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    JEDEC BOTTOM Search Results

    JEDEC BOTTOM Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    F519-1A7A1-11010-E200 Amphenol Communications Solutions Flex Connector, 1.00mm Pitch, Height 3.00mm, Right angle, NON-ZIF, Bottom contact, 10 position, Bottom contact, Without MYLAR Visit Amphenol Communications Solutions
    F519-1A7A1-11007 Amphenol Communications Solutions Flex Connector, 1.00mm Pitch, Height 3.00mm, Right angle, NON-ZIF, Bottom contact, 7 position, Bottom contact, Without MYLAR Visit Amphenol Communications Solutions
    F519-1A7A1-11005-E200 Amphenol Communications Solutions Flex Connector, 1.00mm Pitch, Height 3.00mm, Right angle, NON-ZIF, Bottom contact, 5 position, Bottom contact, Without MYLAR Visit Amphenol Communications Solutions
    F519-1A7A1-11004 Amphenol Communications Solutions Flex Connector, 1.00mm Pitch, Height 3.00mm, Right angle, NON-ZIF, Bottom contact, 4 position, Bottom contact, Without MYLAR Visit Amphenol Communications Solutions
    F519-1A7A1-11019 Amphenol Communications Solutions Flex Connector, 1.00mm Pitch, Height 3.00mm, Right angle, NON-ZIF, Bottom contact, 19 position, Bottom contact, Without MYLAR Visit Amphenol Communications Solutions

    JEDEC BOTTOM Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    18013

    Abstract: No abstract text available
    Text: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to


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    PDF C36000, B16/B16M B579-73 SAE-AMS-QQ-N-290 18013

    SMD Packages

    Abstract: No abstract text available
    Text: IPC/JEDEC J-STD-033A July 2002 Supersedes IPC/JEDEC J-STD-033 April 1999 JOINT INDUSTRY STANDARD Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of


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    PDF J-STD-033A J-STD-033 SMD Packages

    1109814

    Abstract: No abstract text available
    Text: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to


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    PDF C36000, B16/B16M B579-73 SAE-AMS-QQ-N-290 1109814

    Reflow

    Abstract: JEDEC J-STD-020d.1 JEP-140 JEP140 J-STD-035 JESD22-B112 JEDEC J-STD-020d JESD47 JESD22-B108 IPC-020d-5-1
    Text: IPC/JEDEC J-STD-020D.1 March 2008 Supersedes IPC/JEDEC J-STD-020D August 2007 JOINT INDUSTRY STANDARD Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice IPC and JEDEC Standards and Publications are designed to serve the public


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    PDF J-STD-020D J-STD-020D Reflow JEDEC J-STD-020d.1 JEP-140 JEP140 J-STD-035 JESD22-B112 JEDEC J-STD-020d JESD47 JESD22-B108 IPC-020d-5-1

    IC 290 8pin

    Abstract: C17200
    Text: P/Ns 1109522 and 1109523 DIP-to-JEDEC TO Adapter Socket FEATURES • 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board.


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    PDF C36000, B16/B16M C17200, B194-08 IC 290 8pin C17200

    Untitled

    Abstract: No abstract text available
    Text: P/Ns 1109522 and 1109523 DIP-to-JEDEC TO Adapter Socket FEATURES • 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board.


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    PDF C36000, B16/B16M C17200, B194-08

    Untitled

    Abstract: No abstract text available
    Text: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to


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    PDF IS410 101A/26 C36000, B16/B16M MIL-G-45204 AMS-QQ-N-290 1109814-RC 18013RC

    18012

    Abstract: No abstract text available
    Text: P/Ns 1109522 and 1109523 DIP-to-JEDEC TO Adapter Socket FEATURES • 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board.


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    PDF C36000, B16/B16M C17200, B194-08 18012

    IPC 4101A

    Abstract: IS410 4101A
    Text: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to


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    PDF IS410 101A/26 C36000, B16/B16M MIL-G-45204 AMS-QQ-N-290 1109814-RC 18013RC IPC 4101A 4101A

    AS4C32M16D2

    Abstract: No abstract text available
    Text: AS4C32M16D2 512M 32M x 16 bit DDRII Synchronous DRAM (SDRAM) Confidential Advanced (Rev. 1.1, Feb. /2013) Features Overview • JEDEC Standard Compliant  JEDEC standard 1.8V I/O (SSTL_18-compatible)  Power supplies: VDD & VDDQ = +1.8V  0.1V  Supports JEDEC clock jitter specification


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    PDF AS4C32M16D2 18-compatible) lat19 AS4C32M16D2

    Untitled

    Abstract: No abstract text available
    Text: AS4C32M16D2 512M 32M x 16 bit DDRII Synchronous DRAM (SDRAM) Confidential Advanced (Rev. 1.1, Feb. /2013) Features Overview • JEDEC Standard Compliant  JEDEC standard 1.8V I/O (SSTL_18-compatible)  Power supplies: VDD & VDDQ = +1.8V  0.1V  Supports JEDEC clock jitter specification


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    PDF AS4C32M16D2 18-compatible) lat19

    PLCC 44 socket layout

    Abstract: No abstract text available
    Text: Designed standard JEDEC type “A” PLCC packages PLASTIC LEADED CHIP CARRIER SOCKET PCC05 SERIES G-7 PCC05 SERIES PLCC SOCKET FEATURES For standard JEDEC type "A" PLCC packages Low profile/Compact design Closed bottom design controls solder and flux wicking


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    PDF PCC05 52pin 100pin PLCC 44 socket layout

    1E70

    Abstract: TOP MARK B11 jedec package MO-229 UDFN
    Text: CAT6095 Digital Output Temperature Sensor FEATURES DESCRIPTION „ „ „ „ „ The CAT6095 is a JEDEC JC42.4 compliant Temperature Sensor designed for general purpose temperature measurements requiring a digital output. JEDEC JC42.4 Compliant Temperature Sensor


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    PDF CAT6095 CAT6095 MD-1124 1E70 TOP MARK B11 jedec package MO-229 UDFN

    12N6LE

    Abstract: 12n06rle 12N6L AN9321 AN9322 RFD12N06RLE RFD12N06RLESM RFD12N06RLESM9A RFP12N06RLE TB334
    Text: RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE Data Sheet January 2002 17A, 60V, 0.071 Ohm, N-Channel, Logic Level UltraFET Power MOSFET Packaging Features JEDEC TO-251AA JEDEC TO-252AA SOURCE DRAIN GATE DRAIN FLANGE DRAIN (FLANGE) GATE SOURCE RFD12N06RLE RFD12N06RLESM


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    PDF RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE O-251AA O-252AA RFD12N06RLE RFD12N06RLESM O-220AB 12N6LE 12n06rle 12N6L AN9321 AN9322 RFD12N06RLE RFD12N06RLESM RFD12N06RLESM9A RFP12N06RLE TB334

    HUFA75623P3

    Abstract: 11A ABS AN9321 HUFA75623S3ST TB334
    Text: HUFA75623P3, HUFA75623S3ST Data Sheet November 2000 File Number 4957 22A, 100V, 0.064 Ohm, N-Channel, UltraFET Power MOSFETs Packaging JEDEC TO-220AB JEDEC TO-263AB SOURCE DRAIN GATE DRAIN FLANGE GATE SOURCE DRAIN (FLANGE) HUFA75623P3 HUFA75623S3ST Features


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    PDF HUFA75623P3, HUFA75623S3ST O-220AB O-263AB HUFA75623P3 75623P HUFA75623P3 11A ABS AN9321 HUFA75623S3ST TB334

    75645P

    Abstract: 75645s mosfet 75645p HUFA75645P3 HUFA75645S3S HUFA75645S3ST TB334
    Text: HUFA75645P3, HUFA75645S3S Data Sheet November 2000 File Number 4963 75A, 100V, 0.014 Ohm, N-Channel, UltraFET Power MOSFETs Packaging JEDEC TO-220AB JEDEC TO-263AB Features DRAIN FLANGE SOURCE DRAIN GATE GATE SOURCE DRAIN (FLANGE) HUFA75645P3 HUFA75645S3S


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    PDF HUFA75645P3, HUFA75645S3S O-220AB O-263AB HUFA75645P3 75645P 75645P 75645s mosfet 75645p HUFA75645P3 HUFA75645S3S HUFA75645S3ST TB334

    AN9321

    Abstract: HUFA75617D3 HUFA75617D3S HUFA75617D3ST TB334
    Text: HUFA75617D3, HUFA75617D3S Data Sheet November 2000 File Number 4956 16A, 100V, 0.090 Ohm, N-Channel, UltraFET Power MOSFETs Packaging JEDEC TO-251AA JEDEC TO-252AA SOURCE DRAIN GATE DRAIN FLANGE GATE SOURCE DRAIN (FLANGE) HUFA75617D3S HUFA75617D3 Features


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    PDF HUFA75617D3, HUFA75617D3S O-251AA O-252AA HUFA75617D3 75617D AN9321 HUFA75617D3 HUFA75617D3S HUFA75617D3ST TB334

    AN7254

    Abstract: AN7260 AN9321 AN9322 HUF75925D3ST HUF75925P3 TB334
    Text: HUF75925P3, HUF75925D3ST Data Sheet December 2000 File Number 5007 11A, 200V, 0.275 Ohm, N-Channel, UltraFET Power MOSFETs Packaging Features JEDEC TO-220AB JEDEC TO-252AA SOURCE DRAIN GATE DRAIN FLANGE GATE SOURCE DRAIN (FLANGE) HUF75925P3 HUF75925D3ST


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    PDF HUF75925P3, HUF75925D3ST O-220AB O-252AA HUF75925P3 75925P 75925D AN7254 AN7260 AN9321 AN9322 HUF75925D3ST HUF75925P3 TB334

    HUF75829D3S

    Abstract: AN9321 AN9322 HUF75829D3 HUF75829D3ST TB334
    Text: HUF75829D3, HUF75829D3S Data Sheet February 2000 File Number 4795.1 18A, 150V, 0.110 Ohm, N-Channel, UltraFET Power MOSFET Packaging JEDEC TO-251AA JEDEC TO-252AA Features DRAIN FLANGE SOURCE DRAIN GATE GATE SOURCE DRAIN (FLANGE) HUF75829D3S HUF75829D3


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    PDF HUF75829D3, HUF75829D3S O-251AA O-252AA HUF75829D3 75829D HUF75829D3S AN9321 AN9322 HUF75829D3 HUF75829D3ST TB334

    HUF75842P3

    Abstract: HUF75842S3S HUF75842S3ST TB334 75842P 75842S
    Text: HUF75842P3, HUF75842S3S Data Sheet December 2000 File Number 4815.1 43A, 150V, 0.042 Ohm, N-Channel, UltraFET Power MOSFET Packaging JEDEC TO-220AB JEDEC TO-263AB Features DRAIN FLANGE SOURCE DRAIN GATE GATE SOURCE DRAIN (FLANGE) HUF75842P3 HUF75842S3S


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    PDF HUF75842P3, HUF75842S3S O-220AB O-263AB HUF75842P3 75842P HUF75842P3 HUF75842S3S HUF75842S3ST TB334 75842P 75842S

    AN9321

    Abstract: HUFA75829D3 HUFA75829D3S HUFA75829D3ST TB334
    Text: HUFA75829D3, HUFA75829D3S Data Sheet November 2000 File Number 4966 18A, 150V, 0.110 Ohm, N-Channel, UltraFET Power MOSFETs Packaging JEDEC TO-251AA JEDEC TO-252AA Features DRAIN FLANGE SOURCE DRAIN GATE GATE SOURCE DRAIN (FLANGE) HUFA75829D3S HUFA75829D3


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    PDF HUFA75829D3, HUFA75829D3S O-251AA O-252AA HUFA75829D3 75829D AN9321 HUFA75829D3 HUFA75829D3S HUFA75829D3ST TB334

    Untitled

    Abstract: No abstract text available
    Text: HUF76407D3, HUF76407D3S Data Sheet December 2001 11A, 60V, 0.107 Ohm, N-Channel, Logic Level UltraFET Power MOSFET Packaging JEDEC TO-251AA DRAIN FLANGE JEDEC TO-252AA DRAIN (FLANGE) SOURCE DRAIN GATE GATE SOURCE HUF76407D3S HUF76407D3 Symbol Features


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    PDF HUF76407D3, HUF76407D3S O-251AA O-252AA HUF76407D3 76407Dlopment.

    MS-010

    Abstract: No abstract text available
    Text: JEDEC Publication No. 95 Page _ JEDEC Publication No. 95 Page _ SECTION Z - Z DATUM - A - (DATUM — A - ) EVEN NUMBER LEADS (DIMENSIONS IN INCHES) JEDEC SOUD STATE PRODUCT OUTLINES ODD NUMBER LEADS DETAIL A TITLE dual in lin e PLASTIC FAMILY (R -P D IP -T )


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    PDF

    jedec ms-024

    Abstract: MS-024 368S MS 024
    Text: ZD SEATING PLANE 7 b|)~i)~y~Lrn=n= injnj~y~y~y~y~u^ A ' I [B aaa C A B AA L (N5X) 0.10 c PATENT PENDING JEDEC THIS STANDARD OUTLINE HAS BEEN PREPARED BY JEDEC JC-11 COMMITTEE SOLID STATE PRODUCT AND APPROVED BY THE JEDEC COUNCIL AND REFLECTS A PRODUCT WITH WIDE


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    PDF JC-11 MS-024 SPP-012. jedec ms-024 MS-024 368S MS 024