MIL-PRF-8351
Abstract: micro-d connectors SOURIAU 8351 MICRO-D 51 CONNECTORS
Text: Hermetic Micro-D The only Laser Weldable Hermetic Micro-D with Copper Contacts Ultra rugged, compact, lightweight hermetic micro-Ds with copper alloy contacts with a leak rate less than 10-9 atm.cm³/s. These connectors are capable of performing at extreme temperatures and are built to exceed
|
Original
|
PDF
|
MIL-PRF-8351
WMAEMICRODHP00401EN
MIL-PRF-8351
micro-d connectors
SOURIAU
8351
MICRO-D 51 CONNECTORS
|
SD472
Abstract: No abstract text available
Text: DESCRIPTION A EWR 06-413 BY APPD DATE DCam .276 7.01 1. FOR GENERAL SERIES SPECIFICATIONS, SEE SD47-0000. REV PSM 07/27/05 NOTES: UNLESS OTHERWISE SPECIFIED 2. MATERIAL AND FINISHES: BODY : BRASS PER ASTM B16, GOLD 15 MICRO OVER COPPER CONTACT: COPPER ALLOY, GOLD 30 MICRO OVER COPPER
|
Original
|
PDF
|
SD47-0000.
D1710
RG178,
RG196
472-900-0360J
5M-1994
RG-316
SD472-900-0360J
SD472
|
Untitled
Abstract: No abstract text available
Text: AD-V8V8 50Ω ø11 ø.433 SHV Jack To SHV Jack 50 (1.969) Parts Material Plating (Micro-inch) Lock Washer Brass Tin-Zinc-Copper-Alloy 100 Over Copper 50 Contact Pin Brass Gold 10 Over Nickel 50 Over Copper 50 Insulator Teflon Body Brass Tin-Zinc-Copper-Alloy 100 Over Copper 50
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: TNC9100-L400 ø9.6 ø.378 ø7.5 (ø.295) 7/16-28UNEF TNC Reverse Polarity Jack Crimp 50Ω 38.3 (1.508) NOTE: REVERSE POLARITY JACK Parts Material Plating(Micro-inch) Ferrule Brass Tin-Zinc-Copper-Alloy 100 Over Copper 50 Barrel Brass Tin-Zinc-Copper-Alloy 100 Over Copper 50
|
Original
|
PDF
|
TNC9100-L400
7/16-28UNEF
JBY400
|
MLDM Low Profile Metal Shell Micro-D Solid Wire Termination
Abstract: MLDM2L
Text: Micro-D Double and Triple Row MLDM Low Profile Metal Shell Micro-D Solid Wire Termination Low profile MLDM connectors have reduced flange height compared to standard MWDM Micro-D connectors. These .050" pitch Micro-D connectors are supplied with solid copper
|
Original
|
PDF
|
MILDTL-83513.
MLDM Low Profile Metal Shell Micro-D Solid Wire Termination
MLDM2L
|
C5210
Abstract: 302206S 302208S
Text: Dual Row Multi Port Right Angle s s s Standard contact plating is 15 micro inches of gold. For optional platings add dash number as follows: -30 = 30 Micro inches -50 = 50 Micro inches s s Materials Shielded: Housing: 0.25mm Thickness Copper Alloy with Tin Plated
|
Original
|
PDF
|
C5210.
302201S
302202S
302204S
302206S
302208S
302201ST
302202ST
30tional
C5210
302206S
302208S
|
Untitled
Abstract: No abstract text available
Text: 8270 Micro USB Verbinder - SMT Micro USB Connector - SMT W+P PRODUCTS Technische Daten /Technical Data Isolierkörper Thermoplastischer Kunststoff, nach UL94 V-0 Insulator Thermoplastic, rated UL94 V-0 Kontaktmaterial Kupferlegierung Contact Material Copper alloy
|
Original
|
PDF
|
IEC512-12A
100VAC
JSTD-020C
|
Untitled
Abstract: No abstract text available
Text: Micro Miniature Pushbuttons with Tactile Feel “Right Angle” FSMRAJ Series MATERIAL SPECIFICATIONS: TYPICAL PERFORMANCE CHARACTERISTICS: Contacts .Copper alloy, silver plate
|
Original
|
PDF
|
-350g
|
FSMRACDA
Abstract: No abstract text available
Text: Micro Miniature Pushbuttons with “Square Button” FSMCD/A & FSMRACD/A MATERIAL SPECIFICATIONS: TYPICAL PERFORMANCE CHARACTERISTICS: Contacts .Copper alloy, silver plate
|
Original
|
PDF
|
|
G111P
Abstract: G103P GMPM E113 G103
Text: Micro-D Combo Combo Solder Cup Micro-D for High Power Applications 13 Amp Current Rating – Combo Micro-D's combine the size and weight advantages of a Micro -D connector with the added ability to handle higher power needs. Solder Cup Contacts – Gold plated beryllium copper
|
Original
|
PDF
|
MILDTL-83513
B112P
B112R
D112P
D112R
D113P
D113R
E113P
E113R
G101P
G111P
G103P
GMPM E113
G103
|
Untitled
Abstract: No abstract text available
Text: Micro-D Combo Combo Solder Cup Micro-D for High Power Applications 13 Amp Current Rating – Combo Micro-D's combine the size and weight advantages of a Micro -D connector with the added ability to handle higher power needs. Solder Cup Contacts – Gold plated beryllium copper
|
Original
|
PDF
|
MILDTL-83513
|
D113P
Abstract: E113P GMPM 5 G101 GMPM E113 G103P G111P magnetic head 2mm D112R Hysol ee4215 MAGNETIC HEAD
Text: Micro-D Combo Combo Solder Cup Micro-D For High Power Applications 13 Amp Current Rating – Combo Micro-D's combine the size and weight advantages of a Micro -D connector with the added ability to handle higher power needs. A Solder Cup Contacts – Gold plated beryllium copper
|
Original
|
PDF
|
MILDTL-83513
06324/0CA77
D113P
E113P
GMPM 5 G101
GMPM E113
G103P
G111P
magnetic head 2mm
D112R
Hysol ee4215
MAGNETIC HEAD
|
solder cup awg 16
Abstract: No abstract text available
Text: Section E Combo Micro-D For High Power Applications OVERVIEW AND PRODUCT SELECTION GUIDE Aluminum Alloy Shell Aluminum Alloy Shell Gold Plated Four Tine Beryllium Copper Power Contact LCP Thermoplastic Insulator Standard Micro-D Socket Contact .079 Inch 2mm
|
Original
|
PDF
|
06324/0CA77
solder cup awg 16
|
15j 5kv
Abstract: FSM 23
Text: Micro Miniature Vertical Pushbuttons with Tactile Feel & ESD Grounding Terminal FSMJ Series MATERIAL SPECIFICATIONS: TYPICAL PERFORMANCE CHARACTERISTICS: Contacts .Copper alloy, silver plate
|
Original
|
PDF
|
|
|
|
micro SD connector
Abstract: SD connector Micro SD
Text: Amphenol Micro SD Connector 1. Material: Contact: Alloy copper Shell:Alloy copper Insulator: High temperature. Thermoplastic, UL94V-0, 30%glass-filled. 2. Finish : Contact:0.38 micron gold plated at mating area. 4 micron Tin plated on solder tails. Shell:1.25 micron Tin plater overall.
|
Original
|
PDF
|
UL94V-0,
TF-PA-01-001-X
micro SD connector
SD connector
Micro SD
|
Untitled
Abstract: No abstract text available
Text: MMS Series Slide Switches, Micro Size, Instrumentation Grade B MATERIAL SPECIFICATIONS: TYPICAL PERFORMANCE CHARACTERISTICS: Contacts .Silver over nickel over copper alloy Case Material .Polyacetal UL94HB
|
Original
|
PDF
|
UL94HB
MMS43R
MMS43R
|
Untitled
Abstract: No abstract text available
Text: Micro-D Double and Tri ple Row Low Proile Metal and Plastic Shell Micro-D MWDL Plastic Shell Solid Wire Termination Low Proile MWDL Plastic Shell Micro-D with Solid Wire Termination These all-plastic MWDL connectors are supplied with single strand copper wire. Contacts
|
Original
|
PDF
|
MIL-DTL-83513.
MWDL-13
|
Untitled
Abstract: No abstract text available
Text: Combo Solder Cup Micro-D For High Power Applications 13 Amp Current Rating – Combo Micro-D's combine the size and weight advantages of a Micro -D connector with the added ability to handle higher power needs. Solder Cup Contacts – Gold plated beryllium copper
|
Original
|
PDF
|
MILDTL-83513
B112P
B112R
D112P
D112R
D113P
D113R
E113P
E113R
G101P
|
G111P
Abstract: No abstract text available
Text: Combo Solder Cup Micro-D For High Power Applications 13 Amp Current Rating – Combo Micro-D's combine the size and weight advantages of a Micro -D connector with the added ability to handle higher power needs. Solder Cup Contacts – Gold plated beryllium copper
|
Original
|
PDF
|
MILDTL-83513
B112P
B112R
D112P
D112R
D113P
D113R
E113P
E113R
G101P
G111P
|
plating microinch
Abstract: AD-B8B8-75
Text: AD-B8B8 50Ω BNC Jack To BNC Jack 32.5 1.280 Typical VSWR Part Number AD-B8B8 1 Ghz 1.16 2 Ghz 1.16 3 Ghz 1.16 Parts Material Plating (Micro-inch) Contact Pin Phosphor Bronze Gold 10 Over Nickel 50 Over Copper 50 Insulator Teflon Body Brass Tin-Zinc-Copper-Alloy 100 Over Copper 50
|
Original
|
PDF
|
AD-B8B8-75
plating microinch
AD-B8B8-75
|
Untitled
Abstract: No abstract text available
Text: Micro-D Combo GMPM Combo Micro-D for High Power Applications Solder Cup 13 Amp Current Rating– Combo Micro-D's combine the size and weight advantages of a Micro -D connector with the added ability to handle higher power needs. Solder Cup Contacts– Gold plated beryllium copper power
|
Original
|
PDF
|
MILDTL-83513
-g111p
|
micro-x
Abstract: Micro-X Marking E MP86E MP86 MSL Rating micro-x marking 3
Text: v01.1103 MP86 E – 4 LEAD PLASTIC MICRO-P PLASTIC PACKAGE (A.K.A. MICRO-X) PACKAGE OUTLINES MP86 (E) Package Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
|
Original
|
PDF
|
MP86E
micro-x
Micro-X Marking E
MP86E
MP86
MSL Rating
micro-x marking 3
|
Untitled
Abstract: No abstract text available
Text: Amphenol Micro SD Card Conn. 1.Materials: Housing: High temperature thermoplastic, UL 94V-0 rated. Contact: Copper alloy Cover: SUS304 Ground: Copper alloy selective gold 1u" flash plating, over nickel plating 50U" min 2.Contact finish: Selective 1~15u" gold on contact area plating,
|
Original
|
PDF
|
SUS304
100VAC
500VAC
250VAC
1000Mâ
500VDC
100mCopper
|
Untitled
Abstract: No abstract text available
Text: 1 6174 SER IES NOTE 1 1 MICRO SD TRANS FLASH CARD SOCKET F L IP - U P TYPE 1.MATERIAL : HOUSING : HIGH TEMPERATURE PLASTIC(UL94V-0), BLACK. COVER : HIGH TEMPERATURE PLASTIC(UL94V-0), BLACK TERMINAL : COPPER ALLOY. GROUND-LEG : COPPER ALLOY. SHELL : STAINLESS STEEL.
|
OCR Scan
|
PDF
|
UL94V-0)
G6174-5500*
AK0509007
AK0509021
AK0601018
|
