Untitled
Abstract: No abstract text available
Text: Section 4 Quality Control and Reliability 4.1 Hitachi Diode Manufacturing Process and Quality Control Hitachi makes every possible effort to maintain the quality of its diodes from manufacturing to shipment, and pays strict attention to quality control in the production process. Meticulous care over each of the
|
Original
|
PDF
|
1500m/s
|
SNW-EQ-611
Abstract: Statistical statistical process control PROCESS CONTROL EQUIPMENT QUALITY QLY001 quality control assurance and reliability
Text: DISCRETE SEMICONDUCTORS General Section Module Quality Module: QLY001_1 Quality Power Diodes 1998 Dec 07 Philips Semiconductors Power Diodes Quality • In-line Quality Assurance to monitor process reproducibility during manufacture - any corrective action is initiated as necessary. Process steps are under
|
Original
|
PDF
|
QLY001
SNW-EQ-611
Statistical
statistical process control
PROCESS CONTROL EQUIPMENT QUALITY
quality control assurance and reliability
|
INCOMING RAW MATERIAL INSPECTION procedure
Abstract: 5962-8867001LA MIL-STD-883 Method 2010 Mil-Std-883 Wire Bond Pull Method 2011 Sample form for INCOMING Inspection of RAW MATERIAL CY7C122 PALC22V10 plate INCOMING RAW MATERIAL INSPECTION procedure outgoing raw material inspection procedure visual inspection of raw materials
Text: fax id: 8509 Quality, Reliability, and Process Flows Quality, Reliability, and Process Flows Corporate Views on Quality and Reliability Product Testing Categories Cypress believes in product excellence. Excellence can only be defined by how the users perceive both our product quality
|
Original
|
PDF
|
|
visual inspection of raw materials
Abstract: quality control assurance and reliability
Text: QUALITY ASSURANCE FLOW CHART CHEMICALS, GASES, HARDWARE WAFERS RAW MATERIALS MASKS QUALITY ASSURANCE PROCUREMENT REVIEW VENDOR CONTROL INCOMING INSP. QA IN-PROCESS AUDIT QA IN-PROCESS AUDIT S.E.M. INSPECTION NEW PRODUCT DESIGNS AND CURRENT DESIGNS, NEW-CURRENT PROCESSES,
|
Original
|
PDF
|
OA-003
visual inspection of raw materials
quality control assurance and reliability
|
5075MM
Abstract: No abstract text available
Text: Issued March 1999 232-5115 Data Pack A Data Sheet Statistical process control data processor and instruments Introduction Statistical process control SPC is a key concept for enhancing quality control and can achieve significant improvements in product quality.
|
Original
|
PDF
|
200ms
5075MM
|
PPAP level submission requirement table
Abstract: PPAP MANUAL for automotive industry foundry metals quality MANUALS result of 200 prize bond INCOMING MATERIAL INSPECTION checklist, PCB TSMC 90nm sram SMD a006 ISO 9001 Sony foundry INCOMING MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION procedure
Text: Contents Contents i Chapter 1 Quality Management 1.1 Quality Policy 1.2 Quality Organization 1.3 ISO 9001 Year 2000 Revision 1.4 Quality Systems 1.4.1 Process Map 1.4.2 Advanced Product Quality Planning 1.4.3 Quality Assurance in the Project Approval Stage
|
Original
|
PDF
|
|
A -1123* test
Abstract: Family of Testability Products process flow diagram
Text: pASIC 1 FAMILY Quality Program OVERVIEW The pASIC product quality program has the goal to meet or exceed the industry's highest quality standards. The program includes product acceptance inspection in the Standard Process Flow see the following Standard Process Flow diagram . Electrical, visual/mechanical and check on the
|
Original
|
PDF
|
|
QUBiC4X
Abstract: BGU7003 BFU725F
Text: NXP wideband LNA MMIC BGU7003 in SiGe:C process High-quality reception at high RF frequencies Manufactured in NXP’s latest SiGe:C process, this high-frequency RF MMIC delivers high-quality reception with extended battery life. It is a cost-effective, siliconbased alternative to GaAs devices,
|
Original
|
PDF
|
BGU7003
110-GHz
OT891
QUBiC4X
BFU725F
|
in-process quality inspections
Abstract: process flow diagram
Text: 9 OVERVIEW The pASIC product quality program has the goal to meet or exceed the industry's highest quality standards. The program includes product acceptance inspection in the Standard Process Flow see the following Standard Process Flow diagram . Electrical and visual/mechanical
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Issued November 1991 A12536 Statistical process control data processor and instruments Introduction Statistical process control SPC is a key concept for enhancing quality control and can achieve significant improvements in product quality. The RS data processor and the range of digital electronic instruments are powerful tools for implementing
|
Original
|
PDF
|
A12536
200ms
|
Harting
Abstract: No abstract text available
Text: Data downloaded from http://www.angliac.com - the website of Anglia - tel: 01945 474747 Quality assurance press-in process Quality control of the press-in termination pcb thickness: 1.6 mm to 3.2 mm Plating of the press-in zone: Sn Plating of the hole: Sn
|
Original
|
PDF
|
|
HAL 2850
Abstract: harting 09 06 232 harting 09 03 264 6850 HAL 6852 09 05 248 6851 09 03 164 6850 6850C
Text: Directory chapter 04 Page press-in technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 04.02 Recommended configuration of plated through holes . . . . . . . . . . . . . . . . . . . . 04.04 Quality assurance press-in process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
|
Original
|
PDF
|
|
foundry INCOMING MATERIAL INSPECTION procedure
Abstract: outgoing raw material inspection procedure INCOMING RAW MATERIAL INSPECTION form receiving inspection procedure
Text: Quality/Reliability Program You are in Databook Vol. 1 • Click for Main Menu Micrel Quality/Reliability Program 3. Our Philosophy Critical process-step monitoring Particulates Product quality and reliability are two of the most critical elements for achieving success in today’s semiconductor
|
Original
|
PDF
|
MIL-STD-883,
foundry INCOMING MATERIAL INSPECTION procedure
outgoing raw material inspection procedure
INCOMING RAW MATERIAL INSPECTION form
receiving inspection procedure
|
receiving inspection procedure
Abstract: outgoing raw material inspection procedure INCOMING RAW MATERIAL INSPECTION method INCOMING MATERIAL INSPECTION procedure foundry INCOMING MATERIAL INSPECTION procedure
Text: Quality/Reliability Program You are in Databook Vol. 3 • Click for Main Menu Micrel Quality/Reliability Program 3. Our Philosophy Critical process-step monitoring Particulates Product quality and reliability are two of the most critical elements for achieving success in today’s semiconductor
|
Original
|
PDF
|
MIL-STD-883,
receiving inspection procedure
outgoing raw material inspection procedure
INCOMING RAW MATERIAL INSPECTION method
INCOMING MATERIAL INSPECTION procedure
foundry INCOMING MATERIAL INSPECTION procedure
|
|
|
reliability report
Abstract: quality and reliability report defect ppm outgoing quality
Text: Quality and Reliability Report 9. Average Outgoing Quality AOQ Data 1. Calculation Equation: 6 AOQ = (Process Average) • (Probability of Acceptance) • (10 ) (PPM) • Process Average = Total Projected Reject Device / Total Number of Devices • Projected Reject Device = (Defects in Samples / Sample Size) • Lot Size
|
Original
|
PDF
|
2000-Q2
reliability report
quality and reliability report
defect ppm
outgoing quality
|
Sample form for INCOMING Inspection of RAW MATERIAL
Abstract: INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION method Temic PART DATE CODE INCOMING IC INSPECTION MHS IC INCOMING RAW MATERIAL INSPECTION chart INCOMING IC INSPECTION,
Text: Quality Flows Digital IC Products Quality Flows This document presents the flows used in manufacturing and screening of TEMIC Digital IC Processors, Memories, ASICs and ASSPs . Process Control As shown in the following tables, each device is constructed by manufacturing processes which are under
|
Original
|
PDF
|
MIL-883
Sample form for INCOMING Inspection of RAW MATERIAL
INCOMING RAW MATERIAL INSPECTION procedure
INCOMING RAW MATERIAL INSPECTION
INCOMING RAW MATERIAL INSPECTION form
INCOMING RAW MATERIAL INSPECTION method
Temic PART DATE CODE
INCOMING IC INSPECTION
MHS IC
INCOMING RAW MATERIAL INSPECTION chart
INCOMING IC INSPECTION,
|
INCOMING RAW MATERIAL INSPECTION method
Abstract: Sample form for INCOMING Inspection of RAW MATERIAL INCOMING RAW MATERIAL INSPECTIONs INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION chart SCC20500
Text: Quality Flows Digital IC Products Quality Flows This document presents the flows used in manufacturing and screening of TEMIC Digital IC Processors, Memories, ASICs and ASSPs . Process Control As shown in the following tables, each device is constructed by manufacturing processes which are under
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Surface Mounted Semiconductors General QUALITY • In-line quality assurance to m onitor process reproducibility during m anufacture and initiate any necessary corrective action. C ritical process steps are 100% under statistical process control
|
OCR Scan
|
PDF
|
MBB439
|
Untitled
Abstract: No abstract text available
Text: Part 1 MICROCOMPUTER PERIPHERAL CONTROLLER LSI PRODUCT GUIDE QUALITY AND REILABILITY ASSURANCE 1. Quality Assurance 2. Check and Desing Review in Products Development 3. Quality Assurance Activity in Mass Production Process 4. Quality Conformance Inspection of Finished
|
OCR Scan
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: BURN-IN OPTIONS BURN-IN OPTIONS Production quality control ensures that the quality inherent in a design is realized during manufacture of our CMO S integrated circuits. This is achieved by monitoring the quality, both conformity and reliability, of finished ICs; by inspection of the materials and components to be used in the process;
|
OCR Scan
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: BURN-IN OPTIONS BURN-IN OPTIONS Production quality control ensures that the quality inherent in a design is realised during manufacture o f our CMOS integrated circuits. This is achieved by m onitoring the quality, both con form ity and reliability, o f finished ICs; by inspection o f the materials and components to be used in the process;
|
OCR Scan
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: QUALITY PRODUCTS, QUALITY SERVICE A t Philips Com ponents we are com m itted to continuous quality im provem ent and run ISO 9000 certification program m es in all our production centres, supported by statistical process control at all key stages o f our production
|
OCR Scan
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Q uality & Reliability Q uality Strategy Quality by Design Vendor Management Alliance’s quality strategy begins with design. Our memories are built in simpler process technology than competing parts. Fewer processing steps means fewer parameters to control,
|
OCR Scan
|
PDF
|
MIL-STD883D,
|
magnetek
Abstract: No abstract text available
Text: Magnetek develops its market approach with the full use of its Total Quality System. Total Quality means the control of all the design, development and production processes; careful selection of subcontractors; advanced process technology and in-depth customer service.
|
OCR Scan
|
PDF
|
|
