KOSTAT CARRIER TAPE Search Results

KOSTAT CARRIER TAPE Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
IN80C188-12		Rochester Electronics LLC	Microprocessor, 16-Bit, 12.5MHz, CMOS, PQCC68, PLASTIC, LCC-68
N80C188-25		Rochester Electronics LLC	Microprocessor, 16-Bit, 25MHz, CMOS, PQCC68, PLASTIC, LCC-68
IN80C186-20		Rochester Electronics LLC	Microprocessor, 16-Bit, 20MHz, CMOS, PQCC68, PLASTIC, LCC-68
N80C188-20		Rochester Electronics LLC	Microprocessor, 16-Bit, 20MHz, CMOS, PQCC68, PLASTIC, LCC-68
R80186		Rochester Electronics LLC	Microprocessor, 16-Bit, 8MHz, CMOS, CQCC68, CERAMIC, LCC-68

KOSTAT CARRIER TAPE Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
daewon tray Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA	Original	PDF	AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
kostat tray qfn 5 x 3 Abstract: ePAK kostat qfn 6 x 6 Kostat kostat skyworks 6 x 6 Kostat tray EPAK TRAY kostat skyworks 3 x 3 kostat qfn 9 x 9 kostat 6 x 6 Text: APPLICATION NOTE Tape and Reel Information – RF Modules Production quantities of Skyworks RF Modules are shipped in standard tape and reel format. The enclosed information provides the formats and dimensions for the popular sizes of current modules. APPLICATION NOTE	Original	PDF	101568E kostat tray qfn 5 x 3 ePAK kostat qfn 6 x 6 Kostat kostat skyworks 6 x 6 Kostat tray EPAK TRAY kostat skyworks 3 x 3 kostat qfn 9 x 9 kostat 6 x 6
EPAK TRAY Abstract: GP01-D232 JEDEC Kostat Kostat tray kostat qfn 6 x 6 eC3-LGA0909-24-12-F1-L 3M060 Kostat GP01-D232-173 SOT-89-D Text: APPLICATION NOTE Tape and Reel Information – RF Modules Production quantities of Skyworks RF Modules are shipped in standard tape and reel format. The enclosed information provides the formats and dimensions for the currently popular sizes. APPLICATION NOTE	Original	PDF	101568G EPAK TRAY GP01-D232 JEDEC Kostat Kostat tray kostat qfn 6 x 6 eC3-LGA0909-24-12-F1-L 3M060 Kostat GP01-D232-173 SOT-89-D
101568i Abstract: SKY77535-XX sky77535 SKY77536-XX SKY77526 JESD625-a bo 135 SKY77537-XX SKY73022-31 EPAK TRAY Text: APPLICATION NOTE Tape and Reel Information – RF Modules Production quantities of Skyworks RF Modules are shipped in standard tape and reel format. The enclosed information provides the formats and dimensions for the currently popular sizes. APPLICATION NOTE	Original	PDF	101568I 101568i SKY77535-XX sky77535 SKY77536-XX SKY77526 JESD625-a bo 135 SKY77537-XX SKY73022-31 EPAK TRAY
wireless mobile charger block diagram Abstract: Kostat tray kostat skyworks 6 x 6 CX20460-11 Kostat CX20460 CX20460-12 CX20505-14 Text: PRODUCT SUMMARY CX20460 Power Management Integrated Circuit for GSM and GPRS Applications Description APPLICATIONS • GSM and GPRS handsets/data modules FEATURES • • • • • • • • • • Power on/off control Generation of system voltages from a single power source	Original	PDF	CX20460 48-pin 03185A 376-3000fax 376-3100sales wireless mobile charger block diagram Kostat tray kostat skyworks 6 x 6 CX20460-11 Kostat CX20460-12 CX20505-14
Untitled Abstract: No abstract text available Text: DATA SHEET SKY77155 System Smart PA Module for CDMA / KPCS 1750–1780 MHz and WCDMA (1710–1785 MHz) Applications Description • Personal Communications Services (PCS) The SKY77155 System Smart® Power Amplifier Module (PAM) is a fully matched 8-pad surface mount	Original	PDF	SKY77155
SKY77189 Abstract: KS-1208-208 KS-1208 Shipping Trays kostat 10 x 10 HSDPA JEDEC Kostat ACLR10 D232 GP01 Kostat carrier tape Text: ADVANCE DATA SHEET SKY77189 Power Amplifier Module for WCDMA / HSDPA Band VIII 880–915 MHz Applications • WCDMA handsets • HSDPA Features • Low voltage positive bias supply 3.2 V to 4.2 V • Good linearity • High efficiency - 40% @ 28.75 dBm • Large dynamic range	Original	PDF	SKY77189 10-pad KS-1208-208 KS-1208 Shipping Trays kostat 10 x 10 HSDPA JEDEC Kostat ACLR10 D232 GP01 Kostat carrier tape
design of multi section directional coupler Abstract: class d power amplifier Kostat tray MMIC code D sky77189 Shipping Trays kostat 10 x 10 datasheet ACLR10 D232 GP01 kostat skyworks 3 x 3 Text: ADVANCE DATA SHEET SKY77189 Power Amplifier Module for WCDMA / HSDPA Band VIII 880–915 MHz Applications • WCDMA handsets • HSDPA Features • Low voltage positive bias supply 3.2 V to 4.2 V • Good linearity • High efficiency - 40% @ 28.75 dBm • Large dynamic range	Original	PDF	SKY77189 10-pad design of multi section directional coupler class d power amplifier Kostat tray MMIC code D Shipping Trays kostat 10 x 10 datasheet ACLR10 D232 GP01 kostat skyworks 3 x 3
JESD-A115 Abstract: SKY77155 kostat skyworks 6 x 6 D232 GP01 JEDEC Kostat kostat 6 x 6 JESD-C101 Shipping Trays kostat 10 x 10 Text: DATA SHEET SKY77155 System Smart PA Module for CDMA / KPCS 1750–1780 MHz and WCDMA (1710–1785 MHz) Applications Description • Personal Communications Services (PCS) The SKY77155 System Smart® Power Amplifier Module (PAM) is a fully matched 8-pad surface mount	Original	PDF	SKY77155 JESD-A115 kostat skyworks 6 x 6 D232 GP01 JEDEC Kostat kostat 6 x 6 JESD-C101 Shipping Trays kostat 10 x 10
TAIYO PSR 4000 Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100 Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original	PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original	PDF
taiyo PSR4000 Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5 Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2	Original	PDF
fBGA package tray 12 x 19 Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125 Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2	Original	PDF