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    Text: PDF: 2003 Jun 19 Philips Semiconductors PC board footprint HBCC32; SOT560-1 FOOTPRINT REFLOW SOLDERING handbook, full pagewidth PA = OA = 5.40 (2x) 3.05 (2×) 2.55 (2×) 1.275 (2×) solder lands solder resist 0.075 clearance 0.50 (24×) 0.150 solder paste


    Original     		PDF HBCC32; OT560-1 MGX375