16G nand flash
Abstract: emmc csd emmc mmc EXT_CSD emmc Extended CSD NAND16GAH0D EXT_CSD NUMONYX emmc 3R14 CRC16
Text: NAND08GAH0A NAND16GAH0D 1 Gbyte, 2 Gbyte, 1.8 V/3 V supply, NAND Flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND Flash memory with MultiMediaCard interface ■ 1, 2 Gbytes of formatted data storage ■ eMMC/MultiMediaCard system specification,
|
Original
|
PDF
|
NAND08GAH0A
NAND16GAH0D
16G nand flash
emmc csd
emmc
mmc EXT_CSD
emmc Extended CSD
NAND16GAH0D
EXT_CSD
NUMONYX emmc
3R14
CRC16
|
CMD24
Abstract: emmc ball
Text: NAND08GAH0B 1-Gbyte, 1.8 V/3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ 1 Gbyte of formatted data storage ■ eMMC/MultiMediaCard system specification,
|
Original
|
PDF
|
NAND08GAH0B
CMD24
emmc ball
|
CLKIN32
Abstract: No abstract text available
Text: CYUSB302x SD3 USB and Mass Storage Peripheral Controller Features • ■ ■ ■ ■ Latest-generation storage support ❐ SD3.0/SDXC – UHS1 SDR50 / DDR50 Master ❐ eMMC 4.4 Master ❐ SDIO 3.0 Master ■ Independent power domains for core and I/O ■
|
Original
|
PDF
|
CYUSB302x
SDR50
DDR50
CLKIN32
|
NAND08GAH0B
Abstract: emmc csd emmc Initialization CMD24 emmc ball emmc 4.4 standard jedec MultiMediaCard System Specification MultiMediaCard System Specification Version MMCA emmc jedec mechanical standard emmc spi
Text: NAND08GAH0B 1-Gbyte, 1.8 V/3 V supply, NAND flash memories with MultiMediaCard interface Features • Packaged NAND flash memory with MultiMediaCard interface ■ 1 Gbyte of formatted data storage ■ eMMC/MultiMediaCard system specification, compliant with V4.2
|
Original
|
PDF
|
NAND08GAH0B
NAND08GAH0B
emmc csd
emmc Initialization
CMD24
emmc ball
emmc 4.4 standard jedec
MultiMediaCard System Specification
MultiMediaCard System Specification Version MMCA
emmc jedec mechanical standard
emmc spi
|
EXT_CSD
Abstract: eMMC emmc 4.5 MultiMediaCard System Specification Version MMCA 16G nand flash CMD60-CMD63 mmc EXT_CSD NAND08GAH0A eMMC 4.4 rca a 8321
Text: NAND08GAH0A NAND16GAH0D 1 Gbyte, 2 Gbyte, 1.8 V/3 V supply, NAND Flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND Flash memory with MultiMediaCard interface ■ 1, 2 Gbytes of formatted data storage ■ eMMC™/MultiMediaCard system
|
Original
|
PDF
|
NAND08GAH0A
NAND16GAH0D
EXT_CSD
eMMC
emmc 4.5
MultiMediaCard System Specification Version MMCA
16G nand flash
CMD60-CMD63
mmc EXT_CSD
NAND08GAH0A
eMMC 4.4
rca a 8321
|
KLM8G2FEJA-A001
Abstract: KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMXGXFEJA-X001 KLMCGAFEJA-B001
Text: Hello All, 8/16/32GB 27nm eMMC parts are now available to sample CS type ! Please input sample requests for all customers using old generations of moviNAND now. We'll expedite for ASAP delivery. SEC will ramp 27nm production quickly so it is imperative that all customers get qualified ASAP.
|
Original
|
PDF
|
8/16/32GB
KLMXGXFEJA-X001
KLM8G2FEJA-A001
KLMAG4FEJA-A001
KLM8G2FEJA
KLMBG8FEJA-A001
KLMAG4FEJA-B001
klm8g
samsung eMMC 4.5
Samsung eMMC 4.41
KLMCGAFEJA-B001
|
eMMC
Abstract: emmc spec samsung eMMC 4.5 emmc 4.5 spec emmc operation emmc Initialization KMCME0000M emmc 5.0 emmc 4.5 emmc spec samsung
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
|
Original
|
PDF
|
S19904EJ1V0AN00
CMD42
CMD43
CMD54
CMD55
CMD56
CMD59
eMMC
emmc spec
samsung eMMC 4.5
emmc 4.5 spec
emmc operation
emmc Initialization
KMCME0000M
emmc 5.0
emmc 4.5
emmc spec samsung
|
XAM3359AZCZ100
Abstract: No abstract text available
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual
|
Original
|
PDF
|
|
d2516ec
Abstract: KE4CN2H5A kingston memory schematic
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision C.1 May 22, 2014 Author: Gerald Coley [email protected] Contributing Editor: Robert P J Day Page 1 of 126 Rev C.1 REF: BBONEBLK_SRM BeagleBone Black System
|
Original
|
PDF
|
|
lpddr4
Abstract: emmc pcb layout
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual
|
Original
|
PDF
|
|
35RAPC
Abstract: Sandisk emmc FBGA169 ADSP-BF518
Text: ADSP-BF518F EZ-Board Evaluation System Manual TM Revision 1.1, June 2009 Part Number 82-000217-01 Analog Devices, Inc. One Technology Way Norwood, Mass. 02062-9106 Copyright Information 2009 Analog Devices, Inc., ALL RIGHTS RESERVED. This document may not be reproduced in any form without prior, express written
|
Original
|
PDF
|
ADSP-BF518F
35RAPC
Sandisk emmc
FBGA169
ADSP-BF518
|
K4X2G323PD8GD8
Abstract: K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03
Text: PRODUCT SELECTION GUIDE Displays, Memory and Storage 2H 2012 Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, mobile, and graphics memory are found in computers—from
|
Original
|
PDF
|
BR-12-ALL-001
K4X2G323PD8GD8
K9HFGY8S5A-HCK0
K4H511638JLCCC
samsung eMMC 5.0
KLMBG4GE2A-A001
K9K8G08U0D-SIB0
K4X51163PK-FGD8
KLMAG2GE4A
k4h561638n-lccc
K4G10325FG-HC03
|
SDIN7DP2-4G
Abstract: TWL6037 Sandisk eMMC OMAP5432 OMAP5430 SDIN7DP2 IN248 IN255 SN75LVCP412
Text: OMAP5432 ES2.0 EVM System Reference Manual Texas Instruments Revision 0.4 March 1, 2013 DOC-21163 OMAP5432 ES2.0 EVM System Reference Manual Preface Read This First About This Manual This manual should be used by software and hardware developers of applications based on the
|
Original
|
PDF
|
OMAP5432
DOC-21163
750-2628-2XX-SCH)
EVM5432
750-2628-213-EBOM)
SDIN7DP2-4G
TWL6037
Sandisk eMMC
OMAP5430
SDIN7DP2
IN248
IN255
SN75LVCP412
|
emmc spec
Abstract: ppi interface 1007 ppi 2120 ADSP-BF524KBCZ-4C2 sk emmc e-mmc ADZS-BF518F-EZLITE emmc controller ADSP-BF548BBCZ-5A ADSP-BF516KSWZ-4F4
Text: Blackfin Processor Family Cryptography Rights Management Open Source Car Telematics IPTV Mobile TV Driver Assistance Biometrics Streaming Media High Definition Embedded Processing Why Choose a Blackfin Processor? Effects Processing • High performance, 16-/32-bit processor core with DSP and RISC functionality
|
Original
|
PDF
|
16-/32-bit
G04492-5-10/08
emmc spec
ppi interface 1007
ppi 2120
ADSP-BF524KBCZ-4C2
sk emmc
e-mmc
ADZS-BF518F-EZLITE
emmc controller
ADSP-BF548BBCZ-5A
ADSP-BF516KSWZ-4F4
|
|
|
OMAP5430
Abstract: OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba
Text: Version F EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5430 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.
|
Original
|
PDF
|
OMAP5430
SWPS052F
OMAP5430
OMAP5432
MIPI CSI-2 Parallel bridge
Toshiba eMMC 4.40
emmc pcb layout
toshiba eMMC DS
MIPI DPI
CAMERA PARALLEL RGB TO MIPI CSI-2
TWL6041
emmc toshiba
|
ADSP-BF561SBBCZ-5A
Abstract: D1854 ADSP-BF537-STAMP adzs-hpusb-ice ADZS-BF533 ADP5022 ADSP-BF516BBCZ-4 ADSP-BF518BBCZ-4F4 ADSP-BF539BBCZ-5F8 ADSP-BF504BCPZ
Text: Blackfin Processor Family Why Choose a Blackfin Processor? • High performance, 16-/32-bit Blackfin processor core with DSP and RISC functionality and programmability • Eliminates need for multiple separate processors • Large portfolio of products ranging from 300 MHz to 600 MHz
|
Original
|
PDF
|
16-/32-bit
G04492-2-9/10
ADSP-BF561SBBCZ-5A
D1854
ADSP-BF537-STAMP
adzs-hpusb-ice
ADZS-BF533
ADP5022
ADSP-BF516BBCZ-4
ADSP-BF518BBCZ-4F4
ADSP-BF539BBCZ-5F8
ADSP-BF504BCPZ
|
ADZS-DBGAGENT-BRD
Abstract: ADSP-BF537-STAMP d1871 rs232 to ppi ADSP-BF504BCPZ-4F ADZS-BFSHUSB-EZEXT eMMC ADSP-BF527 EMMC software EMMC HOST CONTROLLER
Text: Blackfinプロセッサ・ファミリー Blackfin プロセッサが選ばれる理由 • DSPと RISC の機能性とプログラマビリティを備えた16/32 ビットの高性能プロセッサ・コア • 複数の独立したプロセッサは不要
|
Original
|
PDF
|
600MHz
88-lead
ADSP-BF504KCPZ-4
ADSP-BF504BCPZ-3F
ADSP-BF504KCPZ-3F
ADSP-BF504BCPZ-4F
ADZS-DBGAGENT-BRD
ADSP-BF537-STAMP
d1871
rs232 to ppi
ADSP-BF504BCPZ-4F
ADZS-BFSHUSB-EZEXT
eMMC
ADSP-BF527
EMMC software
EMMC HOST CONTROLLER
|
SVID protocol
Abstract: No abstract text available
Text: Agilent Infiniium 9000 H-Series High-Definition Oscilloscopes Data Sheet See Your Signals in HD See Your Signals in HD The high-deinition 9000 H-Series oscilloscope offers up to 12 bits of resolution, which represents 4096 quantization levels, for precision signal viewing. The 9000 H-Series’
|
Original
|
PDF
|
BP-10-29-13)
5991-1520EN
SVID protocol
|
Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
|
Original
|
PDF
|
IMX50CEC
MCIMX50
|
Samsung eMMC 4.51
Abstract: samsung eMMC 4.5
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
|
Original
|
PDF
|
IMX50CEC
MCIMX50
Samsung eMMC 4.51
samsung eMMC 4.5
|
samsung eMMC 4.5
Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
|
Original
|
PDF
|
IMX50CEC
MCIMX50
samsung eMMC 4.5
Samsung eMMC 4.41
lpddr2 emmc
emmc 4.41 spec
emmc 4.5 spec
153 ball eMMC memory
Samsung eMMC 4.51
samsung* lpddr2* pop package
emmc Pin assignment
eMMC 4.4
|
samsung eMMC 4.5
Abstract: eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
|
Original
|
PDF
|
IMX50CEC
MCIMX50
samsung eMMC 4.5
eMMC 4.51
Samsung eMMC 4.41
emmc 4.5 spec
Samsung eMMC 4.51
emmc 4.41 spec
eMMC PoP
samsung lpddr2
153 ball eMMC memory 0.8
emmc spec samsung
|
Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
|
Original
|
PDF
|
IMX50CEC
MCIMX50
|
Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
|
Original
|
PDF
|
IMX50CEC
MCIMX50
|