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    LEAD-FORM TYPE PACKAGING Search Results

    LEAD-FORM TYPE PACKAGING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TLP3406SRH4 Toshiba Electronic Devices & Storage Corporation Photorelay (MOSFET output, 1-form-a), 30 V/0.9 A, 300 Vrms, S-VSON16T Visit Toshiba Electronic Devices & Storage Corporation
    TLP3407SRA Toshiba Electronic Devices & Storage Corporation Photorelay (MOSFET output, 1-form-a), 60 V/1 A, 500 Vrms, S-VSON4T Visit Toshiba Electronic Devices & Storage Corporation
    TLP3407SRH Toshiba Electronic Devices & Storage Corporation Photorelay (MOSFET output, 1-form-a), 60 V/1 A, 500 Vrms, S-VSON4T Visit Toshiba Electronic Devices & Storage Corporation
    TLP3412SRHA4 Toshiba Electronic Devices & Storage Corporation Photorelay (MOSFET output, 1-form-a), 60 V/0.25 A, 300 Vrms, S-VSON16T Visit Toshiba Electronic Devices & Storage Corporation
    TLP241B Toshiba Electronic Devices & Storage Corporation Photorelay (MOSFET output, 1-form-a), 100 V/2.0 A, 5000 Vrms, DIP4 Visit Toshiba Electronic Devices & Storage Corporation

    LEAD-FORM TYPE PACKAGING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Lead-Form Type Packaging

    Abstract: No abstract text available
    Text: Lead-Form Type Packaging www.vishay.com Vishay Dale Film Resistor, Special Application Lead-Forming SPECIFICATIONS • EUROFORM style lead-forming for the CMF 55, 60, and 20-sizes, and the CPF 1 and 2-sizes; PSEUDO RADIAL style lead-forming for the CMF 50-size


    Original     		PDF 20-sizes, 50-size mm/20 26-Jun-13 Lead-Form Type Packaging

    Untitled

    Abstract: No abstract text available
    Text: KEMET Part Number: ERP610VH3220MEF0 C831DA221M760A Capacitor, ceramic, 220 pF, +/-20% Tol, 760V, K2000, Lead Spacing=12.5 mm General Information Supplier: Application: KEMET Safety:X1/Y1 Approvals: UL,CSA,ENEC Body Type: Radial Ceramic Disc Lead Form: Straight


    Original     		PDF ERP610VH3220MEF0 C831DA221M760A) K2000, 500VAC 760VAC K2000 fd90986e-19e6-4e6a-8daf-5f75568cd403

    Untitled

    Abstract: No abstract text available
    Text: KEMET Part Number: ERP610VH4220MERU C835DA222M760L Capacitor, ceramic, 2200 pF, +/-20% Tol, 760V, K4000, Lead Spacing=12.5 mm General Information Supplier: Application: KEMET Safety:X1/Y1 Approvals: UL,CSA,ENEC Body Type: Radial Ceramic Disc Lead Form: Straight


    Original     		PDF ERP610VH4220MERU C835DA222M760L) K4000, 500VAC 760VAC K4000 afa2ffeb-187c-4bf2-ab07-536c69ad030b

    pc123

    Abstract: PC123 Series PC123ZY1 PC123 how to test PC-123 PC123 VDE pc1234 VDE0884 PC123 pin out PC123*1
    Text: PC123 Series PC123 Series DIP 4pin Reinforced Insulation Type Photocoupler • Description ■ Agency approvals/Compliance PC123 Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option.


    Original     		PDF PC123 UL1577 E64380 PC123) BS-EN60065, BSEN60950 EN60065, PC123 Series PC123ZY1 PC123 how to test PC-123 PC123 VDE pc1234 VDE0884 PC123 pin out PC123*1

    J-STD-020D

    Abstract: TEMD5120X01
    Text: TEMD5120X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5120X01 AEC-Q101 J-STD-020 TEMD5120X01 11-Mar-11 J-STD-020D

    J-STD-020D

    Abstract: TEMD5010X01
    Text: TEMD5010X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5010X01 AEC-Q101 J-STD-020 TEMD5010X01 18-Jul-08 J-STD-020D

    temd5020x01

    Abstract: J-STD-020D
    Text: TEMD5020X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5020X01 AEC-Q101 J-STD-020 TEMD5020X01 18-Jul-08 J-STD-020D

    Untitled

    Abstract: No abstract text available
    Text: TEMD5120X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5120X01 AEC-Q101 J-STD-020 2002/95/EC 2002/96/EC TEMD5120X01 18-Jul-08

    TEMD5010X01

    Abstract: No abstract text available
    Text: TEMD5010X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5010X01 AEC-Q101 J-STD-020 2002/95/EC 2002/96/EC TEMD5010X01 18-Jul-08

    J-STD-020D

    Abstract: TEMD5120X01 AEC-Q101
    Text: TEMD5120X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5120X01 AEC-Q101 J-STD-020 TEMD5120X01 18-Jul-08 J-STD-020D

    AEC-Q101

    Abstract: TEMD5080X01 J-STD-020D
    Text: TEMD5080X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5080X01 AEC-Q101 TEMD5080X01 18-Jul-08 J-STD-020D

    TEMD5020X01

    Abstract: J-STD-020D
    Text: TEMD5020X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5020X01 AEC-Q101 AEC-Q101 J-STD-020 TEMD5020X01 18-Jul-08 J-STD-020D

    J-STD-020D

    Abstract: No abstract text available
    Text: TEMD5020X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5020X01 AEC-Q101 J-STD-020 TEMD5020X01 11-Mar-11 J-STD-020D

    Untitled

    Abstract: No abstract text available
    Text: TEMD5110X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • • • • • Package type: surface mount Package form: top view Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5110X01 AEC-Q101 J-STD-020 2002/95/EC 2002/96/EC TEMD5110X01 18-Jul-08

    Untitled

    Abstract: No abstract text available
    Text: TEMD5020X01 www.vishay.com Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5020X01 AEC-Q101 J-STD-020 2002/95/EC 2002/96/EC TEMD5020X01 2002/95/EC. 2011/65/EU.

    Untitled

    Abstract: No abstract text available
    Text: TEMD6200FX01 Vishay Semiconductors Ambient Light Sensor, RoHS Compliant, Released for Lead Pb -free Solder Process, AEC-Q101 Released FEATURES • • • • • Package type: surface mount Package form: 0805 Dimensions (L x W x H in mm): 2 x 1.25 x 0.85


    Original     		PDF TEMD6200FX01 AEC-Q101 J-STD-020 2002/95/EC 2002/96/EC TEMD6200FX01 18-Jul-08

    Untitled

    Abstract: No abstract text available
    Text: TEMD5020X01 www.vishay.com Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5020X01 AEC-Q101 J-STD-020 2002/95/EC 2002/96/EC TEMD5020X01 11-Mar-11

    Untitled

    Abstract: No abstract text available
    Text: TEMD5120X01 www.vishay.com Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5120X01 AEC-Q101 J-STD-020 2002/95/EC 2002/96/EC 11-Mar-11

    temd5020x

    Abstract: No abstract text available
    Text: TEMD5020X01 www.vishay.com Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5020X01 AEC-Q101 J-STD-020 2002/95/EC 2002/96/EC TEMD5020X01 2011/65/EU 2002/95/EC. temd5020x

    Untitled

    Abstract: No abstract text available
    Text: TEMD5120X01 www.vishay.com Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5120X01 AEC-Q101 J-STD-020 2002/95/EC 2002/96/EC 2002/95/EC. 2011/65/EU. JS709A

    VSMB1940X01

    Abstract: J-STD-020D 20594 Q-101
    Text: TEMT7100X01 Vishay Semiconductors Silicon Phototransistor in 0805 Package, RoHS Compliant, Released for Lead Pb -free Solder Process, AEC Q101 Released FEATURES • Package type: surface mount • Package form: 0805 • Dimensions (L x W x H in mm): 2 x 1.25 x 0.85


    Original     		PDF TEMT7100X01 VSMB1940X01 J-STD-020 2002/95/EC 2002/96/EC TEMT7100X01 18-Jul-08 VSMB1940X01 J-STD-020D 20594 Q-101

    NPN TEMT7000X01

    Abstract: phototransistor 500-600 nm TEMT7000X01 J-STD-020D VSMB1940X01 radiation sensors
    Text: TEMT7000X01 Vishay Semiconductors Silicon Phototransistor in 0805 Package, RoHS Compliant, Released for Lead Pb -free Solder Process, AEC Q101 Released FEATURES • Package type: surface mount • Package form: 0805 • Dimensions (L x W x H in mm): 2 x 1.25 x 0.85


    Original     		PDF TEMT7000X01 VSMB1940X01 J-STD-020 TEMT7000X01 18-Jul-08 NPN TEMT7000X01 phototransistor 500-600 nm J-STD-020D VSMB1940X01 radiation sensors

    Untitled

    Abstract: No abstract text available
    Text: TEMD5120X01 www.vishay.com Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12


    Original     		PDF TEMD5120X01 AEC-Q101 J-STD-020 2002/95/EC 2002/96/EC TEMD5120X01 2011/65/EU 2002/95/EC.

    Untitled

    Abstract: No abstract text available
    Text: EO Q TL P 91X -X & M V6X 00A TAPE & REEL SPECIFICATIO NS SURFACE M O UNT OPTIONS OPTOELECTRONICS To order subminiature lamps on tape and reel, include appropriate standard lamp part number and Code Lead Type G Gullwing Y Yoke Z Z-Bend Lead Form Code Code Lead Type


    OCR Scan     		PDF MV6300A RS-481