TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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HL832N
Abstract: ELC4785 E679 DS7409 MO-298 amkor flip Amkor Technology HL832 MO-192 MO-195
Text: LAMINATE data sheet FlipStack CSP FlipStack® CSP: The FlipStack® CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment
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DS7409HGB
Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
Text: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of
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DS820C
DS7409HGB
DS7409HG
FCCSP
DS-7409HG
HL832 nx-a
HL832
E700G
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Untitled
Abstract: No abstract text available
Text: LAMINATE data sheet Features: et CSP Package: Thermal Performance: Amkor's etCSP® package is the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. This package can squeeze into applications requiring a thin form factor. The
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taiyo PSR4000
Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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amkor RDL
Abstract: amkor flip FCCSP JEDEC tray standard amkor Sip
Text: data sheet wafer level packaging CSPnl Features: CSPnl DSBGA / WLCSP / WSCSP / WLP Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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CSPNL
Abstract: amkor RDL wafer map format amkor amkor flip amkor Sip amkor polyimide FCCSP wafer map
Text: data sheet wafer level packaging CSPnl RDL Features: Packaging CSPnl Bump on Redistribution RDL (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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95Pb
Abstract: FCCSP amkor RDL
Text: data sheet W A F E R L E V E L PAC K AG I N G CSPnl Features: Wafer Level Packaging CSPnl™ Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP Chip Scale Package products. Through the
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CBG064-052A
Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability
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amkor flip
Abstract: wlcsp inspection amkor RDL amkor Sip dS721
Text: data sheet wafer level packaging CSPnl BOR CSPnl Bump on Repassivation BOR (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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fBGA package tray 12 x 19
Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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cu pillar
Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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HL832N
Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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CSP JEDEC tray
Abstract: JEDEC TRAY DIMENSIONS FBGA 60
Text: HEAT PROOF 7 A' 11.95 8.20 11x16=176 135°C MAX PPE 119.5 A NEC CSP 7.8×14.8×0.8 135.9 UNIT : mm 7.98 14.91 19.40 291.0 12.00 315.0 322.6 SECTION A-A' 6.57 (6.35) 7.62 14.91 Applied Package Quantity (pcs) 60-pin • Plastic FBGA (7.83×14.76) MAX. 176
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60-pin
CSP JEDEC tray
JEDEC TRAY DIMENSIONS FBGA 60
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E700G
Abstract: No abstract text available
Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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DS577G
E700G
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BGA 64 PACKAGE thermal resistance
Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect
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63Sn/37Pb)
BGA 64 PACKAGE thermal resistance
FCCSP
CABGA 6x6
amkor flip
fcBGA PACKAGE thermal resistance
bga 9x9 Shipping Trays
CABGA 8X8
BGA 256 PACKAGE power dissipation
BGA 256 PACKAGE thermal resistance
BGA45
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csp process flow diagram
Abstract: jedec Package Shipping Trays
Text: 2.0 µBGA* PACKAGE/PRODUCT PROCESS FLOW Wafer Fabrication Fab 2.1 Overview The µBGA package cross-sectional diagram is illustrated below Figure 3 and displays the various materials used to manufacture the package. This section outlines the µBGA package
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ic 6116 datasheet from texas instruments
Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram
Text: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any
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jedec package MO-247
Abstract: MO-247 DS813B Amkor TSCSP DS813
Text: data sheet advanced product development tsCSP Features: Thin Substrate CSP tsCSP : Very Thin, Superior Performance, Cost Effective Amkor's tsCSP is a land grid array multi-row package (up to 3 rows of lands) compatible with established CSP mounting processes. The near-chip-size standard
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jedec package MO-247
Abstract: Amkor TSCSP MO-247 coreless substrate DS813
Text: data sheet advanced product development tsCSP Features: Thin Substrate CSP tsCSP : Very Thin, Superior Performance, Cost Effective Amkor's tsCSP is a land grid array multi-row package (up to 3 rows of lands) compatible with established CSP mounting processes. The near-chip-size standard
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as4684
Abstract: IDTAS4684
Text: DATASHEET IDTAS4684 0.5 OHM, DUAL SPDT ANALOG SWITCH Description Features The IDTAS4684 low on-resistance RON , low voltage, dual single-pole/double-throw (SPDT) analog switch operates from a single +1.8 V to +5.5 V supply. The IDTAS4684 features a 0.5Ω (max) RON for its NC switch and a 0.8Ω
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IDTAS4684
IDTAS4684
12-bump
as4684
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116-Pin
Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size
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C13185EJ1V0PF00
116-Pin
PBGA 256 reflow profile
semiconductor cross index
Lead Free reflow soldering profile BGA
reflow soldering profile BGA
224-pin plastic ball grid array 0.8mm
JIS-Z0202
tray qfp 14x14 1.4
tray bga 10x10
pcb warpage after reflow
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rd33708
Abstract: BGA PACKAGE TOP MARK intel Intel H4 socket 28F3202C3 intel h2 socket 806801 Intel Stacked CSP 28F1602C3 JEDEC TRAY DIMENSIONS 28F3204C3
Text: Mechanical Specification and Shipping Media Information for Intel Stacked-Chip Scale Packages PRELIMINARY May 2000 Document Number: 298068-005 Information in this document is provided in connection with Inte® products. No license, express or implied, by estoppel or otherwise, to any intellectual
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28F1602C3
US048631
28F1604C3
28F3202C3
28F3204C3
US048681
rd33708
BGA PACKAGE TOP MARK intel
Intel H4 socket
28F3202C3
intel h2 socket
806801
Intel Stacked CSP
28F1602C3
JEDEC TRAY DIMENSIONS
28F3204C3
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