CXTA94 Search Results

CXTA94 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
CXTA94		Central Semiconductor			Original	PDF

CXTA94 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
CP710 Abstract: CMPTA94 CXTA94 CZTA94 MPSA94 Text: PROCESS CP710 Small Signal Transistor PNP - High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 26 x 26 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 6.1 x 4.9 MILS Emitter Bonding Pad Area 5.2 x 5.2 MILS Top Side Metalization	Original	CP710 CMPTA94 CXTA94 CZTA94 MPSA94 22-March CP710 CMPTA94 CXTA94 CZTA94 MPSA94	PDF
CMPTA94 Abstract: CP710 CXTA94 CZTA94 MPSA94 Text: PROCESS CP710 Small Signal Transistors PNP - High VoltageTransistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 26 x 26 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 6.1 x 4.9 MILS Emitter Bonding Pad Area 5.2 x 5.2 MILS Top Side Metalization	Original	CP710 CMPTA94 CXTA94 CZTA94 MPSA94 CMPTA94 CP710 CXTA94 CZTA94 MPSA94	PDF
CMPTA94 Abstract: CP710 CXTA94 CZTA94 MPSA94 Text: PROCESS CP710 Central Small Signal Transistor TM Semiconductor Corp. PNP - High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 26 x 26 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 6.1 x 4.9 MILS Emitter Bonding Pad Area 5.2 x 5.2 MILS	Original	CP710 CMPTA94 CXTA94 CZTA94 MPSA94 CMPTA94 CP710 CXTA94 CZTA94 MPSA94	PDF
CXTA94 Abstract: chip die transistor Text: PROCESS CP710 Small Signal Transistor PNP - High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 26 x 26 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 6.1 x 4.9 MILS Emitter Bonding Pad Area 5.2 x 5.2 MILS Top Side Metalization	Original	CP710 CMPTA94 CXTA94 CZTA94 MPSA94 23-August chip die transistor	PDF
BF244 datasheet Abstract: 2N5133 equivalent MPS5771 BD345 BD347 BF244 2n5248 bf256 2N3304 2n5910 Text: Index Industry Part Number Central Process No. Page # Industry Part Number 1N456 .CPD64 . 216 1N456A.CPD64 . 216 1N457 .CPD64 . 216	Original	1N456 CPD64 1N456A. 1N457 1N457A. 1N458 BF244 datasheet 2N5133 equivalent MPS5771 BD345 BD347 BF244 2n5248 bf256 2N3304 2n5910	PDF
MPSA94 Abstract: CMPTA94 CP710 CXTA94 CZTA94 Text: PROCESS CP710 Small Signal Transistor PNP - High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 26 x 26 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 6.1 x 4.9 MILS Emitter Bonding Pad Area 5.2 x 5.2 MILS Top Side Metalization	Original	CP710 CMPTA94 CXTA94 CZTA94 MPSA94 631tage MPSA94 CMPTA94 CP710 CXTA94 CZTA94	PDF