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    CMOS 0.8MM PROCESS CROSS Search Results

    CMOS 0.8MM PROCESS CROSS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60BFG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP64-1414-0.80-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63BUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP52-1010-0.65-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS62AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP44-P-1010-0.80A Visit Toshiba Electronic Devices & Storage Corporation

    CMOS 0.8MM PROCESS CROSS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    digital dice design VHDL

    Abstract: ECL NAND IMPLEMENTATION V110 V120 mfm modulator ULC S - 139 TEMIC ecl temic ulc products
    Text: Digital Integration Introduction When integrating the digital part of modern electronic systems, various technical and financial criteria must be considered. Over 10 years of ASIC experience have shown that no one methodology can meet all requirements at the same time.


    Original     		PDF 10-May-96 digital dice design VHDL ECL NAND IMPLEMENTATION V110 V120 mfm modulator ULC S - 139 TEMIC ecl temic ulc products

    amd 29050

    Abstract: VHDL CODE FOR PID CONTROLLERS 20630 Xilinx XC2000 LCC100 UD09 LCC84 UD10 8251 uart vhdl MCT8
    Text: Digital Integration Introduction When integrating the digital part of modern electronic systems, various technical and financial criteria must be considered. Over 10 years of ASIC experience have shown that no one methodology can meet all requirements at the same time.


    Original     		PDF 10-May-96 amd 29050 VHDL CODE FOR PID CONTROLLERS 20630 Xilinx XC2000 LCC100 UD09 LCC84 UD10 8251 uart vhdl MCT8

    VDP300

    Abstract: TEMIC VSC350 VSC370 twin cmos two port ram MHCC62P1 temic ulc products
    Text: Digital Integration Introduction When integrating the digital part of modern electronic systems, various technical and financial criteria must be considered. Over 10 years of ASIC experience have shown that no one methodology can meet all requirements at the same time.


    Original     		PDF 10-May-96 VDP300 TEMIC VSC350 VSC370 twin cmos two port ram MHCC62P1 temic ulc products

    XC3030A-5PL84C

    Abstract: UD10 UD09 ud02 EPM7128 XC3030 UD Series UD27 ulc xc3030 matra universal logic circuit
    Text: UD Series Matra MHS Universal Logic Circuits Description The UD series of ULCts is optimized for conversion of small- to medium-sized PLDs, CPLDs and FPGAs. This series use a unique architecture that provides a high I/O-to-gate ratio. Devices are implemented in


    Original     		PDF 65-mm standb27 300-mil 150-mil XC3030A-5PL84C UD10 UD09 ud02 EPM7128 XC3030 UD Series UD27 ulc xc3030 matra universal logic circuit

    IEC60730

    Abstract: CMOS Sensor to H.264 STK 361 ARM926EJ-S lcd cross reference VIA ARM926EJ-S SD-Card layout TMPA900CMXBG toshiba lcd controller board TMPA912CM
    Text: ARM9 Microcontroller TMPA900CMXBG Memory Features ADC 10-bit Ch. 16-bit Timer RTC / WDT 32 FBGA 289 √ √ H/D 2 3 2 1 8 6 √ 91 1.7~3.6 TMPA901CMXBG 2 ARM926EJ-S 200* - 32 FBGA 177 √ √ H/D 1 2 1 1 4 6 √ 43 1.7~3.6 ARM926EJ-S 200* - 56 FBGA 361 √


    Original     		PDF TMPA900CMXBG 10-bit 16-bit TMPA901CMXBG ARM926EJ-S TMPA911CRAXBG TMPA912CMAXBG IEC60730 CMOS Sensor to H.264 STK 361 ARM926EJ-S lcd cross reference VIA ARM926EJ-S SD-Card layout TMPA900CMXBG toshiba lcd controller board TMPA912CM

    LCMXO2-1200

    Abstract: CEL-9750ZHF CEL-9750ZHF10
    Text: MachXO2 Product Family Qualification Summary Lattice Document # 25 – 106923 July 2013 Lattice Semiconductor Corporation Doc. #25-106923 Rev. G 1 Dear Customer, Enclosed is Lattice Semiconductor‟s MachXO2 Product Family Qualification Report. This report was created to assist you in the decision making process of selecting and using our products. The


    Original     		PDF LCMXO2-1200-25WLCSP LCMXO2-1200 CEL-9750ZHF CEL-9750ZHF10

    L24002

    Abstract: NAND "read disturb" 1GB Toshiba 512 NAND MLC FLASH BGA PC133 registered reference design CMOS 0.8mm process cross Lithium battery CR2025 sony M2V28S30AVP M5M51008CFP
    Text: Future On Chips MITSUBISHI SEMICONDUCTORS MITSUBISHI ELECTRIC CORPORATION ULSI Memory Memory Series Series ULSI RAM/MCP/FLASH New Data Package http://www.mitsubishichips.com Jul. 2000 MITSUBISHI ELECTRIC L-11002-01 CONTENTS General Business Operation Network and Production Facilities


    Original     		PDF L-11002-01 64MDRAM 64MSDRAM 128MSDRAM 256MSDRAM 144MRDRAM L24002 NAND "read disturb" 1GB Toshiba 512 NAND MLC FLASH BGA PC133 registered reference design CMOS 0.8mm process cross Lithium battery CR2025 sony M2V28S30AVP M5M51008CFP

    BCM8156

    Abstract: BCM8152 SFP LVDS STM-64 SFP GR-253 BCM815 10G prbs
    Text: BCM8156 MULTIRATE LOW-POWER 10G XFI TO SFI-4.1 TRANSCEIVER FEATURES • Fully integrated multirate CDR, DEMUX, MUX, CMU • 300-pin Multisource Agreement MSA compatible SUMMARY OF BENEFITS • Compliant to OIF, Telcordia®, ITU-T, XFI specification, and


    Original     		PDF BCM8156 300-pin GR-253, 16-bit BCM8156 301-pin BCM8152 196-pin 8156-PB00-R BCM8152 SFP LVDS STM-64 SFP GR-253 BCM815 10G prbs

    sandisk micro sd card pin

    Abstract: MCP 1Gb nand 512mb dram 130 256K x 16 DRAM FPM cross reference Toshiba NAND MLC FLASH BGA TSOP 48 Package nand memory toshiba MCP 1Gb 512Mb 130 PC133 registered reference design L7103 02bjxx ulsi
    Text: Future On Chips MITSUBISHI SEMICONDUCTORS MITSUBISHI ELECTRIC CORPORATION ULSI Memory Memory Series Series ULSI RAM/MCP/FLASH New Data Package http://www.mitsubishichips.com Jul. 2000 L-11002-01 MITSUBISHI ELECTRIC CONTENTS 1. General 1 2. DRAM 9 3. Low Power SRAM


    Original     		PDF L-11002-01 L-11003-0I sandisk micro sd card pin MCP 1Gb nand 512mb dram 130 256K x 16 DRAM FPM cross reference Toshiba NAND MLC FLASH BGA TSOP 48 Package nand memory toshiba MCP 1Gb 512Mb 130 PC133 registered reference design L7103 02bjxx ulsi

    BCM8157

    Abstract: BCM8154 196-PIN SFP LVDS BCM8156 GR-253
    Text: BCM8157 MULTIRATE LOW-POWER 10G XFI TO SFI-4.1 TRANSCEIVER 8.5 GBPS–11.35 GBPS FEATURES • Fully integrated multirate CDR, DEMUX, MUX, CMU • SONET-compliant serial interface • 300-pin Multisource Agreement (MSA)-compatible • Compliant to ITU GR-253, XFP, and SFP+ specifications


    Original     		PDF BCM8157 300-pin GR-253, 16-bit BCM8157 196-pin 8157-PB01-R BCM8154 SFP LVDS BCM8156 GR-253

    BCM8154

    Abstract: duobinary BCM8152 LVDS 10G GR-253 475 10v BCM815
    Text: BCM8154 MULTIRATE LOW-POWER 10G NRZ/DUOBINARY TRANSCEIVER WITH 10G CLOCK FEATURES • Fully integrated multirate CDR, DEMUX, MUX, CMU • 300-pin Multisource Agreement MSA compatible SUMMARY OF BENEFITS • Compliant to OIF, Telcordia®, ITU-T, XFI specification, and


    Original     		PDF BCM8154 300-pin GR-253, 16-bit BCM8154 301-pin BCM8152 196-pin 8154-PB01-R duobinary BCM8152 LVDS 10G GR-253 475 10v BCM815

    universal shift register using cpld

    Abstract: mc16 DS012 PT16 XCR3032XL XCR3064XL XCR3128XL XCR3256XL XCR3384XL 280-Pin
    Text: R CoolRunner XPLA3 CPLD DS012 v1.3 February 9, 2001 14 Features • • • • • • • • Fast Zero Power (FZP ) design technique provides ultra-low power and very high speed Innovative XPLA3 architecture combines high speed with extreme flexibility


    Original     		PDF DS012 universal shift register using cpld mc16 DS012 PT16 XCR3032XL XCR3064XL XCR3128XL XCR3256XL XCR3384XL 280-Pin

    OF4337

    Abstract: 90CR288A 90CR288 DS101087-6 90CR287 DS90CR287MTD
    Text: DS90CR287/DS90CR288A +3.3V Rising Edge Data Strobe LVDS 28-Bit Channel Link-85 MHZ General Description Features The DS90CR287 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS Low Voltage Differential Signaling data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link.


    Original     		PDF DS90CR287/DS90CR288A 28-Bit Link-85 DS90CR287 DS90CR288A DS90CR288ASLC 5-Dec-2000] OF4337 90CR288A 90CR288 DS101087-6 90CR287 DS90CR287MTD

    Untitled

    Abstract: No abstract text available
    Text: R CoolRunner XPLA3 CPLD DS012 v1.6 January 6, 2003 14 Preliminary Product Specification Features • • • • • • • • • • • • • • • • • • Fast Zero Power (FZP) design technique provides ultra-low power and very high speed


    Original     		PDF DS012 devices--10 XC9500XL XCR3384XL TQ144

    schematic diagram UPS 600 Power structure

    Abstract: AS 108-120 DS012 MC16 PT16 XCR3032XL XCR3064XL XCR3128XL XCR3256XL XCR3384XL
    Text: R CoolRunner XPLA3 CPLD DS012 v1.4 April 11, 2001 14 Features • • • • • • • • Fast Zero Power (FZP ) design technique provides ultra-low power and very high speed Innovative XPLA3 architecture combines high speed with extreme flexibility


    Original     		PDF DS012 XCR3512XL 324-pin devices--10 schematic diagram UPS 600 Power structure AS 108-120 DS012 MC16 PT16 XCR3032XL XCR3064XL XCR3128XL XCR3256XL XCR3384XL

    Xilinx XC2000

    Abstract: TEMIC PLD 26v12 20RA10 XC7000
    Text: ULC Matra MHS Universal Logic Circuits Description FPGAs and PLDs are excellent tools for design development and lower-volume production. They provide a quick design cycle for fast time to market, low development costs and low risk. In higher-volume production, with proven and stable designs, where cost,


    Original     		PDF

    CoolRunner XPLA3 CPLD Family

    Abstract: AS 108-120 DS012 MC16 PT16 TQ144 XCR3032XL XCR3064XL XCR3128XL XCR3256XL
    Text: R CoolRunner XPLA3 CPLD DS012 v2.4 September 8, 2008 Product Specification 14 Features • • • • • • • • Fast Zero Power (FZP) design technique provides ultra-low power and very high speed - Typical Standby Current of 17 to 18 A at 25°C


    Original     		PDF DS012 asynch3/04 PCG44 xcn07022 CoolRunner XPLA3 CPLD Family AS 108-120 DS012 MC16 PT16 TQ144 XCR3032XL XCR3064XL XCR3128XL XCR3256XL

    CoolRunner XPLA3 CPLD Family

    Abstract: DS012 MC16 PT16 TQ144 XCR3032XL XCR3064XL XCR3128XL XCR3256XL XCR3384XL
    Text: CoolRunner XPLA3 CPLD R DS012 v2.2 March 31, 2006 14 Features • • • • • • • Product Specification • Fast Zero Power (FZP) design technique provides ultra-low power and very high speed - Typical Standby Current of 17 to 18 A at 25° C


    Original     		PDF DS012 asynch500XL XCR3384XL TQ144 CoolRunner XPLA3 CPLD Family DS012 MC16 PT16 XCR3032XL XCR3064XL XCR3128XL XCR3256XL

    XCR3256xl 144

    Abstract: AS 108-120 DS012 MC16 PT16 TQ144 XCR3032XL XCR3064XL XCR3128XL XCR3256XL
    Text: R CoolRunner XPLA3 CPLD DS012 v1.7 June 23, 2003 14 Preliminary Product Specification Features • • • • • • • • • • • • • • • • • • Fast Zero Power (FZP) design technique provides ultra-low power and very high speed


    Original     		PDF DS012 XC9500XL XCR3384XL TQ144 XCR3256xl 144 AS 108-120 DS012 MC16 PT16 XCR3032XL XCR3064XL XCR3128XL XCR3256XL

    DS012

    Abstract: MC16 PT16 TQ144 XCR3032XL XCR3064XL XCR3128XL XCR3256XL XCR3384XL XCR3512XL
    Text: R CoolRunner XPLA3 CPLD DS012 v1.8 February 13, 2004 14 Features • • • • • • • • Preliminary Product Specification • Fast Zero Power (FZP) design technique provides ultra-low power and very high speed Innovative XPLA3 architecture combines high speed


    Original     		PDF DS012 XC9500XL XCR3384XL TQ144 DS012 MC16 PT16 XCR3032XL XCR3064XL XCR3128XL XCR3256XL XCR3512XL

    Untitled

    Abstract: No abstract text available
    Text: R CoolRunner XPLA3 CPLD DS012 v2.0 January 10, 2005 14 Features • • • • • • • • Preliminary Product Specification • Fast Zero Power (FZP) design technique provides ultra-low power and very high speed Innovative XPLA3 architecture combines high speed


    Original     		PDF DS012 XC9500XL XCR3384XL TQ144

    AS 108-120

    Abstract: DS012 MC16 PT16 TQ144 XCR3032XL XCR3064XL XCR3128XL XCR3256XL XCR3384XL
    Text: R CoolRunner XPLA3 CPLD DS012 v1.9 September 29, 2004 14 Features • • • • • • • • Preliminary Product Specification • Fast Zero Power (FZP) design technique provides ultra-low power and very high speed Innovative XPLA3 architecture combines high speed


    Original     		PDF DS012 XC9500XL XCR3384XL TQ144 AS 108-120 DS012 MC16 PT16 XCR3032XL XCR3064XL XCR3128XL XCR3256XL

    Untitled

    Abstract: No abstract text available
    Text: R CoolRunner XPLA3 CPLD DS012 v2.1 April 8, 2005 14 Features • • • • • • • Product Specification • Fast Zero Power (FZP) design technique provides ultra-low power and very high speed - Typical Standby Current of 17 to 18 µA at 25° C


    Original     		PDF DS012 XC9500XL XCR3384XL TQ144

    68HC11L6

    Abstract: 68hc11ka4 68HC11PH8 68HC11a1 527 MOSFET TRANSISTOR motorola D65C 68HC05N4 nippon denso 68HC05B6 128 QFP 14x20
    Text: CMRQS/D REV 10 MOTOROLA MICROCONTROLLER TECHNOLOGIES GROUP RELIABILITY AND QUALITY MONITOR REPORT Quarter 1, 1997 Semiconductor Product Sector Test results contained herein are for information only. This report does not alter MotorolaÕs standard warranty or product speciÞcations.


    Original     		PDF