35HDRA
Abstract: 35HDRANN stereo 3.5mm plug stereo plug 3.5mm
Text: PART NUMBER PLUG FINGER HANDLE HANDLE CABLE OPENING I.D. 35HDRABAU GOLD BLACK 0.29 35HDRABAUS GOLD BLACK 0.175 35HDRANAU GOLD NICKEL 0.29 35HDRANAUS GOLD NICKEL 0.175 35HDRANN NICKEL NICKEL 0.29 35HDRANNS NICKEL NICKEL 0.175 MATERIALS: 1.52 REF PLUG MOLDING COMPOUND - L.C.P. BLACK
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35HDRABAU
35HDRABAUS
35HDRANAU
35HDRANAUS
35HDRANN
35HDRANNS
35HDRA
stereo 3.5mm plug
stereo plug 3.5mm
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Untitled
Abstract: No abstract text available
Text: TABLE 1: MATERIAL ITEM SHELL PIN INSULATOR FINGER SHELL MATERIAL FINISH BRASS C3602B BRASS C3602B TEFLON BeCu C17300 .75[.000030] GOLD OVER 1.25[.000050] NICKEL .75[.000030] GOLD OVER 1.25[.000050] NICKEL -.75[.000030] GOLD OVER 1.25[.000050] NICKEL S A M TE C
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C3602B
C17300
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Untitled
Abstract: No abstract text available
Text: CHEMTRONICS TDS # 0601 Technical Data Sheet Gold Guard PRODUCT DESCRIPTION Gold Guard is engineered to clean, lubricate and protect gold, silver, platinum and other precious metal contacts. Gold Guard is a high performance contact cleaner and lubricant, offering protection
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Untitled
Abstract: No abstract text available
Text: b http://www.tekcon.com http://www.tekcon.com.tw 1226 Series D-Sub Miniature Connector Vertical, One Metal Shell, Receptacle Ordering Information 1226 - X X X - 15 S - X X Contact Plating 0 - Gold Flash/Tin 1 - 10 µ" Gold/Tin 3 - 30 µ" Gold/Tin 5 - 15 µ" Gold/Tin
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UL94V-0.
-558C
1258C
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Untitled
Abstract: No abstract text available
Text: HELIAX Connector P R O D U C T S P E C I F I C A T I O N F036PSR-SX SMA Right Angle for FSJ036RN-50, Superflexible Foam Dielectric Cable CHARACTERISTICS Components Body Right Angle Brass Gold Plate Coupling Nut Brass Gold Plate Interface Brass Gold Plate
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F036PSR-SX
FSJ036RN-50,
MIL-STD-1344A,
MIL-STD-202F
Temp-55
MIL-STD-202F,
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Untitled
Abstract: No abstract text available
Text: Connectors IC Sockets KLS1-209BA 2.0x2.8mm Pitch IC Socket SIP L=11.2mm I Material: Pin outer sleeve :Brass Clip(contact 4/6 finger):Beryllium copper,heat treated Plating(outer sleeve): Tin plated:1.25u" m/50u" nickel,50um/200u" Tin Gold plated:1.25u" m/50u" nicke,full gold
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KLS1-209BA
m/50u"
50um/200u"
25um/50u"
1000M
KLS1-209BA-1-XX-S
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JEDEC SMT reflow profile
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR MATERIAL: GLASS FILED NYLON FLAMMABILITY RATING UL94-V0 COLOUR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: SELECTIVE GOLD SHIELDING: BRONZE NI PLATED QUALITY CLASS: - 3'' INCH GOLD -> CONTACT AREA
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UL94-V0
12-NOV-09
12-MNG:
12-MAY-09
26-NOV-08
24-NOV-08
04-MAR-08
13-FEB-08
21-NOV-07
JEDEC SMT reflow profile
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Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR MATERIAL: GLASS FILED NYLON FLAMMABILITY RATING UL94-V0 COLOUR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: SELECTIVE GOLD SHIELDING: BRONZE NI PLATED QUALITY CLASS: - 3'' INCH GOLD -> CONTACT AREA
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UL94-V0
28-NOV-12
05-JAN-10
12-NOV-09
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KMT221NG
Abstract: CKN9436CT-ND glyptal hearing aids CKN9212-ND KMR243GLFG CKN9213-ND CKN9374-ND CKN9375-ND 401-1427-1-ND
Text: RF 19 and RF 15 Short-Travel Keyswitches Specifications: • Maximum Rated Voltage: Gold:42V Silver: 50V • Maximum Rated Current: Gold 100mA; Silver 250mA • Operating Temperature Range: -25°C ~ 70°C • Operating Life: 1,000,000 operations minimum
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100mA;
250mA
401-1852-1-ND
401-1852-2-ND
401-1662-1-ND
401-1662-2-ND
401-1855-1-ND
401-1664-1-ND
401-1853-ND
401-1653-ND
KMT221NG
CKN9436CT-ND
glyptal
hearing aids
CKN9212-ND
KMR243GLFG
CKN9213-ND
CKN9374-ND
CKN9375-ND
401-1427-1-ND
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i1 321
Abstract: 011-AC
Text: r h CONTACT PART NUMBER <XXXY 509B 120B 003A 509A 009A 011A C L IP /S H E L L PLATING 30 30 30 30 30 10 u' u' u' u' u' u' GDLD/200 u ' TIN GOLD/IO u ' GOLD GOLD/200 u ' TIN GOLD/IO u ' GOLD GOLD/200 u ' TIN GDLD/200 u ' TIN REF. INSERTION EXTRACTION NO. DF
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GDLD/200
GOLD/200
-B-626.
-C-533.
V00017
PZA321HXXXY-37AU
i1 321
011-AC
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Untitled
Abstract: No abstract text available
Text: COAXIAL CONNECTORS BNC FEMALE TO FEMALE BNC MALE TO MALE TYPE "N" FEMALE TO BNC MALE 800-2406-03-25 800-2407-03-25 800- 2450- 03-25 Teflon* Insulated. Gold Plated Beryillium Center Contacts. Teflon* Insulated. Gold Plated Beryillium Outer Finger Contacts.
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75OHMS
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Untitled
Abstract: No abstract text available
Text: Finger-Pac Inlaid Gold Connectors Features • Multiples. Multiples of smaller module boards can be manufactured in larger panels since select plating of gold fingers is not required. ■ Controlled Mating. Controlled mating thick ness ± .001 of Finger-Pac connector compares
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pINLAY-30p'
UL94V0
QQ-B-750
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Untitled
Abstract: No abstract text available
Text: 1 8 I File No. ' — 392 r SHEET 1 / 1 Specifications: Pin outer sleeve : Brass,machined, CuZn38Pb2 Clip(contact 6 finger): Beryllium copper,heat treated Plating(outer sleeve) : Tin plated: 2um /80u"nickel,5 um /200u"Tin Gold plated: 2um/80u"nickel,Full gold
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CuZn38Pb2
/200u
2um/80u
UL94Vâ
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84-1LMI epoxy adhesive
Abstract: TS0300W3 TS0500W3
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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Untitled
Abstract: No abstract text available
Text: 1 I I 6 8 File No. r SH E E T 1 / 1 Specifications: Pin outer sleeve : Brass,machined, CuZn38Pb2 Clip(contact 6 finger): Beryllium copper,heat treated Plating(outer sleeve) : Tin plated: 2um /80u"nickel,5 um /200u"Tin Gold plated: 2um/80u"nickel,Full gold
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CuZn38Pb2
/200u
2um/80u
UL94Vâ
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intcon
Abstract: No abstract text available
Text: AUGAT/ INTCON PRDT GP S7E D 10^3335 G0G27flb till M A U I P Finger-Pac Inlaid Gold Connectors Features Multiples. Multiples of smaller module boards can be manufactured in larger panels since select plating of gold fingers is not required. Controlled Mating. Controlled mating thick
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0D027flb
intcon
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold w rap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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Untitled
Abstract: No abstract text available
Text: 1 I I 31 6 File No. 9« KD + n 9D I SHEET o 1 ~ / 1 Specifications: Pin outer sleeve : Brass,machined, CuZn38Pb2 Clip(contact 6 finger):Beryllium copper,heat treated Plating(outer sleeve) : Tin plated:2um /80u"nickel,5um /200u”Tin Gold plated:2um /80u”nickel,Full gold
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CuZn38Pb2
/200uâ
UL94Vâ
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Untitled
Abstract: No abstract text available
Text: 1 IBI I I File No.I I , I ISHEET 441 Q 1 /1 MATERIALS Pin Outer Sleeve : Brass,M achined,CuZn38Pb2 Cllp(Contact Finger): Beryllium Copper.Heat Treated Platlng(Outer Sleeve): Tin Plated: 2u”m / 8 0 u ”Nlckel,5um /200u"Tin Gold Plated: 2 u ”m / 8 0 u ”Nickel,Full Gold
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CuZn38Pb2
m/80u
5um/200u
2um/80u
UL94V-0
SIC03XX
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Untitled
Abstract: No abstract text available
Text: I 6 I ~5-File No. 392 SHEET 1 o ~ / 1 Specifications: Pin outer sleeve : Brass,machined, CuZn38Pb2 Clip(contact 6 finger): Beryllium copper,heat treated Plating(outer sleeve) : Tin plated: 2um /80u"nickel,5 u m / 2 0 0 u ”Tin Gold plated: 2 u m / 8 0 u ”nickel,Full gold
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CuZn38Pb2
UL94Vâ
HIS0442
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Untitled
Abstract: No abstract text available
Text: 1 I sn nn+n 9n 31 I File No. 392 I SH E E T o 1 ~ / 1 Specifications: Pin outer sleeve : Brass,machined, CuZn38Pb2 Clip(contact 6 finger):Beryllium copper,heat treated Plating(outer sleeve) : Tin plated:2um/80u”nickel,5um/200u”Tin Gold plated:2um/80u"nickel,Full gold
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CuZn38Pb2
2um/80uâ
5um/200uâ
2um/80u
HIS0656
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MPA1030
Abstract: A103-C
Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. - ALL RIGHTS RESERVED. MATERIALS COMPONENT NAME BASE MATERIAL FINISH CASE PHENOL RESIN, EIXED CONTACT COPPER GOLD FLASH MOVING CONTACT COPPER GOLD FLASH OVER SILVER
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11AUG06
MPA103004
MPA103B04
14APR98
14APR98
A103C
MPA1030
A103-C
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HIS0628
Abstract: No abstract text available
Text: 31 I File No. 392 I SHEET o 1 /1 9 e! 9 n + n on H Specifications: Pin outer sleeve : Brass,machined, CuZn38Pb2 Clip(contact 6 finger): Beryllium copper,heat treated Plating(outer sleeve) : Tin plated: 2 u m / 8 0 u ”nickel,5 u m / 2 0 0 u ”Tin Gold plated: 2 u m / 8 0 u ”nickel,Full gold
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CuZn38Pb2
2um/80u
um/200u
UL94V-0)
HIS0628
HIS0628
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Untitled
Abstract: No abstract text available
Text: o Materials and Finish CO CO o Housing Material: High Temperature Thermoplastic, UL 94V-0 Rated, Color: Black CO Contact Material: Phosphor Bronze 10 Plating Options: Standard: Nickel Underplating, Gold Flash Plating on Contact Area, Gold Flash on Solder Area
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ANSI/TIA-1096-A,
GTVX-SMT-N-88-TR
GTVX-SMT-N-88-50
-N-88
2002/95/EC
LR78160
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