ECHO schematic diagrams
Abstract: No abstract text available
Text: Preliminary GS8170LW18/36/72C-333/300/250 18Mb Σ1x1 Late Write SigmaRAM SRAM 209-Bump BGA Commercial Temp Industrial Temp 250 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Late Write mode • Pipeline read operation • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170LW18/36/72C-333/300/250
209-Bump
209-bump,
8170LW18
ECHO schematic diagrams
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U8 100E
Abstract: BGA2002 ECHO schematic diagrams GS8170DD36C-300 GS8170DD36C-333
Text: Preliminary GS8170DD18/36C-333/300/250 18Mb Σ1x2Lp Double Data Rate SigmaRAM SRAM 209-Bump BGA Commercial Temp Industrial Temp 250 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Double Data Rate Read and Write mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170DD18/36C-333/300/250
209-Bump
209-bump,
209-Pin
GS8170DD18C-333I
GS8170DD18C-300I
GS8170DD18C-250I
U8 100E
BGA2002
ECHO schematic diagrams
GS8170DD36C-300
GS8170DD36C-333
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Untitled
Abstract: No abstract text available
Text: Preliminary GS8170EW18/36/72C-333/300/250 18Mb Σ1x1 Early Write SigmaRAM SRAM 209-Bump BGA Commercial Temp Industrial Temp 250 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Early Write mode • User-configurable pipeline and flow through operation
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Original
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PDF
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GS8170EW18/36/72C-333/300/250
209-Bump
8170EW18
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ECHO schematic diagrams
Abstract: flip chip bga 0,8 mm
Text: Preliminary GS8170DW18/36/72C-333/300/250 18Mb Σ1x1 Double Late Write SigmaRAM SRAM 209-Bump BGA Commercial Temp Industrial Temp 250 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Double Late Write mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170DW18/36/72C-333/300/250
209-Bump
209-bump,
8170DW18
ECHO schematic diagrams
flip chip bga 0,8 mm
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Untitled
Abstract: No abstract text available
Text: GS8170LW36/72C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM 200 MHz–333 MHz 1.8 V VDD 1.8 V I/O Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170LW36/72C-333/300/250/200
209-Bump
209-bump,
144Mb
8170LW18
|
GS8170DW72C-250
Abstract: GS8170DW72C-300 GS8170DW72C-333 GS8170DW72C-333I
Text: GS8170DW36/72C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Dp CMOS I/O Double Late Write SigmaRAM Features 200 MHz–333 MHz 1.8 V VDD 1.5 V or 1.8 V I/O Functional Description • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170DW36/72C-333/300/250/200
209-Bump
209-bump,
8170W18
GS8170DW72C-250
GS8170DW72C-300
GS8170DW72C-333
GS8170DW72C-333I
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GS8170DW36C-200
Abstract: GS8170DW36C-250 GS8170DW36C-300 GS8170DW36C-333
Text: Preliminary GS8170DW36/72C-333/300/250/200 18Mb Σ1x1Dp CMOS I/O 209-Bump BGA Commercial Temp Industrial Temp 200 MHz–333 MHz 1.8 V VDD 1.8 V I/O Double Late Write SigmaRAM Features • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170DW36/72C-333/300/250/200
209-Bump
209-bump,
8170LW18
GS8170DW36C-200
GS8170DW36C-250
GS8170DW36C-300
GS8170DW36C-333
|
Untitled
Abstract: No abstract text available
Text: Preliminary GS8170DW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Dp CMOS I/O Double Late Write SigmaRAM 250 MHz – 350 MHz 1.8 V VDD 1.8 V I/O Features • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170DW36/72AC-350/333/300/250
209-Bump
209-bump,
144Mb
8170DWxxA
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GS8170LW72AC-300I
Abstract: GS8170LW36AC-300I GS8170LW36AC-250I GS8170LW72AC-250I GS8170LW36AC-350 GS8170LW36AC-250 GS8170LW36AC-300 GS8170LW36AC-333
Text: GS8170LW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM 250 MHz–350 MHz 1.8 V VDD 1.8 V I/O Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170LW36/72AC-350/333/300/250
209-Bump
209-bump,
36nology
8170LWxxA
GS8170LW72AC-300I
GS8170LW36AC-300I
GS8170LW36AC-250I
GS8170LW72AC-250I
GS8170LW36AC-350
GS8170LW36AC-250
GS8170LW36AC-300
GS8170LW36AC-333
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GS8170LW36AC-250
Abstract: GS8170LW36AC-300 GS8170LW36AC-333 GS8170LW36AC-350
Text: GS8170LW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM 250 MHz–350 MHz 1.8 V VDD 1.8 V I/O Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170LW36/72AC-350/333/300/250
209-Bump
209-bump,
8170LWxxA
GS8170LW36AC-250
GS8170LW36AC-300
GS8170LW36AC-333
GS8170LW36AC-350
|
Untitled
Abstract: No abstract text available
Text: Preliminary GS8170LW36/72AC-350/333/300/250 18Mb Σ1x1Lp CMOS I/O 209-Bump BGA Commercial Temp Industrial Temp 250 MHz – 350 MHz 1.8 V VDD 1.8 V I/O Late Write SigmaRAM Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170LW36/72AC-350/333/300/250
209-Bump
209-bump,
GS817xx72C-300T.
8170LWxxA
|
Untitled
Abstract: No abstract text available
Text: GS8170LW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM 250 MHz–350 MHz 1.8 V VDD 1.8 V I/O Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170LW36/72AC-350/333/300/250
209-Bump
209-bump,
packag0LW36/72AC-350/333/300/250
8170LWxxA
|
ECHO schematic diagrams
Abstract: GS8170DD36 GS8170DD36C-250 GS8170DD36C-300 GS8170DD36C-300I GS8170DD36C-333 GS8170DD36C-333I
Text: GS8170DD36C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x2Lp CMOS I/O Double Data Rate SigmaRAM Features • Double Data Rate Read and Write mode • Late Write; Pipelined read operation • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170DD36C-333/300/250/200
209-Bump
209-bump,
144Mb
8170DD18
ECHO schematic diagrams
GS8170DD36
GS8170DD36C-250
GS8170DD36C-300
GS8170DD36C-300I
GS8170DD36C-333
GS8170DD36C-333I
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GS8170DW36AC-250
Abstract: GS8170DW36AC-300 GS8170DW36AC-333 GS8170DW36AC-350 GS8170DW36AC-350I
Text: GS8170DW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Dp CMOS I/O Double Late Write SigmaRAM 250 MHz–350 MHz 1.8 V VDD 1.8 V I/O Features • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170DW36/72AC-350/333/300/250
209-Bump
209-bump,
8170DWxxA
GS8170DW36AC-250
GS8170DW36AC-300
GS8170DW36AC-333
GS8170DW36AC-350
GS8170DW36AC-350I
|
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Untitled
Abstract: No abstract text available
Text: High IP3 Frequency Mixer HJK-481H+ Level 17 LO Power +17 dBm 345 to 480 MHz Maximum Ratings Operating Temperature Features -45°C to 85°C Storage Temperature LO Power +19 dBm RF Power +20 dBm CASE STYLE: TTT881 PRICE: $10.95 ea. QTY. (1-9) • high IP3, 32 dBm typ.
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Original
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PDF
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HJK-481H+
TTT881
2002/95/EC)
14dBm
14dBm
|
Untitled
Abstract: No abstract text available
Text: Preliminary GS8170LW36/72C-333/300/250/200 18Mb Σ1x1Lp CMOS I/O 209-Bump BGA Commercial Temp Industrial Temp 200 MHz–333 MHz 1.8 V VDD 1.8 V I/O Late Write SigmaRAM Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170LW36/72C-333/300/250/200
209-Bump
209-bump,
72and
8170LW18
|
Untitled
Abstract: No abstract text available
Text: High IP3 Frequency Mixer HJK-481H+ Level 17 LO Power +17 dBm 345 to 480 MHz Maximum Ratings Operating Temperature Features -45°C to 85°C Storage Temperature LO Power +19 dBm RF Power +20 dBm CASE STYLE: TTT881 PRICE: $10.95 ea. QTY. (1-9) • high IP3, 32 dBm typ.
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Original
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PDF
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HJK-481H+
TTT881
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GS8170DD36
Abstract: GS8170DD36AC-200 GS8170DD36AC-250 GS8170DD36AC-300
Text: Preliminary GS8170DD36C-333/300/250/200 18Mb Σ1x2Lp CMOS I/O 209-Bump BGA Commercial Temp Industrial Temp 200 MHz–333 MHz 1.8 V VDD 1.8 V I/O Double Data Rate SigmaRAM Features • Double Data Rate Read and Write mode • Late Write; Pipelined read operation
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Original
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PDF
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GS8170DD36C-333/300/250/200
209-Bump
209-bump,
GS8170DD36AC-300I
GS8170DD36AC-250I
GS8170DD36AC-200I
GS817xx72C-300T.
GS8170DD36
GS8170DD36AC-200
GS8170DD36AC-250
GS8170DD36AC-300
|
Untitled
Abstract: No abstract text available
Text: GS8170DW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Dp CMOS I/O Double Late Write SigmaRAM 250 MHz–350 MHz 1.8 V VDD 1.8 V I/O Features • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8170DW36/72AC-350/333/300/250
209-Bump
209-bump,
pi0DW36/72AC-350/333/300/250
8170DWxxA
|
Untitled
Abstract: No abstract text available
Text: GS8171DW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Dp HSTL I/O Double Late Write SigmaRAM 250 MHz–350 MHz 1.8 V VDD 1.5 V I/O Features • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8171DW36/72AC-350/333/300/250
209-Bump
209-bump,
8171DWxxA
|
GS8171DW72AC-300I
Abstract: GS8171DW72AC-250I GS8171DW36AC-300I GS8171DW72AGC-350 GS8171DW36AC-250I GS8171DW72AC-250 GS8171DW72AC-300 GS8171DW72AC-333 GS8171DW72AC-350 GS8171DW72AC-350I
Text: GS8171DW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Dp HSTL I/O Double Late Write SigmaRAM 250 MHz–350 MHz 1.8 V VDD 1.5 V I/O Features • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package
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Original
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PDF
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GS8171DW36/72AC-350/333/300/250
209-Bump
209-bump,
8171DWxxA
GS8171DW72AC-300I
GS8171DW72AC-250I
GS8171DW36AC-300I
GS8171DW72AGC-350
GS8171DW36AC-250I
GS8171DW72AC-250
GS8171DW72AC-300
GS8171DW72AC-333
GS8171DW72AC-350
GS8171DW72AC-350I
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HJK-481H
Abstract: ED135 HJK-481 TTT881 M1202 41310 M12-022 44910 HJK-4
Text: High IP3 Frequency Mixer HJK-481H+ Level 17 LO Power +17 dBm 345 to 480 MHz Maximum Ratings Operating Temperature Features -45°C to 85°C Storage Temperature LO Power +19 dBm RF Power +20 dBm CASE STYLE: TTT881 PRICE: $10.95 ea. QTY. (1-9) • high IP3, 32 dBm typ.
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Original
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PDF
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HJK-481H+
TTT881
2002/95/EC)
14dBm
HJK-481H
ED135
HJK-481
TTT881
M1202
41310
M12-022
44910
HJK-4
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U9AN
Abstract: No abstract text available
Text: Product Preview GS832418A B/C /GS832436A(B/C)/GS832472A(C) 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs 119- and 209-Pin BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable (x36 and x72)
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Original
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PDF
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GS832418A
/GS832436A
/GS832472A
209-Pin
x36/x72
832418A
U9AN
|
anzac mixers
Abstract: MCL TFM-2 "RF Mixers" ANZAC anzac md-108 anzac MD-109 Anzac relay md 5-t Anzac MD-141 Anzac T-1000 pin configuration for FP 1016
Text: M/ A - C OM INC/ ANZAC DIV 14 E D S b 42177 0003325 4 D O U BLÉ BALAN CED M I X E R ^ ^ C : lìVlÒDEÈ MD-40Ö’ LO Power +7 dBm 4-Pin Half Relay Header MCL Model TFM-2 Replacement Guaranteed Specifications* From -5 5 °C to +85°C _ Frequency Range
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OCR Scan
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PDF
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D-400*
Sb42177
DC-1000
anzac mixers
MCL TFM-2
"RF Mixers" ANZAC
anzac md-108
anzac MD-109
Anzac
relay md 5-t
Anzac MD-141
Anzac T-1000
pin configuration for FP 1016
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