CERAMIC LEADLESS CHIP CARRIER
Abstract: J68.A Package
Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J68.A 0.010 S E H S 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E SYMBOL MIN MAX MIN MAX NOTES A 0.067 0.087 1.70 2.20 6, 7 A1 0.058 0.072 1.47 1.83 - B - - - - - B1 0.033
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5M-1982.
CERAMIC LEADLESS CHIP CARRIER
J68.A Package
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CERAMIC LEADLESS CHIP CARRIER
Abstract: 8512E
Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J20.B 0.010 S E H S 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45 SYMBOL o E3 B E A1 0.097 1.78 2.46 6, 7 0.077 1.37 1.96 - B - - - - - B1 0.020 0.030 0.51 0.76 2, 4 0.15 0.56
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5M-1982.
CERAMIC LEADLESS CHIP CARRIER
8512E
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CERAMIC LEADLESS CHIP CARRIER
Abstract: No abstract text available
Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J44.B 0.010 S E H S 44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E SYMBOL MIN MAX MIN MAX NOTES A 0.067 0.087 1.70 2.20 6, 7 A1 0.058 0.072 1.47 1.83 - B - - - - - B1 0.022
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5M-1982.
CERAMIC LEADLESS CHIP CARRIER
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CQCC1-N20
Abstract: CERAMIC LEADLESS CHIP CARRIER n20 n
Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J20.A MIL-STD-1835 CQCC1-N20 (C-2) 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45 o E3 B E MIN MAX MIN MAX NOTES A 0.060 0.100 1.52 2.54 6, 7 A1 0.050 0.088 1.27 2.23
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MIL-STD-1835
CQCC1-N20
5M-1982.
CQCC1-N20
CERAMIC LEADLESS CHIP CARRIER
n20 n
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CERAMIC LEADLESS CHIP CARRIER CLCC 28
Abstract: MIL-STD-1835 CQCC1-N28 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER package CQCC1-N28
Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J28.A MIL-STD-1835 CQCC1-N28 (C-4) 28 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45 o E3 B E MIN MAX MIN MAX NOTES A 0.060 0.100 1.52 2.54 6, 7 A1 0.050 0.088 1.27 2.23
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MIL-STD-1835
CQCC1-N28
5M-1982.
CERAMIC LEADLESS CHIP CARRIER CLCC 28
MIL-STD-1835 CQCC1-N28
CERAMIC LEADLESS CHIP CARRIER
CERAMIC LEADLESS CHIP CARRIER package
CQCC1-N28
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CERAMIC LEADLESS CHIP CARRIER
Abstract: h 033 clcc 68
Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J68.B j x 45o 0.010 S E H S 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 E3 B E 0.010 S E F S h HEAT SINK BASE A SYMBOL MIN MAX MIN MAX NOTES A 0.092 0.118 2.34 3.00 6, 7 A1 0.067 0.083
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5M-1982.
CERAMIC LEADLESS CHIP CARRIER
h 033
clcc 68
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CERAMIC LEADLESS CHIP CARRIER
Abstract: E2318
Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J18.A 0.010 S E H S 18 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 SYMBOL MIN MAX MIN MAX NOTES A 0.054 0.075 1.37 1.91 6, 7 A1 0.044
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5M-1982.
CERAMIC LEADLESS CHIP CARRIER
E2318
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CERAMIC LEADLESS CHIP CARRIER
Abstract: CQCC1-N32
Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J32.A MIL-STD-1835 CQCC1-N32 (C-12) 32 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- SYMBOL MIN MAX MIN MAX NOTES A 0.060
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MIL-STD-1835
CQCC1-N32
5M-1982.
CERAMIC LEADLESS CHIP CARRIER
CQCC1-N32
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CERAMIC LEADLESS CHIP CARRIER
Abstract: J18B CERAMIC LEADLESS CHIP CARRIER package
Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J18.B 0.010 S E H S 18 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- SYMBOL MIN MAX MIN MAX NOTES A 0.054 0.075 1.37 1.91 6, 7
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5M-1982.
CERAMIC LEADLESS CHIP CARRIER
J18B
CERAMIC LEADLESS CHIP CARRIER package
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CERAMIC LEADLESS CHIP CARRIER
Abstract: J20.C Package
Text: Ceramic Packages Ceramic Leadless Chip Carrier Packages CLCC J20.C MIL-STD-1835 CQCC3-N20 (C-13) 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- SYMBOL MIN MAX MIN MAX NOTES A 0.060
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MIL-STD-1835
CQCC3-N20
5M-1982.
CERAMIC LEADLESS CHIP CARRIER
J20.C Package
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CERAMIC LEADLESS CHIP CARRIER
Abstract: J44.A Package CQCC1-N44 CERAMIC LEADLESS CHIP CARRIER package
Text: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J44.A MIL-STD-1835 CQCC1-N44 (C-5) 44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- SYMBOL MIN MAX MIN MAX NOTES A 0.064
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MIL-STD-1835
CQCC1-N44
5M-1982.
CERAMIC LEADLESS CHIP CARRIER
J44.A Package
CQCC1-N44
CERAMIC LEADLESS CHIP CARRIER package
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CQCC1-N32
Abstract: CERAMIC LEADLESS CHIP CARRIER
Text: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J32.A MIL-STD-1835 CQCC1-N32 (C-12) 32 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES SYMBOL D3 j x 45 o E3 E A PLANE 2 PLANE 1 -E- 0.007 M E F S H S
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MIL-STD-1835
CQCC1-N32
5M-1982.
CQCC1-N32
CERAMIC LEADLESS CHIP CARRIER
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Untitled
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J20.C MIL-STD-1835 CQCC3-N20 (C-13) 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 PLANE 1 -E-
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MIL-STD-1835
CQCC3-N20
5M-1982.
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MIL-STD-1835 CQCC1-N28
Abstract: clcc 68 CQCC1-N28 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 datasheet d 442 CERAMIC LEADLESS CHIP CARRIER CLCC 28
Text: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J28.A MIL-STD-1835 CQCC1-N28 (C-4) 28 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 PLANE 1 -E-
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MIL-STD-1835
CQCC1-N28
5M-1982.
MIL-STD-1835 CQCC1-N28
clcc 68
CQCC1-N28
CERAMIC LEADLESS CHIP CARRIER
CERAMIC LEADLESS CHIP CARRIER 68
datasheet d 442
CERAMIC LEADLESS CHIP CARRIER CLCC 28
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CQCC1-N20
Abstract: ne55 CERAMIC LEADLESS CHIP CARRIER
Text: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J20.A MIL-STD-1835 CQCC1-N20 (C-2) 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A PLANE 2 PLANE 1 -E- MIN
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MIL-STD-1835
CQCC1-N20
5M-1982.
CQCC1-N20
ne55
CERAMIC LEADLESS CHIP CARRIER
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CERAMIC LEADLESS CHIP CARRIER
Abstract: CQCC1-N44
Text: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J44.A MIL-STD-1835 CQCC1-N44 (C-5) 44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 PLANE 1 -E-
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MIL-STD-1835
CQCC1-N44
5M-1982.
CERAMIC LEADLESS CHIP CARRIER
CQCC1-N44
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Untitled
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J3.A B D 3 PAD HERMETIC SMD.5 PACKAGE CERAMIC BOTTOM TERMINAL CHIP CARRIER INCHES E A TOP VIEW SYMBOL MIN MAX MIN MAX NOTES A 0.110 0.124 2.79 3.15 3 A1 0.010 0.020 0.25
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MIL-STD-1835
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b3 smd transistor
Abstract: CBCC1-N3 SMD Transistor Y14 smd diode B3 CERAMIC LEADLESS CHIP CARRIER HERMETIC SMD smd b3 SMD y14
Text: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J3.A 3 PAD HERMATIC SMD.5 PACKAGE CERAMIC BOTTOM TERMINAL CHIP CARRIER B D INCHES E A TOP VIEW MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.110 0.124 2.79 3.15 3 A1 0.010
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MIL-STD-1835
b3 smd transistor
CBCC1-N3
SMD Transistor Y14
smd diode B3
CERAMIC LEADLESS CHIP CARRIER
HERMETIC SMD
smd b3
SMD y14
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pkg 4015
Abstract: No abstract text available
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
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SMJ320C25,
SMJ320C2550
SGUS007D
100-ns
80-ns
16-Bit
32-Bit
pkg 4015
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Untitled
Abstract: No abstract text available
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
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SMJ320C25,
SMJ320C2550
SGUS007D
100-ns
80-ns
16-Bit
32-Bit
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documentation for 32 bit alu in vlsi
Abstract: EPROM 27001 TMS320C25 starter
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
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SMJ320C25,
SMJ320C2550
SGUS007D
100-ns
80-ns
16-Bit
32-Bit
documentation for 32 bit alu in vlsi
EPROM 27001
TMS320C25 starter
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k534
Abstract: No abstract text available
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
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SMJ320C25,
SMJ320C2550
SGUS007D
100-ns
80-ns
16-Bit
32-Bit
k534
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SMJ320C25GBM
Abstract: smj320c25
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
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SMJ320C25,
SMJ320C2550
SGUS007D
100-ns
80-ns
16-Bit
32-Bit
SMJ320C25GBM
smj320c25
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Untitled
Abstract: No abstract text available
Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier
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SMJ320C25,
SMJ320C2550
SGUS007D
100-ns
80-ns
16-Bit
32-Bit
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