar integrated circuit CBIC process that offers the advantages of vertical NPN and vertical PNP transistors. CBIC technology
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ALA400/401
51AL230240
D-8000
DS87-61LBC
pnp 8 transistor array
ALA400
transistor BIPOLAR
npn 8 transistor array
1000 volt pnp transistor
JFET 401
ARRAY resistor
DS87-61LBC
kss 216
complementary JFET
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Untitled
Abstract: No abstract text available
Text: lAiur Data Sheet Linear Array 005152 Benefits • High-frequency performance, typical fî of 350 MHz for NPN and 300 MHz for PNP transistors ■ 30 volt capability ■ Low development costs ■ Quick design turnaround, typically six to eight weeks from design
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LA400
50AL203140
DS86-352LBC
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BD 104 NPN
Abstract: pnp 8 transistor array LA400 npn 8 transistor array BD+104+NPN
Text: AT&T Data Sheet oo5i 52 ^ ss Benefits • High-frequency performance, typical fr of 350 MHz for NPN and 300 MHz for PNP transistors ■ 30 volt capability ■ Low development costs ■ Quick design turnaround, typically six to eight weeks from design approval
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LA400
50AL203140
DS86-352LBC
BD 104 NPN
pnp 8 transistor array
npn 8 transistor array
BD+104+NPN
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pnp 8 transistor array
Abstract: ALA401 Boron 220 resistor array ALA402 RESISTORS transistor array pnp npn 8 transistor array GL RESISTOR ARRAY
Text: A T & T MELEC I C 2SE D • G0 5 G 0 2 b 000^54 1 Preliminary Data Sheet ALA401/402 Semicustom Linear Arrays Description The ALA401/402 Semicustom Linear Arrays are fabricated using a complementary bipolar integrated cir cuit (CBIC) process that offers the advantages of vertical NPN and PNP transistors. CBIC technology
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005005b
0002T54
ALA401/402
ALA401
ALA402
5002b
100x10-3
pnp 8 transistor array
Boron
220 resistor array
RESISTORS
transistor array pnp
npn 8 transistor array
GL RESISTOR ARRAY
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pnp 8 transistor array
Abstract: BD 104 NPN LA400 ARRAY resistor npn 8 transistor array transistor array pnp bD 106 transistor
Text: AT&T Data Sheet ^ ss oo5i 52 Benefits • High-frequency performance, typical fr of 350 MHz for NPN and 300 MHz for PNP transistors ■ 30 volt capability ■ Low development costs ■ Quick design turnaround, typically six to eight weeks from design approval
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LA400
rev400
50AL203140
DS86-352LBC
pnp 8 transistor array
BD 104 NPN
ARRAY resistor
npn 8 transistor array
transistor array pnp
bD 106 transistor
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K1HC
Abstract: No abstract text available
Text: b l 1 1 5 Ml Q Q 1 Q D 3 S fiflfl • URN ADVANCE MT9LD T 272 C 2 MEG X 72 DRAM MODULE MICRON M SEMICONDUCTOR INC. DRAM MODULE 2 MEG X 72 DRAM ECC, 3.3V FAST PAGE MODE FEATURES PIN ASSIGNMENT (Top View) • Industry-standard ECC pinout in a 168-pin, dual read
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168-pin,
800mW
048-cycle
84-Position
168-Pin
K1HC
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