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Abstract: No abstract text available
Text: Reliability and Quality Assurance 1. Views on Quality and Reliability Hitachi’s basic quality aims are to meet individual user’s purchase purpose and quality required, and to be at a satisfactory quality level considering general marketability. Quality required by users is
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Abstract: No abstract text available
Text: Power MOSFET Construction and Characteristics Power MOSFET in Detail 2. Construction and Characteristics Since Power MOSFETs operate principally as majority carrier devices, adverse influences are relatively small magnitude or importance. This is in contrast to the situation with minority carrier
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phototransistor ultraviolet
Abstract: 6N140 "immune to high radiation" H1061 Neutron sensitive PIN diode MIL-HDBK-279 4N55 6N134 military optocoupler high sensitive neutron PIN diode
Text: Radiation Immunity of Avago Technologies Optocouplers Application Note 1023 Introduction This application note describes the immunity of Avago Technologies optocoupters to the effects of high radiation environments, such as those encountered in military and space applications. According to
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MIL-HDBK-279,
NS-22,
NS-19,
MIL-M-38510F,
5954-1003E
phototransistor ultraviolet
6N140
"immune to high radiation"
H1061
Neutron sensitive PIN diode
MIL-HDBK-279
4N55
6N134
military optocoupler
high sensitive neutron PIN diode
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koike relays
Abstract: ed27 smd diode EM 231 WIRING DIAGRAM corona discharge circuit simulation smd transistor marking xy TOSHIBA Thyristor tunnel diode GaAs QFP100 injection molding machine wire diagram position sensitive diode circuit
Text: [ 2 ] Semiconductor Reliability Contents 1. Reliability Concept . 1 1.1 Defining and Quantifying Reliability. 1 1.2 1.3 Reliability and Time. 1
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NS-15,
koike relays
ed27 smd diode
EM 231 WIRING DIAGRAM
corona discharge circuit simulation
smd transistor marking xy
TOSHIBA Thyristor
tunnel diode GaAs
QFP100
injection molding machine wire diagram
position sensitive diode circuit
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UPGA301A
Abstract: FIRING squib scr 106 SCR 106 B scr firing pulse generating circuit
Text: MicroNOTE # 602 by: George Repucci UPGA301A Pulse Circuit Analysis The dynamic on-state characteristics of the UPGA301A are described. This device is assembled in Microsemi’s PowerMITE3 low profile, surface-mount package. The UPGA301A is an E-processed high speed silicon controlled
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UPGA301A
148ns.
125ns.
216ns.
FIRING squib
scr 106
SCR 106 B
scr firing pulse generating circuit
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ecg semiconductors master replacement guide
Abstract: transistor SMD marked RNW th 20594 TRANSISTOR si 6822 MIL-STD-202F-201A CT 1975 sam transistors br 6822 sun hold ras 2410 relay TRANSISTOR SMD MARKING CODE jg Mist Ultrasonic Humidifier
Text: RELIABILITY OF SEMICONDUCTOR DEVICES I. RELIABILITY OF SEMICONDUCTOR DEVICES 1. OUR PHILOSOPHY OF QUALITY 2. SEMICONDUCTOR RELIABILITY RELIABILITY OF SEMICONDUCTOR DEVICES I. RELIABILITY OF SEMICONDUCTOR DEVICES 1. OUR PHILOSOPHY OF QUALITY Since its foundation, Mitsubishi Electric has been seeking a philosophy of extending the business and contributing the society with high
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gold metal detectors
Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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Alumina ceramic AI203
Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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LS028B7UX01
Abstract: GS63 ls028 lcd sharp transflective Note10-3
Text: Technical Document LCD Specification LCD Group LS028B7UX01 LCD Module Product Specification June 2007 Transflective 240 x 400 portrait-mode LCD Module featuring high integration and wide viewing angles. Full Specifications Listing. RECORDS OF REVISION MODEL No.: LS028B7UX01
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LS028B7UX01
LS028B7UX01
LCP-2707023
LCP-27070231
GS63
ls028
lcd sharp transflective
Note10-3
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vgm5
Abstract: GS63 sharp lcd 21 pins
Text: Technical Document LCD Specification LCD Group LS028B7UX01 LCD Module Product Specification June 2007 Transflective 240 x 400 portrait-mode LCD Module featuring high integration and wide viewing angles. Full Specifications Listing. RECORDS OF REVISION MODEL No.: LS028B7UX01
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LS028B7UX01
LS028B7UX01
LCP-2707023
LCP-27070231
vgm5
GS63
sharp lcd 21 pins
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circuit diagram of very long range remote control
Abstract: RC-90023A SM10 SM20 wagner PADS Soldering and desoldering Cracking furnaces lambda transistor PWB series lambda ENC61000-4-2
Text: Lambda’s new SM Series of Power Modules are ideally designed for Telecommunications and Network applications. APPLICATION NOTES SM10 Series of Power Modules Lambda Electronics, Inc. 515 Broad Hollow Road Melville, New York 11747 Tel: 516 694-4200 or Toll Free: (800) LAMBDA-4/5
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gold metal detectors
Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
Text: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of
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CH03WIP
gold metal detectors
soft solder die bonding
schematic diagram intel atom
INCOMING RAW MATERIAL INSPECTION
lead side brazed hermetic
X-RAY INSPECTION
ausi die attach
electrical three phase schematic riser DIAGRAM
epoxy adhesive paste cte table
intel 24008
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IT 8517E
Abstract: 8517E induction cooker schematic diagram diode d.a.t.a. book objectives of automatic college bell induction cooker component list on pcb induction cooker circuit diagram ADE-410-002 Ultrasonic humidifier circuit Induction sealing machine circuit diagram
Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003.
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STDC7100
Abstract: STDC-71 photo transistor array NAND FLASH BGA
Text: Imaging Solutions Digital Photo Frames Digital Photo Frame SoC STDC7100 Conexant’s portfolio includes a comprehensive suite of semiconductor solutions for communications and consumer applications. Conexant’s portfolio of communication peripheral devices and system-onchip SoC solutions is the most complete product line of highly integrated
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STDC7100
STDC7100
PBR-201839
STDC-71
photo transistor array
NAND FLASH BGA
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DC7150
Abstract: digital photo frame TFT photo frame conexant USB NAND FLASH BGA CCIR656 photo transistor array DC715 CCIR656 camera usb
Text: Imaging Solutions Digital Photo Frames Digital Photo Frame SoC DC7150 Conexant’s portfolio includes a comprehensive suite of semiconductor solutions for communications and consumer applications. Conexant’s portfolio of communication peripheral devices and system-onchip SoC solutions is the most complete product line of highly integrated
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DC7150
DC7150
PBR-201767
digital photo frame
TFT photo frame
conexant USB
NAND FLASH BGA
CCIR656
photo transistor array
DC715
CCIR656 camera usb
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SM20
Abstract: SM20-24S12 SM20-24S15 UL-1950 1320UH IMC process inductor
Text: Lambda’s new SM Series of Power Modules are ideally designed for Telecommunications and Network applications. Instruction Manual SM20 Series of Power Modules Lambda Electronics, Inc. 515 Broad Hollow Road Melville, New York 11747 Tel: 516 694-4200 or Toll Free: (800) LAMBDA-4/5
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DRS24
N2510B2510BA
N1810B1810BA
N1410B1410BA
SM20
SM20-24S12
SM20-24S15
UL-1950
1320UH
IMC process inductor
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Untitled
Abstract: No abstract text available
Text: Reliability and Quality Assurance 1. Views on Quality and Reliability Hitachi’s basic quality aims are to meet individual user’s purchase purpose and quality required, and to be at a satisfactory quality level considering general marketability. Quality required by users is specifically
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Abstract: No abstract text available
Text: Reliability and Quality Assurance 1. Views on Quality and Reliability At Hitachi the basic views on quality are meeting the individual user’s purchase needs and required quality, and to be at the satisfied quality level as considered for general marketability. The quality
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Untitled
Abstract: No abstract text available
Text: Reliability and Q u ality A ssu ran ce 1. View s on Quality and R eliability Hitachi's basic quality aims are to m eet indi vidual user's purchase purpose and quality required, and to be at a satisfactory quality level considering general marketability.
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Untitled
Abstract: No abstract text available
Text: Reliability and Q u ality A ssu ra n c e 1. VIEWS ON QUALITY AND RELIABILITY Hitachi basic views on quality are based jon the principle th at m anufacturers should make products from the standpoint o f custom ers w ith their need and expectations. It is ideal
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Untitled
Abstract: No abstract text available
Text: RELIA BILITY AND Q UALITY 1. VIEWS ON QUALITY AND RELIABILITY Basic views on quality in H itachi are to m eet individual user’s purchase purpose and quality required, and to be at the satisfied quality level considering general m arketability. Quality required b y users is specifically clear i f the con tract specifica
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Untitled
Abstract: No abstract text available
Text: R eliab ility and Q uality A ssurance 1. Views on Quality and Reliability A t H itachi the basic view s on quality are m eeting the individual u se r’s purchase needs and required quality, and to be at the satisfied quality level as considered for general m arketability. T he quality
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HD10101
Abstract: No abstract text available
Text: QUALITY ASSURANCE OF ECL 1. Views On Quality and Reliability Basic views on quality in Hitachi are to meet individual users' purchase purpose and quality re quired, and to be at the satisfied quality level considering general marketability. Quality required
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temptronic TP03000A
Abstract: NXR-1400 INCOMING RAW MATERIAL INSPECTION procedure Sample form for INCOMING Inspection of RAW MATERIAL INCOMING MATERIAL INSPECTION procedure INCOMING MATERIAL FLOW PROCESS FOR GENERAL FABRICATION UNIT TP04000 nicolet nxr1400 TRIO TECH
Text: QUALITY CONTROL FLOW LG Semicon CONTENTS PAGE 1. Introduction . 2. Q uality A ssurance System 3. R eliability Test . 13 . 30 4. Failure M ode A n alysis .
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