senju m705 solder paste
Abstract: Solder bar of Senju M705 M705-221BM5-42-11
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-5-14-A
senju m705 solder paste
Solder bar of Senju M705
M705-221BM5-42-11
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4E *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-7-14-A
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Front Flip Lock Actuator
Abstract: No abstract text available
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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FH29B
Front Flip Lock Actuator
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Senju M705
Abstract: M705 solder paste senju m705 solder paste
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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CL580-3700-8-00
Abstract: M705-221CM5
Text: 0.5 mm Pitch, 1.5 mm Above-the-Board, High-Speed Transmission FPC Connector FH55 Series FH55 Differential Impedance 70ps rise time 20-80% 100+15%[ø] 100[ø] 100-15%[ø] Dimensional Diagram: 40 pins •Characteristics 4 mm (mounting area) 23.4mm 1.FPC Connector for High-Speed Transmission
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Untitled
Abstract: No abstract text available
Text: 㩷 Doc. No. DG-097016C ISSUED March 05, 2010 SYSTEM DEVICE DIVISION Υ ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION ᭽ᦠ SPECIFICATIONS ຠฬ 㕙ታⵝဳ LED Product name Surface Mount LED ᒻฬ GM2BB40BM0C Model No. 㪩㪼㪽㪼 㔚ሶ࠺ࡃࠗࠬᬺᧄㇱ
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DG-097016C
GM2BB40BM0C
DG-097016C
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Untitled
Abstract: No abstract text available
Text: Doc. No. DG-104023 ISSUED May 6, 2010 SYSTEM DEVICE DIVISION Ⅲ ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BB45BMAC Model No. R e f e re n c 電子デバイス事業本部
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DG-104023
GM2BB45BMAC
DG-104023
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Senju
Abstract: senju m705 solder paste M705 solder paste
Text: 0.3mm Contact Pitch, 1.25mm above the board, Flexible Printed Circuit Connectors FH 23 Series ●Staggered termination configuration. Only 1.25 mm above the board. Leadless type Completely enclosed bottom surface Lead type 1.25mm •Features 1. FPC low insertion force and high holding force
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Senju paste 7100
Abstract: M705-221CM5 40 pin zif connector 1mm FPC LCD 40 pin zif connector 1mm FPC Senju 7100 reflow profile 1mm 30 pin fpc connector Senju 1mm 40 pin fpc connector 32 PIN FPC CONNECTOR FH26-13S-0.3SHW
Text: 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors FH26 Series 1.0mm ●Space saving 51 pos. shown 3.2mm 16.8mm Metal fittings do no protrude outside of the connector body •Features 1. Extremely light weight ●Can be mounted over conductive traces.
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NCP18XH103D0SRB
Abstract: heraeus pc 3000 NCG18XH103 NCP15XH103D0SRC NCP18WF104D0SRB NCG18XH103F0SRB Senju M705-grn360-k2-v NXFS15XH103 PRF18BE471QS5RB BC 5609
Text: !Note • Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
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R03E-6
NCP18XH103D0SRB
heraeus pc 3000
NCG18XH103
NCP15XH103D0SRC
NCP18WF104D0SRB
NCG18XH103F0SRB
Senju M705-grn360-k2-v
NXFS15XH103
PRF18BE471QS5RB
BC 5609
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Solder bar of Senju M705
Abstract: Senju M705 solder bar Senju ESR-250 Senju M705 safety senju M705-221BM5-42-11 senju m705 solder wire solder paste m705 EIAJ C-3 Senju M705 material safety senju m705 solder wire 0.5 mm
Text: Technical Document LED Specification EC/Opto Group GM2BB50BM0C LED for Lighting Applications Product Specification December 2010 “Double Dome” Module: High-output, 5000 K LED Module 52 lm High Color Rendering (85 CRI) suited for lighting applications
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GM2BB50BM0C
rDG-097015D
GM2BB50BM0C
DG-097015D
Solder bar of Senju M705
Senju M705 solder bar
Senju ESR-250
Senju M705 safety
senju M705-221BM5-42-11
senju m705 solder wire
solder paste m705
EIAJ C-3
Senju M705 material safety
senju m705 solder wire 0.5 mm
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M3582
Abstract: M8636 M8628 m865 m7632 M7052 M8632 M7310 m737 M3585
Text: P art Number .186 MAX. .168 MAX. .550 MAX. Des ign V oltage A mps MS C P L ife Hours F ilament T ype C M7302 C M8636 1.30 1.35 .030 .060 .006 .006 100 500 S -2 C -2R C M8656 C M8637 C M3518 C M3582 2.50 3.00 5.00 5.00 .400 .190 .115 .060 .550 .250 .150 .030
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M7302
M8636
M8656
M8637
M3518
M3582
M3585
M8541
M8628
M8551
m865
m7632
M7052
M8632
M7310
m737
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Senju M705
Abstract: Senju Sn Pb 60 40 solder Senju PASTE Senju
Text: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices
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m8636
Abstract: m865
Text: engineered to light up your design www.vcclite.com 1.800.522.5546 T-1 1/4 Special Midget Flange Base P art Number .186 MAX. .168 MAX. .550 MAX. Des ign V oltage A mps MS C P L ife Hours F ilament T ype C M7302 C M8636 1.30 1.35 .030 .060 .006 .006 100 500
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M7302
M8636
M3585
M8541
M8628
M8551
M8646
M8632
M7515
M7580
m8636
m865
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Untitled
Abstract: No abstract text available
Text: Reference 改定記録表 Revision Records GM2BB□□QT1B 版 改 定 年 月 日 技術資料番号 改 Edition Revised date 訂 内 Revised contents Spec. No. 容確 和英併記新規制定。 1st 図番：52310005 欄 Signature or name stamp 部 門 長 副 参 事 係 長 担 当
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DG-122030
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Untitled
Abstract: No abstract text available
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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51pos.
11gramms.
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senju m705 solder paste
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB50GT1C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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GM2BB50GT1C
LD-E7-2-14-A
senju m705 solder paste
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1mm 30 pin fpc connector
Abstract: IEC61249-2-21 40 pin connector 1mm FPC FH26-15
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors FH26 Series 1.0mm
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FH270
Abstract: 201C DC100V FH12 5FPC LCD 15.6 OZ63-201C-50-9 50FPC
Text: 掲載している製品の特性及び仕様は参考値です。製品のご使用に当たっては、最新の納入仕様書／参考図にてご確認下さい。 RoHS非適合製品については生産中止予定です。RoHS対応製品につきましては、RoHS対応品検索して頂くか、弊社営業担当へご相談下さい。
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FH270
AC40Vrms
201C
DC100V
FH12
5FPC
LCD 15.6
OZ63-201C-50-9
50FPC
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hrs fh26-51s-0.3shw
Abstract: 201C DC100V M705 CL580-0211-5 02102 SFPC FH26-15 G3232
Text: 掲載している製品の特性及び仕様は参考値です。製品のご使用に当たっては、最新の納入仕様書／参考図にてご確認下さい。 RoHS非適合製品については生産中止予定です。RoHS対応製品につきましては、RoHS対応品検索して頂くか、弊社営業担当へご相談下さい。
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3mmFH2351
FH260
AC30Vrms
DC100V
AC90Vrms1
981m/sHS
hrs fh26-51s-0.3shw
201C
DC100V
M705
CL580-0211-5
02102
SFPC
FH26-15
G3232
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GM2BB57
Abstract: gm2bb
Text: Reference Doc. No. DG-11X011 ISSUED October 11, 2011 LIGHTING DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BB57QK1C Model No. 電子デバイス事業本部
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DG-11X011
GM2BB57QK1C
GM2BB57QK1C
DG-11X011
GM2BB57
gm2bb
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Solder bar of Senju M705
Abstract: No abstract text available
Text: Technical Document LED Specification EC/Opto Group GM2BB57BM0C LED for Lighting Applications Product Specification December 2010 “Double Dome” Module: High-output, 5700 K LED Module 51 lm High Color Rendering (85 CRI) suited for lighting applications.
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GM2BB57BM0C
rDG-09Z031B
GM2BB57BM0C
DG-09Z031B
Solder bar of Senju M705
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eiaj-c3
Abstract: No abstract text available
Text: Reference Doc. No. DG-11X008A ISSUED October 11, 2011 LIGHTING DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BB40QK1C Model No. 電子デバイス事業本部
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DG-11X008A
GM2BB40QK1C
GM2BB40QK1C
DG-11X008A
eiaj-c3
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gm2bb
Abstract: M705 solder paste
Text: Technical Document LED Specification EC/Opto Group GM2BB40QK0C “Double Dome” LED Module for Lighting Applications Product Specification September 2011 CRI CCT Current mA Luminous Flux Efficacy (lm/W) 83 CRI 220 68.5 101 4000 K 150 50 113 Reference Doc. No.
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GM2BB40QK0C
DG-113009A
GM2BB40QK0C
DG113009A
gm2bb
M705 solder paste
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