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    FOOTPRINT PLCC 208 Search Results

    FOOTPRINT PLCC 208 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TN80C186XL-12 Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 PLCC Package, Industrial Temp spec. Visit Rochester Electronics LLC Buy
    N80C152JC-1-G Rochester Electronics LLC Rochester Manufactured 80C152, 8 bit Microcontroller, 68 PLCC Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy
    EN80C186XL-12 Rochester Electronics LLC Rochester Manufactured 80C186XL, Microprocessor, 68 PLCC Package, Industrial Temp spec. Visit Rochester Electronics LLC Buy
    IN80C188-16-G Rochester Electronics LLC Rochester Manufactured 80C188, Microprocessor, 68 PLCC Package, Industrial Temp spec. Visit Rochester Electronics LLC Buy
    EN80C196KC20 Rochester Electronics LLC Rochester Manufactured 80C196KC, Microprocessor, 68 PLCC Package, Industrial Temp spec. Visit Rochester Electronics LLC Buy

    FOOTPRINT PLCC 208 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    footprint plcc 208

    Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
    Text: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC


    Original     		PDF SXT6051 SXT6251 SXT6282 144-Pin LXT300Z/301Z 28-Pin LXT304A footprint plcc 208 PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs

    plx 9030

    Abstract: FOOTPRINTS CONNECTOR ssop-4 footprint plcc 208 plx 9030 176-pin pqfp PLCC pin configuration FOOTPRINTS CONNECTOR 2 PIN 14 pin plcc socket footprint soic 20 pci connector footprint plx 9030 data sheet
    Text: PCI 9030RDK–LITE PCI SMARTarget Rapid Development Kit Features •A PCI v2.2 prototype adapter board design based on the PLX PCI 9030 SMARTarget I/O Accelerator ■ Surface mount footprints on the board support industry standard embedded CPUs, DSPs, FPGAs, CPLDs and


    Original     		PDF 9030RDK 100-pin 9030RDK-LITE 9030/LITE-RDK-PB-P1-2 plx 9030 FOOTPRINTS CONNECTOR ssop-4 footprint plcc 208 plx 9030 176-pin pqfp PLCC pin configuration FOOTPRINTS CONNECTOR 2 PIN 14 pin plcc socket footprint soic 20 pci connector footprint plx 9030 data sheet

    heraeus pd944

    Abstract: heraeus pd945 Amicon d125f D125F3 PD945 PD944 AMICON D125F AmiconD125F TSSOP footprint
    Text: CHAPTER 4 THROUGH-HOLE MOUNTING METHODS page Soldering by dipping or solder wave 4-2 Repairing soldered joints 4-2 Philips Semiconductors IC Packages Through-hole mounting methods Chapter 4 SOLDERING BY DIPPING OR SOLDER WAVE The maximum temperature of the solder must not exceed


    Original     		PDF MLC742 heraeus pd944 heraeus pd945 Amicon d125f D125F3 PD945 PD944 AMICON D125F AmiconD125F TSSOP footprint

    BMI-S-203-F

    Abstract: PLCC-48 footprint BMI-S-201-C BMIS-101 BMI-S-203-C BMI-C-004-SN BMIC-001 LTES461 BMI-S-204-F BMIS-201-F
    Text: global solutions : local support ª | Board Level Shields and Contacts www.lairdtech.com Laird Technologies is the world-leader in the design and supply of customized performance-critical products for wireless and other advanced electronic applications. Laird Technologies partners with its customers to help


    Original     		PDF

    68L SOT 353

    Abstract: tip 3035 transistor C04-067 footprint jedec MS-026 TQFP SP-750 footprint jedec MS-026 TQFP 128 C0421 30014 c04090 transistor wm
    Text: SECTION 11 PACKAGING Outlines and Parameters . 1 Product Tape and Reel Specifications . 58


    Original     		PDF DS00049R-page 68L SOT 353 tip 3035 transistor C04-067 footprint jedec MS-026 TQFP SP-750 footprint jedec MS-026 TQFP 128 C0421 30014 c04090 transistor wm

    QCI-39000

    Abstract: No abstract text available
    Text: SECTION 11 PACKAGING Commercial/Industrial Outlines and Parameters . 11-1 Product Tape and Reel Specifications . 11-52


    Original     		PDF DS00049Q-page 24LC65-I/SN PIC16C54-RCI/SO DS30258C-page QCI-39000

    QCI-39000

    Abstract: C04090 C04-067
    Text: SECTION 11 PACKAGING Commercial/Industrial Outlines and Parameters . 11-1 Product Tape and Reel Specifications . 11-52


    Original     		PDF DS00049N-page 11-ii 24LC65-I/SN PIC16C54-RCI/STemperature DS30258C-page QCI-39000 C04090 C04-067

    MO-193 footprint

    Abstract: CA 4570 QCI-39000
    Text: PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Microcontroller Products


    Original     		PDF 24LC65-I/SN PIC16C54-RCI/SO 28CXX 93LCXX MO-193 footprint CA 4570 QCI-39000

    Preci-Dip Durtal SA

    Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
    Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin


    Original     		PDF CH-2800 540-PP-020-24-000-1 540-PP-028-24-000-1 540-PP-032-24-000-1 540-PP-044-24-000-1 540-PP-052-24-000-1 540-PP-068-24-000-1 540-PP-084-24-000-1 Preci-Dip Durtal SA C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148

    PCT-GF30

    Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
    Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID [email protected] 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount


    Original     		PDF

    35x35 bga

    Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
    Text: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID [email protected] 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169


    Original     		PDF PREC68 35x35 bga C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    PCS-032SMU-11

    Abstract: PCS-044SMU-11 PCS-052SMU-11 PCS-044SMU-12T MO-047 MO-052 PCS-052SMU-11T PCS-052SMU-12T PCS-068SMU-11 TX8136-20
    Text: PCS SMU Series Ultra Low Profile Surface Mount PLCC Sockets C PCS-068SMU-11 FEATURES: PERFORMANCE SPECIFICATIONS: The Augat SMU Series Surface Mount Chip carrier sockets are an "Ultra" low profile, .175" 4.45 for JEDEC dimensioned PLCC devices. The lower


    Original     		PDF PCS-068SMU-11 MIL-STD-1344, PCS-052SMU-11T PCS-052SMU-11 PCS-052SMU-12T PCS-052SMU-12 PCS-068SMU-11T PCS-068SMU-12T PCS-032SMU-11 PCS-044SMU-11 PCS-052SMU-11 PCS-044SMU-12T MO-047 MO-052 PCS-052SMU-11T PCS-052SMU-12T PCS-068SMU-11 TX8136-20

    ispMACH 4A5

    Abstract: TQFP 44 PACKAGE footprint footprint tqfp 208 footprint plcc 208 footprint pqfp 208 lattice m4a3 TQFP 48 PACKAGE footprint footprint TQFP 48 ispMACH M4A3 100-pin BGA
    Text: Introduction to ispMACH 4A Family TM Introduction The ispMACH 4A Family from Lattice offers an exceptionally flexible architecture and delivers a superior Complex Programmable Logic Device CPLD solution of easy-to-use silicon products and software tools. The


    Original     		PDF M4A5-32/32 M4A3-32/32 M4A5-64/32 M4A3-64/32 M4A5-256/128 M4A3-256/128 M4A3-256/160 M4A3-384/160 M4A3-512/160 44-Pin ispMACH 4A5 TQFP 44 PACKAGE footprint footprint tqfp 208 footprint plcc 208 footprint pqfp 208 lattice m4a3 TQFP 48 PACKAGE footprint footprint TQFP 48 ispMACH M4A3 100-pin BGA

    240817

    Abstract: SURFACE MOUNT TECHNOLOGY
    Text: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,


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    programming smt machine

    Abstract: pick and place robot tank water level control A5668-01 SURFACE MOUNT RESISTOR SMT Process application 741 heat exchanger wired pick and place robot water pumping machine control schematic
    Text: Leaded Surface Mount Technology SMT 7.1 7 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight, volume, and


    Original     		PDF

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318

    orcad components footprints

    Abstract: pci verilog code ORCAD block code error management, verilog source code 44-PIN 48-PIN SOIC EEPROM pci schematics 54-PIN verilog code for EEPROM Controller
    Text: High-Performance, Flexible Hardware Development Platform PCI 9056RDK-LITE • PCI r2.2 compliant PCI form factor ■ PLX PCI 9056 I/O Accelerator Rapid Development Kit For PCI 9056 Generic Local Bus Designs – 32-bit, 66MHz PCI bus operation ■ CPLD Local Bus memory


    Original     		PDF 9056RDK-LITE 32-bit, 66MHz 128KB 30x25 9056/LITE-RDK-PB-P1-1 orcad components footprints pci verilog code ORCAD block code error management, verilog source code 44-PIN 48-PIN SOIC EEPROM pci schematics 54-PIN verilog code for EEPROM Controller

    pci plx 9656

    Abstract: verilog code for pci PCI 9656 schematic flash controller verilog code pci verilog code PCI 9656 verilog pci footprints pci 9054 44-PIN 48-PIN
    Text: High-Performance, Flexible Hardware Development Platform PCI 9656RDK-LITE • PCI r2.2 compliant PCI form factor ■ The PCI 9656 I/O Accelerator Rapid Development Kit For PCI 9656 Generic Local Bus Designs – Supports 64-bit, 66MHz PCI bus operation ■ CPLD


    Original     		PDF 9656RDK-LITE 64-bit, 66MHz 128KB 30x25 9656/LITE-RDK-PB-P1-1 pci plx 9656 verilog code for pci PCI 9656 schematic flash controller verilog code pci verilog code PCI 9656 verilog pci footprints pci 9054 44-PIN 48-PIN

    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


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    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PDF PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001

    clock generator of computer motherboard

    Abstract: ARK2000PV RAMDAC DIP vga video genlock pll soic 8 WD90C31 8-bit VGA ramdac ARK LOGIC ARK1000PV ics1494 SOIC 20 pin package datasheet
    Text: ICS Product Selection Guide Video Timing Generator Products PRODUCT APPLICATION PC Graphics Clock Generators Western Digital Compatible Graphics Clock Generators ICS DEVICE TYPE DESCRIPTION MAX FREQUENCY CLOCK OUTPUTS PACKAGE TYPES PAGE ICS1494 NOT RECOMMENDED FOR


    Original     		PDF 20-Pin ICS2494/ ICS2494A ICS2495 16-Pin ICS2496 ICS2595 ICS2494 clock generator of computer motherboard ARK2000PV RAMDAC DIP vga video genlock pll soic 8 WD90C31 8-bit VGA ramdac ARK LOGIC ARK1000PV ics1494 SOIC 20 pin package datasheet

    FP-X4KPG223-01

    Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
    Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators


    Original     		PDF XC2018, XC2018 XC3020, XC3064, XC3042, XC3090, XC3090 FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01

    Untitled

    Abstract: No abstract text available
    Text: ADVANCED INTERCONNECTIONS QFP/PLCC Adapters Patents issued and/or pending. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 QFP/PLCC Adapters Tel. 401-823-5200 • FAX 401-823-8723 Body Material: FR-4: Fiberglass Epoxy Board U.L. Rated 94V-0, Index 140"C 284’ F


    OCR Scan     		PDF QQ-B-626,