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    KBB06A300M-T402 Search Results

    KBB06A300M-T402 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    59202-T40-20-150LF Amphenol Communications Solutions Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions. Visit Amphenol Communications Solutions
    59112-T40-20-090LF Amphenol Communications Solutions Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 40 Positions. Visit Amphenol Communications Solutions
    59132-T40-24-140LF Amphenol Communications Solutions Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 48 Positions, 2.00mm (0.079in) Pitch Visit Amphenol Communications Solutions
    59362-T4022A119LF Amphenol Communications Solutions Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 44 Positions, 2.00mm (0.079in) Pitch.. Visit Amphenol Communications Solutions
    59112-T40-25-166LF Amphenol Communications Solutions Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions. Visit Amphenol Communications Solutions

    KBB06A300M-T402 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    KBB06A300M-T402 Samsung Electronics Multi-Chip Package Memory 64 MBit (8M x 8/4M x 16) Dual Bank NOR Flash x 2/128 MBit (8M x 16) NAND Flash/32 MBit (2M x 16) UtRAM Original PDF