CP30338
Abstract: No abstract text available
Text: REV. A DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 30.0 0.3 7.0 3.0 Red + 30.0 0.3 Black (-) SCALE 1:1 0.80 (TYP) Cold Side 3.8 0.01 Hot Side Parameters Remarks 4.00 Ω ± 10% 3.0 A 15.4 V Th=50°C Th=27°C Qmax 27.0 W 30.1 W ΔTmax 66°C 72°C Solder melting point
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07N/cm²
10kgf/cm²
CP30338
Al203
UL1332
112th
CP30338
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CP85338
Abstract: No abstract text available
Text: REV. A DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 30.0 0.3 7.0 3.0 Red + 30.0 0.3 Black (-) SCALE 1:1 0.80 (TYP) Cold Side 3.8 0.01 Hot Side Parameters Remarks 0.9 Ω ± 10% 8.5 A 8.6 V Th=50°C Th=27°C Qmax 42.0 W 46.9 W ΔTmax 68°C 75°C Solder melting point
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10kgf/cm²
CP85338
Al203
UL1332
112th
CP85338
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CP85438
Abstract: No abstract text available
Text: REV. A 40.0 0.3 DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 Red + 7.0 3.0 40.0 0.3 SCALE 1:1 Black (-) 0.80 (TYP) Cold Side 3.8 0.01 Parameters Remarks 1.5 Ω ± 10% 8.5 A 15.4 V Th=50°C Th=27°C 75.0 W 83.9 W Qmax 68°C 75°C ΔTmax 138°C Solder melting point
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10kgf/cm²
CP85438
Al203
UL1332
112th
CP85438
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silicon sealer
Abstract: CP60333
Text: REV. A DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 30.0 0.3 7.0 3.0 Red + 30.0 0.3 Black (-) SCALE 1:1 0.80 (TYP) Cold Side 3.3 0.01 Hot Side Parameters Remarks 2.20 Ω ± 10% 6.0 A 15.4 V Th=50°C Th=27°C Qmax 50.5 W 56.5 W ΔTmax 66°C 72°C Solder melting point
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10kgf/cm²
CP60333
Al203
UL1332
112th
silicon sealer
CP60333
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CP40336
Abstract: No abstract text available
Text: REV. A DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 30.0 0.3 7.0 3.0 Red + 30.0 0.3 Black (-) SCALE 1:1 0.80 (TYP) Cold Side 3.6 0.01 Hot Side Parameters Remarks 3.5 Ω ± 10% 4.0 A 15.4 V Th=50°C Th=27°C Qmax 33.4 W 37.3 W ΔTmax 66°C 72°C Solder melting point
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07N/cm²
10kgf/cm²
CP40336
Al203
UL1332
112th
CP40336
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Untitled
Abstract: No abstract text available
Text: REV. A DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 30.0 0.3 7.0 3.0 Red + 30.0 0.3 Black (-) SCALE 1:1 0.80 (TYP) Cold Side 5.1 0.01 Hot Side Parameters Remarks 6.7 Ω ± 10% 2.0 A 15.4 V Th=50°C Th=27°C Qmax 15.2 W 16.9 W ΔTmax 66°C 72°C Solder melting point
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07N/cm²
10kgf/cm²
CP20351
Al203
UL1332
112th
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ul1332
Abstract: CP602 Peltier module
Text: REV. A DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 7.0 3.0 20.0 0.3 Red + 20.0 0.3 Black (-) SCALE 1:1 0.80 (TYP) Cold Side 4.0 0.01 Hot Side Parameters Remarks 0.53 Ω ± 10% 6.0 A 3.8 V Th=50°C Th=27°C Qmax 13.0 W 14.5 W ΔTmax 68°C 75°C Solder melting point
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07N/cm²
10kgf/cm²
CP60240
Al203
UL1332
112th
ul1332
CP602
Peltier module
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Untitled
Abstract: No abstract text available
Text: REV. A 40.0 0.3 DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 Red + 7.0 3.0 40.0 0.3 SCALE 1:1 Black (-) 0.80 (TYP) Cold Side 4.0 0.01 Parameters Remarks 2.17 Ω ± 10% 6.0 A 15.4 V Th=50°C Th=27°C Qmax 53.0 W 59.3 W ΔTmax 68°C 75°C Solder melting point
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10kgf/cm²
CP60440
Al203
UL1332
112th
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Untitled
Abstract: No abstract text available
Text: REV. A DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 30.0 0.3 7.0 3.0 Red + 30.0 0.3 Black (-) SCALE 1:1 0.80 (TYP) Cold Side 4.0 0.01 Hot Side Parameters Remarks 1.21 Ω ± 10% 6.0 A 8.6 V Th=50°C Th=27°C Qmax 29.0 W 32.4 W ΔTmax 68°C 75°C Solder melting point
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07N/cm²
10kgf/cm²
CP60340
Al203
UL1332
112th
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Untitled
Abstract: No abstract text available
Text: page 1/5 Surface Mount Terminal Blocks 120-M-221-THR | 5.00 mm 0.197 in Spacing - 2-24 poles PICTURES 120-M-221-THR 120-M-221-THR & 120-D-111 TECHNICAL INFORMATION Description Standoffs underneath the molding prevent bottom of molding from touching the solder paste and allow for a visual inspection of the solder joints and
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120-M-221-THR
120-D-111
120-M-221-THR
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peltier element schematic
Abstract: peltier cooler schematic peltier schematic pitarresi IC SEM 2005 smema A356 Theory of Modern Electronic Semiconductor Device
Text: Powercycling Reliability, Failure Analysis and Acceleration Factors of Pb-free Solder Joints Kaushik Setty1, Ganesh Subbarayan1 and Luu Nguyen2 School of Mechanical Engineering, Purdue University, W. Lafayette, IN 47907-2088 2 National Semiconductor Corporation, Santa Clara, CA 95051
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Untitled
Abstract: No abstract text available
Text: page 1/5 Surface Mount Terminal Blocks 971-SLR-THR-1.1 | 5.00 mm 0.197 in Spacing - 2-12 poles PICTURES 971-SLR-THR-1.1 TECHNICAL INFORMATION Description Standoffs underneath the molding prevent bottom of molding from touching the solder paste and allow for a visual inspection of the solder joints and
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971-SLR-THR-1
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Untitled
Abstract: No abstract text available
Text: page 1/5 Surface Mount Terminal Blocks 110-M-221-THR | 3.50 mm 0.138 in Spacing - 2-12 poles PICTURES 110-M-221-THR 110-M-221-THR & 110-A-111 TECHNICAL INFORMATION Description Standoffs underneath the molding prevent bottom of molding from touching the solder paste and allow for a visual inspection of the solder joints and
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110-M-221-THR
10-A-111
120-K
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semikron skiip 30
Abstract: 30 kw motor miniskiip board semikron spring contact reliability
Text: MiniSKiiP Converter Inverter Brake CIB modules Technology ♦ Spring contacts for all power and auxiliary connections instead of soldered joints. ♦ Integration of latest chip technology: ♦ Low switching loss 1200 V and 600 V, homogeneous (NPT) IGBTs
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Cold solder joint
Abstract: IPC-A-610C
Text: Soldering Methods and Procedures for 1st and 2nd Generation Power Modules Overview This document is intended to provide guidance in utilizing soldering practices to make high quality connections of Vicor Power Modules to printed circuit boards. Some care
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astm d 876
Abstract: ASTM D 638 pvdf clear heat shrink
Text: It reliably protects wires, solder joints, terminals, connections, and components from most industrial fuels, solvents and chemicals. AKY-175 Excellent to insulate from high temperatures. Semi rigid tubing, ideal for applications that require high-temperature
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AKY-175
astm d 876
ASTM D 638
pvdf clear heat shrink
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module vicor
Abstract: SAC305 V300
Text: 123333333333333333333333 Soldering Methods and Procedures for Vicor ROHS Compliant Power Modules Overview This document is intended to provide guidance for making high quality solder connections of RoHS Compliant Vicor Power Modules to printed circuit boards. This application note applies to lead free
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IPC-A-610C
Abstract: VI-J00 Kit-18156 Kit-18146 SURFACE CLEANING SUPPLIES
Text: Design Guide & Applications Manual For VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies 23. Recommended Soldering Methods, Tin Lead Pins, and InMate Sockets OVERVIEW The following chapters contain soldering information for the following Vicor product families; Maxi, Mini, Micro;
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VI-200
VI-J00
VI-200,
VI-J00;
opti19122
Bag-19123
Bag-19122
Kit-18156
Kit-18157
Kit-18150
IPC-A-610C
Kit-18156
Kit-18146
SURFACE CLEANING SUPPLIES
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pcb thermal Design guide pcb trace
Abstract: vicor module VI-J00 IPC-A-610C Bag-19133 Kit-18150
Text: Design Guide & Applications Manual For Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies 14. Recommended Soldering Methods, Tin Lead Pins, and InMate Sockets OVERVIEW The following chapters contain soldering information for the following Vicor product families; Maxi, Mini, Micro;
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VI-200,
VI-J00;
optim19122
Bag-19123
Bag-19122
Kit-18156
Kit-18157
Kit-18150
Kit-18152
pcb thermal Design guide pcb trace
vicor module
VI-J00
IPC-A-610C
Bag-19133
Kit-18150
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VE-200
Abstract: solder joint SAC305 Kit-18146
Text: 13. Recommended Soldering Methods, Lead Free Pins RoHS Design Guide & Applications Manual For Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies OVERVIEW The following chapters contain soldering information for the following Vicor product families; Maxi, Mini, Micro;
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VE-200,
VE-J00;
VE-200
solder joint
SAC305
Kit-18146
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VE-200
Abstract: pcb thermal Design guide pcb trace SAC305 VI-J00 Kit-18151 Kit-18156 VE-J00
Text: 22. Recommended Soldering Methods, Lead Free Pins RoHS Design Guide & Applications Manual For VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies OVERVIEW The following chapters contain soldering information for the following Vicor product families; Maxi, Mini, Micro;
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VI-200
VI-J00
VE-200,
VE-J00;
VE-200
pcb thermal Design guide pcb trace
SAC305
Kit-18151
Kit-18156
VE-J00
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Untitled
Abstract: No abstract text available
Text: . FEBRUARY 9,1998 TEST REPORT #98040 SMT SOLDER JOINT EVALUATION SAMTEC CORPOR?iTION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was
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10012-l
44OJd
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Cu3Sn
Abstract: HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 AN10365
Text: AN10365 Surface mount reflow soldering description Rev. 03 — 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.
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AN10365
AN10365
Cu3Sn
HVQFN48
J-STD-020D
SSOP20
Cu6Sn5
Solder Paste, Indium 5.1, Type 3
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Lead Free reflow soldering profile BGA
Abstract: AN10365 HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
Text: AN10365 Surface mount reflow soldering description Rev. 01 — 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.
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AN10365
AN10365
Lead Free reflow soldering profile BGA
HVQFN48
SSOP20
Solder Paste, Indium, Type 3
Cu3Sn
philips pb-free products
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