emmc controller
Abstract: Sandisk iNAND micron emmc eMMC Sandisk eMMC Sandisk iNAND eMMC 8GB eMMC SLC emmc code emmc sector size Sandisk NAND Flash memory controller ecc
Text: Micron e-MMC Embedded Memory Simplifies High-Capacity Storage for Mobile and Embedded Systems Summary This white paper addresses the various functions NAND designers face today. It also discusses the ways that e-MMC embedded memory can provide the necessary NAND Flash functions in an easy-to-use BGA
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TN-29-18
Abstract: TN2918 micron emmc emmc EXT_CSD micron emmc 4.3 eMMC emmc Extended CSD MultiMediaCard System Specification Version MMCA emmc csd emmc boot
Text: TN-29-18: Booting from Embedded MMC Introduction Technical Note Booting from Embedded MMC Introduction MultiMediaCard MMC technology provides low-cost data storage media for many mobile applications. MMC benefits include: • Royalty-free design • Industry-standard interface
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TN-29-18:
09005aef822f5f67
09005aef822f5fbb
tn2918
TN-29-18
micron emmc
emmc EXT_CSD
micron emmc 4.3
eMMC
emmc Extended CSD
MultiMediaCard System Specification Version MMCA
emmc csd
emmc boot
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LPDDR2 PoP
Abstract: LPDDR2 micron lpddr2 lpddr2 datasheet 216-ball LPDDR lpddr2 nand mcp Micron 512MB nand FLASH 136-Ball 168-ball LPDDR Micron NAND
Text: A Perfect Match for Matchless Performance Micron Multichip Packages Form Factor, Speed, Power. Choose All That Apply. Form factor, speed, power—your mobile customers want all three. With Micron’s MCPs, you can respond to customers’ everincreasing demands without compromising leading-edge performance. Mix and match devices, configurations, and package
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XAM3359AZCZ100
Abstract: No abstract text available
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual
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d2516ec
Abstract: KE4CN2H5A kingston memory schematic
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision C.1 May 22, 2014 Author: Gerald Coley [email protected] Contributing Editor: Robert P J Day Page 1 of 126 Rev C.1 REF: BBONEBLK_SRM BeagleBone Black System
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lpddr4
Abstract: emmc pcb layout
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual
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35RAPC
Abstract: Sandisk emmc FBGA169 ADSP-BF518
Text: ADSP-BF518F EZ-Board Evaluation System Manual TM Revision 1.1, June 2009 Part Number 82-000217-01 Analog Devices, Inc. One Technology Way Norwood, Mass. 02062-9106 Copyright Information 2009 Analog Devices, Inc., ALL RIGHTS RESERVED. This document may not be reproduced in any form without prior, express written
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ADSP-BF518F
35RAPC
Sandisk emmc
FBGA169
ADSP-BF518
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Micron TLC
Abstract: micron emmc Micron NAND onfi MICRON NAND MLC TLC nand MICRON NAND sLC micron ecc nand ONFI micron emmc application note SLC NAND endurance
Text: Micron Memory Which NAND solution is best for my design? Micron offers a full line of high-performance memory solutions—from SLC, MLC, and TLC to Serial NAND, e•MMC , and MCPs—for a variety of applications. And we work with chipset vendors, OS designers, and other
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SDIN7DP2-4G
Abstract: TWL6037 Sandisk eMMC OMAP5432 OMAP5430 SDIN7DP2 IN248 IN255 SN75LVCP412
Text: OMAP5432 ES2.0 EVM System Reference Manual Texas Instruments Revision 0.4 March 1, 2013 DOC-21163 OMAP5432 ES2.0 EVM System Reference Manual Preface Read This First About This Manual This manual should be used by software and hardware developers of applications based on the
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OMAP5432
DOC-21163
750-2628-2XX-SCH)
EVM5432
750-2628-213-EBOM)
SDIN7DP2-4G
TWL6037
Sandisk eMMC
OMAP5430
SDIN7DP2
IN248
IN255
SN75LVCP412
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Micron NAND flash controller
Abstract: TLC nand Micron NAND Flash MLC Micron TLC nand flash ONFI 3.0 micron emmc nand flash tlc emmc ONFI ONFI 3.0
Text: NVM Advantages for Multiple Markets Micron Nonvolatile Memory Micron does more than design and manufacture nonvolatile NVM memory. We strive to solve design challenges through better engineering—by raising the bar on features, functionality, and performance. We’ll
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Micron NAND flash controller
TLC nand
Micron NAND Flash MLC
Micron TLC
nand flash ONFI 3.0
micron emmc
nand flash tlc
emmc
ONFI
ONFI 3.0
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toshiba emmc 4.4
Abstract: micron emmc micron emmc 4.4 toshiba emmc micron emmc 4.3 TCD1304DG micron eMMC 100 ball BGA eMMC intel eMMC eMMC 4.4
Text: Freescale Semiconductor Application Note Document Number: AN4198 Rev. 0, 09/2010 Architectural Differences between the i.MX23, i.MX25, and i.MX28 by Multimedia Applications Division Freescale Semiconductor, Inc. Austin, TX 1 Introduction This application note describes the key architectural
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AN4198
32-bit
ARM926EJ-S
ARM11
toshiba emmc 4.4
micron emmc
micron emmc 4.4
toshiba emmc
micron emmc 4.3
TCD1304DG
micron eMMC 100 ball BGA
eMMC intel
eMMC
eMMC 4.4
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Toshiba emmc
Abstract: No abstract text available
Text: Mobile Storage Zoom Family ‑ Flash Card Controllers SM2671 Key Features MMC Controller Overview The SM2671 is a state-of-the-art MMC controller designed by Silicon Motion, Inc. With backward compatibility with MMC4.2/MMC4.1 and legacy MMC specifications, the
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SM2671
48-pin
Toshiba emmc
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OV5642
Abstract: sony IMX 322 cmos DA9053 Atheros AR6003 AR6003 SII9022 ov5642 omnivision HSD100PXN1-A00-C11 SiI9022 HDMI transmitter wi-fi schematic miniPCIe
Text: MCIMX53SMD Board Hardware User’s Guide IMX53SMDHUG Rev. 0 9/2011 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road
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MCIMX53SMD
IMX53SMDHUG
CH370
OV5642
sony IMX 322 cmos
DA9053
Atheros AR6003
AR6003
SII9022
ov5642 omnivision
HSD100PXN1-A00-C11
SiI9022 HDMI transmitter
wi-fi schematic miniPCIe
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tn0008
Abstract: mobile ddr2 TN-00-08 micron BGA SDRAM
Text: TN-00-08: Thermal Applications Introduction Technical Note Thermal Applications Introduction This technical note defines a general method and the criteria for measuring and ensuring that Micron memory components and modules do not exceed the maximum allowable temperature. The specified temperatures will help ensure the reliability and
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09005aef805ec8a5/S
09005aef805ec8b1
TN0008
mobile ddr2
TN-00-08
micron BGA SDRAM
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micron emmc
Abstract: toshiba emmc 4.4 emmc toshiba toshiba emmc samsung emmc boot movinand emmc BOOT_LOCK movinand efuse micron emmc 4.3
Text: Freescale Semiconductor Application Note Document Number: AN3682 Rev. 0, 06/2009 i.MX25 IC Identification Module IIM Fusebox by Multimedia and Applications Division Freescale Semiconductor, Inc. Austin, TX The IC identification module (IIM) provides the primary
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AN3682
micron emmc
toshiba emmc 4.4
emmc toshiba
toshiba emmc
samsung emmc boot
movinand emmc
BOOT_LOCK
movinand
efuse
micron emmc 4.3
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micron emmc
Abstract: Toshiba emmc Samsung Nexus S JTAG pins micron emmc 4.3 toshiba emmc 4.4 EMMC emmc "boot mode" emmc toshiba micron emmc 4.4 eMMC memory
Text: Freescale Semiconductor Application Note Document Number: AN3652 Rev. 1, 04/2010 i.MX35 IC Identification Module IIM Fusebox The IC identification module (IIM) provides the primary user-visible mechanism for interfacing with on-chip fuse elements. Among the uses for the fuses are unique chip
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micron emmc
Toshiba emmc
Samsung Nexus S JTAG pins
micron emmc 4.3
toshiba emmc 4.4
EMMC
emmc "boot mode"
emmc toshiba
micron emmc 4.4
eMMC memory
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marvell armada 310
Abstract: Toshiba emmc
Text: Cover Marvell ARMADA 16x Applications Processor Family Version 3.2.x Boot ROM Reference Manual Doc. No. MV-S301208-00, Rev. November 2010 PUBLIC RELEASE Marvell. Moving Forward Faster Marvell® ARMADA 16x Applications Processor Family Version 3.2.x Boot ROM Reference Manual
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MV-S301208-00
marvell armada 310
Toshiba emmc
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sandisk eMMC 4.41
Abstract: Sandisk eMMC micron emmc eMMC 4.41 application note emmc EXT_CSD eMMC mmc EXT_CSD emmc 4.41 EXT_CSD IMX23RM
Text: Freescale Semiconductor Errata Document Number: i.MX23CE Rev. 2, 04/2010 Chip Errata for the i.MX23 This document details all known silicon errata for the i.MX23. Table 1 provides a revision history for this document. Table 1. Document Revision History Rev.
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sandisk eMMC 4.41
Sandisk eMMC
micron emmc
eMMC 4.41 application note
emmc EXT_CSD
eMMC
mmc EXT_CSD
emmc 4.41
EXT_CSD
IMX23RM
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sandisk eMMC 4.41
Abstract: EXT_CSD
Text: Freescale Semiconductor Errata Document Number: IMX23CE Rev. 4, 01/2013 Chip Errata for the IMX23 This document details all known silicon errata for the i.MX23. Table 1 provides a revision history for this document. Table 1. Document Revision History Rev.
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IMX23CE
IMX23
ARM926EJ-S
sandisk eMMC 4.41
EXT_CSD
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MICRON NAND u-boot
Abstract: spi32766
Text: Freescale Semiconductor T4240 QDS Quick Start Guide Document Number:T4240QDSQSG Rev.0, 06/2013 T4240 QDS Quick Start Guide The QorIQ T4240 development system T4240 QDS-16GPA is a flexible system that supports the 24-virtual core T4240 processor. The T4240 QDS main
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T4240QDSQSG
T4240
QDS-16GPA)
24-virtual
MICRON NAND u-boot
spi32766
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asus motherboard circuit diagram
Abstract: SuperSpeed USB 3.0 to Serial ATA Bridge P1263 intel MOTHERBOARD SERVICE MANUAL
Text: Intel Atom Processor E3800 Product Family Datasheet October 2013 Revision 1.0 Reference Number: 538136 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
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IRQ15,
IRQ14.
IRQ12,
IRQ11,
IRQ10,
asus motherboard circuit diagram
SuperSpeed USB 3.0 to Serial ATA Bridge
P1263
intel MOTHERBOARD SERVICE MANUAL
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toshiba onenand
Abstract: toshiba emmc 4.4 Toshiba 512 NAND MLC FLASH BGA movinand emmc MICRON oneNAND micron emmc Toshiba emmc movinand micron emmc 4.3 fuse n20
Text: Freescale Semiconductor Application Note Document Number: AN3684 Rev. 0, 06/2009 i.MX25 Boot Options by Multimedia and Applications Division Freescale Semiconductor, Inc. Austin, TX This document describes the boot options for the i.MX25 device. For more in-depth details about how the boot
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AN3684
MCIMX25RM)
toshiba onenand
toshiba emmc 4.4
Toshiba 512 NAND MLC FLASH BGA
movinand emmc
MICRON oneNAND
micron emmc
Toshiba emmc
movinand
micron emmc 4.3
fuse n20
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micron emmc 4.4
Abstract: micron emmc micron emmc 4.3 emmc 4.5 ARMv5 ARM1136 ARMv6 Architecture Reference Manual eMMC 4.4 ARMv6 emmc reader
Text: L210 Cache Controller Revision r0p5 Technical Reference Manual Copyright 2003-2006 ARM Limited. All rights reserved. ARM DDI 0284G L210 Cache Controller Technical Reference Manual Copyright © 2003-2006 ARM Limited. All rights reserved. Release Information
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Glossary-10
Glossary-11
Glossary-12
micron emmc 4.4
micron emmc
micron emmc 4.3
emmc 4.5
ARMv5
ARM1136
ARMv6 Architecture Reference Manual
eMMC 4.4
ARMv6
emmc reader
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Modified Coffin-Manson Equation Calculations
Abstract: TN-00-18 TN0018 micron memory model for ddr3 TN-00-08 ddr3 MTBF 59559 Coffin-Manson Equation mobile ddr2 7994
Text: TN-00-18: Temperature Uprating on Semiconductors Introduction Technical Note Uprating Semiconductors for High-Temperature Applications Introduction Uprating is used to evaluate a part’s ability to function and perform when it is used outside of the manufacturer’s specified temperature range.21 For example, the
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TN-00-08
09005aef81694133/Source:
09005aef8169415f
TN0018
Modified Coffin-Manson Equation Calculations
TN-00-18
micron memory model for ddr3
ddr3 MTBF
59559
Coffin-Manson Equation
mobile ddr2
7994
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