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    CERAMIC LEADLESS CHIP CARRIER LCC 24 Search Results

    CERAMIC LEADLESS CHIP CARRIER LCC 24 Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    R80186 Rochester Electronics LLC Microprocessor, 16-Bit, 8MHz, CMOS, CQCC68, CERAMIC, LCC-68 Visit Rochester Electronics LLC Buy
    5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 Visit Rochester Electronics LLC Buy
    MR82510/B Rochester Electronics LLC Serial I/O Controller, 1 Channel(s), CMOS, CQCC28, CERAMIC, LCC-28 Visit Rochester Electronics LLC Buy
    X28C512EM-12 Rochester Electronics LLC EEPROM, 64KX8, 120ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Visit Rochester Electronics LLC Buy

    CERAMIC LEADLESS CHIP CARRIER LCC 24 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
    Text: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)


    Original     		PDF MS101105 EA20B EA028C CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet

    Untitled

    Abstract: No abstract text available
    Text: 8 Megabit FLASH EEPROM DPZ1MM8NG DESCRIPTION: The DPZ1MM8NG is a 1 Meg x 8 CMOS FLASH Electrically Erasable and Programmable nonvolatile memory devices. The DPZ1MM8NG is a 40 Pin ceramic Leadless Chip Carrier LCC , hermetically sealed making the module suitable for commercial,


    Original     		PDF 150ns 30A136-00

    7142LA25L48B

    Abstract: 7164L20 4Kx8 sram ttl 5962-8861011UA 7206l20l 5962-8855206YA 5962-8855206 5962-8953604 54FCT244AT 5962-8855206XA
    Text: IDT Military Offerings FIFO Military Offerings Logic Military Offerings Multi-Port Military Offerings SRAM Military Offerings May 2005 FIFO Military Offerings FIFO Military Selector Guide by Part Number FIFO Military Selector Guide (by SMD Number) Obsolete Part List and Replacement Guide


    Original     		PDF 72401L10DB 72401L15DB 72401L25DB 72401L35DB 72403L10DB 72403L35DB 7200L20TDB 7200L30TDB 7201LA20DB 7201LA30DB 7142LA25L48B 7164L20 4Kx8 sram ttl 5962-8861011UA 7206l20l 5962-8855206YA 5962-8855206 5962-8953604 54FCT244AT 5962-8855206XA

    IDT54FCT541ATDB

    Abstract: 5962-8861011UA 54FCT543DB 5962-8986301 54FCT162245TEB 54FCT543AT 54FCT541CTDB 5962-8860802 IDT54FCT162245ATEB 5962-8855201XA
    Text: FIFO MILITARY SELECTOR GUIDE As Of: November 1, 2001 FIFO Military Offerings Page FIFO Military Selector Guide by Part Number . 3-4 FIFO Military Selector Guide (by SMD Number) . 5 Obsolete Part List and Replacement Guide . 6-8


    Original     		PDF 72401L10DB 72401L15DB 72401L25DB 72401L35DB 72403L10DB 72403L35DB 72404L15DB 72404L35DB 7200L20TDB 7200L30TDB IDT54FCT541ATDB 5962-8861011UA 54FCT543DB 5962-8986301 54FCT162245TEB 54FCT543AT 54FCT541CTDB 5962-8860802 IDT54FCT162245ATEB 5962-8855201XA

    LM747 pinout

    Abstract: LM741 pinout LM741 op amp datasheet and circuit 8601401HX LM741 block diagram LM741 LM741 Application LM741 regulator lm741 comparator lm723 14 pin
    Text: Mil Aero Analog Surface Mount Products General Description Features National Semiconductor’s Mil Aero Analog Group offers a large range of military qualified linear devices in surface mount configurations Hardware is available in two small hermetically sealed outlines the Leadless Chip Carrier


    Original     		PDF MIL-STD-883 MIL-M-38510 LM747 pinout LM741 pinout LM741 op amp datasheet and circuit 8601401HX LM741 block diagram LM741 LM741 Application LM741 regulator lm741 comparator lm723 14 pin

    CERAMIC LEADLESS CHIP CARRIER LCC 68

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC
    Text: Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad


    Original     		PDF 180Pin, CERAMIC LEADLESS CHIP CARRIER LCC 68 CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    0555B

    Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
    Text: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7


    Original     		PDF 44-Lead, 48-Lead, 64-Lead 100-Lead, 144-Lead, 24-Lead, 20-Lead, 0555B footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238

    CERAMIC QUAD FLATPACK CQFP

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CY74FCT CERAMIC LEADLESS CHIP CARRIER LCC 24 ic 62256 dual flatpack 8 PAL20 22V10 PAL CMOS device
    Text: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256 7C245 7C006 7C404 7B991 C = CMOS B = BiCMOS SUFFIX -45 D L-70 S L-35 P V-15 J -25 D -5 J MB C C C MB C FAMILY CMOS SRAM - FAST CMOS SRAM - SLOW


    Original     		PDF 7C128 7C245 7C006 7C404 7B991 MIL-STD-883C 231XNZ 7C63000A CERAMIC QUAD FLATPACK CQFP 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CY74FCT CERAMIC LEADLESS CHIP CARRIER LCC 24 ic 62256 dual flatpack 8 PAL20 22V10 PAL CMOS device

    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint

    7C245

    Abstract: b1225 CERAMIC QUAD FLATPACK CQFP 22V10 PAL CMOS device 228X 16R8 7B991 PAL20 7C404 7C128
    Text: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256 7C245 7C006 7C404 7B991 C = CMOS B = BiCMOS SUFFIX -45 D L-70 S L-35 P V-15 J -25 D -5 J MB C C C MB C FAMILY CMOS SRAM - FAST CMOS SRAM - SLOW


    Original     		PDF 7C128 7C245 7C006 7C404 7B991 MIL-STD-883C T229X, W42C31, 231XNZ WB1330, 7C245 b1225 CERAMIC QUAD FLATPACK CQFP 22V10 PAL CMOS device 228X 16R8 7B991 PAL20 7C404 7C128

    16v8 PLD

    Abstract: 48C101 7c63000a 7C128 2061A B1225 CERAMIC QUAD FLATPACK CQFP
    Text: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256L 7C245L 7C09389V 7C4292V 7B991 C = CMOS B = BiCMOS SUFFIX -45 D M B -70 S C -35 P C -15 J C -25 AS C -5 J C FAMILY CMOS SRAM - FAST


    Original     		PDF 7C128 62256L 7C245L 7C09389V 7C4292V 7B991 MIL-STD-883C 48C101, W42C31, 231XNZ 16v8 PLD 48C101 7c63000a 2061A B1225 CERAMIC QUAD FLATPACK CQFP

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545

    Z84C0010PEC

    Abstract: MIL-STD-883C CPS95CO0125 84C00 10X10 Z84C90 64 CERAMIC LEADLESS CHIP CARRIER LCC ceramic QFP Package 100 lead
    Text: PACKAGE INFORMATION CPS95CO0125 CUSTOMER P ROCUREMENT S PECIFICA TION PACKAGE INFORMATION ORDERING CODES IC PACKAGE CODES TEMPERATURE A = VQFP Very Small QFP C = Ceramic Sidebrazed D = Cerdip E = Ceramic Window F = Plastic Quad Flatpack G = Ceramic PGA (Pin Grid Array)


    Original     		PDF CPS95CO0125 Z84C0010PEC MIL-STD-883C CPS95CO0125 84C00 10X10 Z84C90 64 CERAMIC LEADLESS CHIP CARRIER LCC ceramic QFP Package 100 lead

    Atmel 918

    Abstract: c22v10 atv750-15dm SMD CODE list smd code book "SMD Code" transistor smd list "SMD Code" 15 SMD CODES AT22V10L
    Text: SMD PLDs Introduction to the SMD Product Listing Each Standardized Military Drawing SMD part number that Atmel supplies corresponds to an Atmel /883 part number. SMD products are compliant to MIL-STD-883, paragraph 1.2.1 and to the requirements of the applicable standardized military drawing. The tables in this section list the currently approved Atmel SMD parts by Atmel


    Original     		PDF MIL-STD-883, ATV5000L-35KM/883 60-Input, 52-Output ATV750-25GM/883 22-Input, 10-Output ATV750-25NM/883 Atmel 918 c22v10 atv750-15dm SMD CODE list smd code book "SMD Code" transistor smd list "SMD Code" 15 SMD CODES AT22V10L

    C30737LH-500-92

    Abstract: CERAMIC LEADLESS CHIP CARRIER
    Text: DATASHEET Photon Detection C30737PH and C30737LH Series Silicon Avalanche Photodiodes APDs for range finding and laser meters – plastic and leadless ceramic carrier packages Excelitas’ C30737 Series APDs are ideally suited to laser meter, laser range finding and area scanning applications,


    Original     		PDF C30737PH C30737LH C30737 C30737PH-LH-Rev C30737LH-500-92 CERAMIC LEADLESS CHIP CARRIER

    application PAL 16v8

    Abstract: 7c63000a CERAMIC LEADLESS CHIP CARRIER LCC 24 62256L K100 BGA and eQFP Package Neuron Chip 3150 CYPRESS B1225 PLD 22V10
    Text: Ordering Information PHYSICAL LAYER DEVICES PREFIX CY CY CY CY SUFFIX DEVICE P 15G P 15G P 25G S 25G 04 04 01 01 01 DX 02 DX 01 DX K100 - BG - BG - AT - MG C T C T C T C FAMILY QUAD HOTLINK II TRANSCEIVER QUAD HOTLINK II SERDES OC-48 SERDES PROCESSING T = SURFACE-MOUNTED DEVICES TO BE TAPE AND REELED


    Original     		PDF OC-48 7C53120E4 8C25122A application PAL 16v8 7c63000a CERAMIC LEADLESS CHIP CARRIER LCC 24 62256L K100 BGA and eQFP Package Neuron Chip 3150 CYPRESS B1225 PLD 22V10

    20-PAD

    Abstract: 26LS32 pin diagram
    Text: DENSE-PAC LOGIC MODULE MICROSYSTEMS 36-PIN PGA LOGIC DESCRIPTION: The Dense-Pac LO G IC M O DULE consists of two logic devices in standard JEDEC 20-pad ceramic LCC Leadless Chip Carrier packages, surface-mounted on a co-fired ceramic substrate. The 36 pins of the LOGIC M ODULE are


    OCR Scan     		PDF 20-pad 26LS32 pin diagram

    Dense-Pac Microsystems dpz1MM

    Abstract: DPZ1M
    Text: DENSE-PAC 8 Megabit FLASH EEPROM VI I C K O S Y ST HM $ D PZ1M M 8N G D E SC R IP T IO N : The DPZ1MM8NG is a 1 Meg x 8 CMOS FLASH Electrically Erasable and Programmable nonvolatile memory devices. The DPZ1MM8NC is a 40 Pin ceramic Leadless Chip Carrier LCC , hermetically


    OCR Scan     		PDF 150ns 100ns 120ns 30A136-00 Dense-Pac Microsystems dpz1MM DPZ1M

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: No abstract text available
    Text: ATV750 L Ordering Information Wx (ns) (ns) (MHz) Ordering Code Package 20 20 55 ATV750-20JC"' 28J ATV75U-20PC'1' 24P3 ATV750-20SC'1’ 24S 25 22 45 A T V 7 5 0 -2 0 jr""" "" 28J ATV750-20PI'-’-' 24P3 ATV750-20SI-1-' 24S ATV750-20DM'''1 24DW3 ATV750-20GM!:’-


    OCR Scan     		PDF ATV750 ATV750-20JC" ATV75U-20PC ATV750-20SC ATV750-20PI ATV750-20SI-1 ATV750-20DM' ATV750-20GM! ATV750-20LM ATV750-20NM, CERAMIC LEADLESS CHIP CARRIER

    V74ACT645

    Abstract: No abstract text available
    Text: V54ACT645 V74ACT645 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS FEATURES •CMOS Replacement for ALS •High Speed, 5ns Typical •TTL Levels, I ql/ 1OH - 48/24mA Commercial, 32/24mA Military •Low Input Current, 1jxA Max •Fully Specified: 5V ± 10% Power Supply, 50pF and 300pF


    OCR Scan     		PDF V54ACT645 V74ACT645 48/24mA 32/24mA 300pF V74ACT645

    Untitled

    Abstract: No abstract text available
    Text: V54FCT645 V74FCT645 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS CONNECTION DIAGRAMS FEATURES •Direct CMOS Replacement for FAST •Speed Equivalent to FAST •Output Drive Equivalent to FAST •CMOS Low Power 5fiW typ. static •Outputs Compatible with both CMOS and TTL


    OCR Scan     		PDF V54FCT645 V74FCT645

    Untitled

    Abstract: No abstract text available
    Text: ACT FAMILY GENERAL CHARACTERISTICS DC ELECTRICAL CHARACTERISTICS SYMBOL PARAM ETER VIH M inim um High Level Input Voltage V L M axim um Low Level Input Voltage V OH M inim um High Level O u tp ut Voltage TEST CONDITIONS Military -55° to 125°C Commercial


    OCR Scan     		PDF