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    CERAMIC PIN GRID ARRAY CPGA LEAD FRAME Search Results

    CERAMIC PIN GRID ARRAY CPGA LEAD FRAME Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TRS8E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 8 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation
    TBAW56 Toshiba Electronic Devices & Storage Corporation Switching Diode, 80 V, 0.215 A, SOT23 Visit Toshiba Electronic Devices & Storage Corporation
    TRS10E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 10 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation
    TRS6E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 6 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation
    TRS3E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 3 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation

    CERAMIC PIN GRID ARRAY CPGA LEAD FRAME Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    GI 312 diode

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame ceramic pin grid array package wire bond VIC064 CPGA 168 lead frame CERAMIC PIN GRID ARRAY 144 pins VIC068A CERAMIC PIN GRID ARRAY wire lead frame description of transistor bc 148 CY7C964
    Text: Qualification Report November, 1994 - QTP# 93101 Version 1.1 CMOS2AN PROCESS MARKETING PART NUMBER VIC64 DEVICE DESCRIPTION VMEbus Interface Controller with D64 VIC068A VMEbus Interface Controller VAC068A VMEbus Address Controller CY7C964 Bus Interface Logic Circuit


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    PDF VIC64 VIC068A VAC068A CY7C964 VIC64, VIC064/VIC068A 144-pins VIC64/VIC068A/VAC068A/7C964 GI 312 diode CERAMIC PIN GRID ARRAY CPGA lead frame ceramic pin grid array package wire bond VIC064 CPGA 168 lead frame CERAMIC PIN GRID ARRAY 144 pins VIC068A CERAMIC PIN GRID ARRAY wire lead frame description of transistor bc 148 CY7C964

    smd transistor HX

    Abstract: TRANSISTOR SMD MARKING CODE TK TRANSISTOR SMD MARKING CODE MP smd transistor HX 45 cdp68hc68 hc221 TRANSISTOR SMD MARKING CODE WM intersil standard part marking HIP SMD TRANSISTOR MARKING by 4p TRANSISTOR SMD MARKING CODES
    Text: Ordering Nomenclature Guides 2 2-3 Elantec TYPES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 5962 SMD/DSCC - QML TYPES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


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    PDF 82CXXX -25oC -40oC -55oC 125oC JM38510/ 1-888-INTERSIL smd transistor HX TRANSISTOR SMD MARKING CODE TK TRANSISTOR SMD MARKING CODE MP smd transistor HX 45 cdp68hc68 hc221 TRANSISTOR SMD MARKING CODE WM intersil standard part marking HIP SMD TRANSISTOR MARKING by 4p TRANSISTOR SMD MARKING CODES

    QFN108

    Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
    Text: v 11. 2 Package Mechanical Drawings Ceramic Pin Grid Array 84-Pin CPGA Top View 0.050" ± 0.010" Pin #1 ID 0.045" 0.055" 0.015" 0.018" ± 0.002" 0.100" BSC 1.100" ± 0.020" square 0.072" 0.088" L 0.120" 0.140" Side View K J H G F 1.000" BSC E D C B A 1 2 3


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    PDF 84-Pin A1010B A1020B 100-Pin QFN108 QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


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    GOERTZEL ALGORITHM SOURCE CODE

    Abstract: 3x3 matrix goertzel XDS510 fixed point goertzel 4x4 bit multipliers 1/SPRA056 5962-9679101QYC SM320C80 SM320C80HFHM50
    Text: Fact Sheet M i l i t a r y S e m i c o n d u c t o r P r o d u c t s SM320C80 / SMJ320C80 / 5962-9679101 SGYV006C - August 2000 NOT RECOMMENDED FOR NEW DESIGNS Multi-DSP System-On-A-Chip Optimized for Image Processing HIGHLIGHTS The SM320C80 is the highest performance military multiprocessor DSP available today. It is a


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    PDF SM320C80 SMJ320C80 SGYV006C 32-bit SPRA066 SPRA087 SPRA156 GOERTZEL ALGORITHM SOURCE CODE 3x3 matrix goertzel XDS510 fixed point goertzel 4x4 bit multipliers 1/SPRA056 5962-9679101QYC SM320C80HFHM50

    GOERTZEL ALGORITHM SOURCE CODE for dtmf in c

    Abstract: fixed point goertzel GOERTZEL ALGORITHM SOURCE CODE spra069 XDS510 3x3 matrix c80 Master Processor architecture ti c80 architecture 320C80 TMDX3248855-07
    Text: DFW 6KHHW 0 L O L W D U \ 6 H P L F R Q G X F W R U 3 U R G X F W V SM320C80 / SMJ320C80 / 5962-9679101 SGYV006C - August 2000 NOT RECOMMENDED FOR NEW DESIGNS Multi-DSP System-On-A-Chip Optimized for Image Processing HIGHLIGHTS The SM320C80 is the highest performance military multiprocessor DSP available today. It is a


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    PDF SM320C80 SMJ320C80 SGYV006C 32-bit GOERTZEL ALGORITHM SOURCE CODE for dtmf in c fixed point goertzel GOERTZEL ALGORITHM SOURCE CODE spra069 XDS510 3x3 matrix c80 Master Processor architecture ti c80 architecture 320C80 TMDX3248855-07

    marking "3AA"

    Abstract: marking KA2 2272A rgb f13 TMC2272A YC11 TMC2330
    Text: www.fairchildsemi.com TMC2272A Digital Colorspace Converter 36 Bit Color, 50 MHz Features Applications • 50 MHz 20ns pipelined throughput • 3 Simultaneous 12-bit input and output channels (64 Giga {236} colors) • Two's complement inputs and outputs


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    PDF TMC2272A 12-bit 10-bit DS30002272A marking "3AA" marking KA2 2272A rgb f13 TMC2272A YC11 TMC2330

    a5657

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame EOS ESD S 61.1 ZIF socket design guidelines
    Text: Component Handling Precaution 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD


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    a5657

    Abstract: DOD Handbook 263 CERAMIC PIN GRID ARRAY CPGA lead frame diode databook tote design technology
    Text: Component Handling Precaution 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD


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    PDF yo980. a5657 DOD Handbook 263 CERAMIC PIN GRID ARRAY CPGA lead frame diode databook tote design technology

    transistor BC 458

    Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
    Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and


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    PDF MS011795 transistor BC 458 transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE

    KB9010

    Abstract: KCY 40 gigabyte power supply diagram RGB to YCbCr color difference GK 101 V6
    Text: www.fairchildsemi.com TMC2272A Digital Colorspace Converter 36 Bit Color, 50 MHz Features Applications • 50 MHz 20ns pipelined throughput • 3 Simultaneous 12-bit input and output channels (64 Giga {236} colors) • Two's complement inputs and outputs


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    PDF TMC2272A 12-bit 10-bit DS30002272A KB9010 KCY 40 gigabyte power supply diagram RGB to YCbCr color difference GK 101 V6

    transistor BC 458

    Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
    Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and


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    cpga weight

    Abstract: No abstract text available
    Text: SMJ320C31, SMJ320LC31, SMQ320LC31 DIGITAL SIGNAL PROCESSORS SGUS026F – APRIL 1998 – REVISED OCTOBER 2001 D D D D D D D D D D D D Processed to MIL-PRF-38535 QML Operating Temperature Ranges: – Military (M) –55°C to 125°C – Special (S) –55°C to 105°C


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    PDF SMJ320C31, SMJ320LC31, SMQ320LC31 SGUS026F MIL-PRF-38535 SMJ320C31-60 33-ns SMJ320C31-50 40-ns SMJ320C31-40 cpga weight

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


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    PDF CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays

    diode databook package outline

    Abstract: sip Connector, Pitch 2.5mm, 4 pin PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC a5501 A5540 Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28 EPROM databook 35 x 35 PBGA, 580 100 balls 64 CERAMIC LEADLESS CHIP CARRIER LCC
    Text: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type – –


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    PDF A5579-01 A5580-01 diode databook package outline sip Connector, Pitch 2.5mm, 4 pin PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC a5501 A5540 Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28 EPROM databook 35 x 35 PBGA, 580 100 balls 64 CERAMIC LEADLESS CHIP CARRIER LCC

    Untitled

    Abstract: No abstract text available
    Text: SMJ320C31, SMJ320LC31, SMQ320LC31 DIGITAL SIGNAL PROCESSORS SGUS026F – APRIL 1998 – REVISED OCTOBER 2001 D D D D D D D D D D D D Processed to MIL-PRF-38535 QML Operating Temperature Ranges: – Military (M) –55°C to 125°C – Special (S) –55°C to 105°C


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    PDF SMJ320C31, SMJ320LC31, SMQ320LC31 SGUS026F MIL-PRF-38535 SMJ320C31-60 33-ns SMJ320C31-50 40-ns SMJ320C31-40

    Untitled

    Abstract: No abstract text available
    Text: SMJ320C31, SMJ320LC31, SMQ320LC31 DIGITAL SIGNAL PROCESSORS SGUS026F – APRIL 1998 – REVISED OCTOBER 2001 D D D D D D D D D D D D Processed to MIL-PRF-38535 QML Operating Temperature Ranges: – Military (M) –55°C to 125°C – Special (S) –55°C to 105°C


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    PDF SMJ320C31, SMJ320LC31, SMQ320LC31 SGUS026F MIL-PRF-38535 SMJ320C31-60 33-ns SMJ320C31-50 40-ns SMJ320C31-40

    SMJ320C31

    Abstract: SMJ320LC31 SMQ320LC31
    Text: SMJ320C31, SMJ320LC31, SMQ320LC31 DIGITAL SIGNAL PROCESSORS SGUS026F – APRIL 1998 – REVISED OCTOBER 2001 D D D D D D D D D D D D Processed to MIL-PRF-38535 QML Operating Temperature Ranges: – Military (M) –55°C to 125°C – Special (S) –55°C to 105°C


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    PDF SMJ320C31, SMJ320LC31, SMQ320LC31 SGUS026F MIL-PRF-38535 SMJ320C31-60 33-ns SMJ320C31-50 40-ns SMJ320C31-40 SMJ320C31 SMJ320LC31 SMQ320LC31

    Untitled

    Abstract: No abstract text available
    Text: SMJ320C31, SMJ320LC31, SMQ320LC31 DIGITAL SIGNAL PROCESSORS SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006 D Processed to MIL-PRF-38535 QML D Operating Temperature Ranges: D D D D D D D D D D − Military (M) −55°C to 125°C − Special (S) −55°C to 105°C


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    PDF SMJ320C31, SMJ320LC31, SMQ320LC31 SGUS026G MIL-PRF-38535 SMJ320C31-60 33-ns SMJ320C31-50 40-ns SMJ320C31-40

    c3140

    Abstract: 320LC31-40
    Text: SMJ320C31, SMJ320LC31, SMQ320LC31 DIGITAL SIGNAL PROCESSORS SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006 D Processed to MIL-PRF-38535 QML D Operating Temperature Ranges: D D D D D D D D D D − Military (M) −55°C to 125°C − Special (S) −55°C to 105°C


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    PDF SMJ320C31, SMJ320LC31, SMQ320LC31 SGUS026G MIL-PRF-38535 SMJ320C31-60 33-ns SMJ320C31-50 40-ns SMJ320C31-40 c3140 320LC31-40

    SMJ320C31

    Abstract: No abstract text available
    Text: SMJ320C31, SMJ320LC31, SMQ320LC31 DIGITAL SIGNAL PROCESSORS SGUS026F – APRIL 1998 – REVISED OCTOBER 2001 D D D D D D D D D D D D Processed to MIL-PRF-38535 QML Operating Temperature Ranges: – Military (M) –55°C to 125°C – Special (S) –55°C to 105°C


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    PDF SMJ320C31, SMJ320LC31, SMQ320LC31 SGUS026F MIL-PRF-38535 SMJ320C31-60 33-ns SMJ320C31-50 40-ns SMJ320C31-40 SMJ320C31

    C3150

    Abstract: Diode smd f6 smd transistor w17 W17 SMD transistor SMJ320C31 SMJ320LC31 SMQ320LC31 SMJ320C3X
    Text: SMJ320C31, SMJ320LC31, SMQ320LC31 DIGITAL SIGNAL PROCESSORS SGUS026F – APRIL 1998 – REVISED OCTOBER 2001 D D D D D D D D D D D D Processed to MIL-PRF-38535 QML Operating Temperature Ranges: – Military (M) –55°C to 125°C – Special (S) –55°C to 105°C


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    PDF SMJ320C31, SMJ320LC31, SMQ320LC31 SGUS026F MIL-PRF-38535 SMJ320C31-60 33-ns SMJ320C31-50 40-ns SMJ320C31-40 C3150 Diode smd f6 smd transistor w17 W17 SMD transistor SMJ320C31 SMJ320LC31 SMQ320LC31 SMJ320C3X

    LM7603

    Abstract: No abstract text available
    Text: O EC i 9 LSI LOGIC 1990 L64760 Inter-Frame Processor Prelim inary The device also generates strobes for the vari­ able length coder L64750 and the quantizer (L64740). In addition, the quantization stepsize from the channel data buffer is latched by the


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    PDF L64760 L64750) L64740) L64760 MIL-STD-883C 100-Pin LM7603

    Untitled

    Abstract: No abstract text available
    Text: W Ît S 3 LSI LOGIC 159! L64750/51 CCITT Variable Length Coder/Decoder Description The L64750 and L64751 perform the run length and variable length coding and decoding func­ tions of the CCITT Consultative Committee for International Telephones and Telegraphs


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    PDF L64750/51 L64750 L64751 L64740 L64760