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    PCN0808

    Abstract: EPM3128ATC100-10 EPM240T100C5N EPM3064ATC100-10 EPM3064ATC100-10N EPM570T100C5 EPM570T100I5N EPM570T100C5N EPM3064ATC44-10 EPM3256ATC144-10
    Text: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0808 WIRE-BOND DIAMETER REDUCTION FOR SELECTED TQFP PACKAGES Change Description Altera is implementing bond wire diameter reduction from 1.0 mil to 0.8 mil on product lines assembled in the TQFP package. This change will be implemented on selected MAX CPLD and


    Original     		PDF PCN0808 40T100C5AA EPM240T100C5N EPM240T100C5NRR EPM240T100C5RR EPM240T100C5TT EPM240T100I5 EPM240T100I5N EPM240T100I5NRR EPM240T100I5RR PCN0808 EPM3128ATC100-10 EPM240T100C5N EPM3064ATC100-10 EPM3064ATC100-10N EPM570T100C5 EPM570T100I5N EPM570T100C5N EPM3064ATC44-10 EPM3256ATC144-10

    PCN0813

    Abstract: EPM240T100C5N EP1C3T144C8N EPM240T100I5N EPM1270T144C5N EPM570T144C5N EPM240T100C5 EPM570T100C5N EPM2210F256A5N f324
    Text: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0813 POLYIMIDE WAFER COAT REMOVAL FOR SELECTED ALTERA DEVICES Change Description Altera is implementing a change to the wafer coat on selected product lines fabricated at Taiwan Semiconductor Manufacturing Co. TSMC . This change includes the exclusion of the existing


    Original     		PDF PCN0813 PM2210GF256C5N EPM2210GF256C5RR EPM2210GF256I5 EPM2210GF256I5N EPM2210GF324C3 EPM2210GF324C3N EPM2210GF324C4 EPM2210GF324C4N EPM2210GF324C5 PCN0813 EPM240T100C5N EP1C3T144C8N EPM240T100I5N EPM1270T144C5N EPM570T144C5N EPM240T100C5 EPM570T100C5N EPM2210F256A5N f324